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1. 发明授权

US06542367B2 Securing heat sinks 失效
公开(公告)号：US06542367B2
公开(公告)日：2003-04-01
申请号：US09871587
申请日：2001-05-31
申请人： David Shia , Thomas J. Wong
发明人： David Shia , Thomas J. Wong
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , Y10T29/4935 , H01L2924/00
摘要： A heat sink retention frame is disposed about an electronic package, and a heat sink is disposed within the heat sink retention frame above the electronic package. A clip is mounted across a lateral edge surface of the heat sink and fastened to the heat sink retention frame. The clip can help hold the heat sink in place during normal operation and can retain the heat sink in the retention frame during mechanical shocks.

2. 发明授权

US06522545B2 Securing heat sinks 失效
公开(公告)号：US06522545B2
公开(公告)日：2003-02-18
申请号：US10174700
申请日：2002-06-19
申请人： David Shia , Thomas J. Wong
发明人： David Shia , Thomas J. Wong
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , Y10T29/4935 , H01L2924/00
摘要： A heat sink retention frame is disposed about an electronic package, and a heat sink is disposed within the heat sink retention frame above the electronic package. A clip is mounted across a lateral edge surface of the heat sink and fastened to the heat sink retention frame. The clip can help hold the heat sink in place during normal operation and can retain the heat sink in the retention frame during mechanical shocks.

3. 发明授权

US06519153B1 Heat sink retention frame 失效
标题翻译：散热片固定架
公开(公告)号：US06519153B1
公开(公告)日：2003-02-11
申请号：US09925714
申请日：2001-08-08
申请人： David Shia , Thomas J. Wong
发明人： David Shia , Thomas J. Wong
IPC分类号： H05K720
CPC分类号： H01L23/36 , H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
摘要： An assembly is disclosed including a printed circuit board, a single piece heat sink retention frame secured to the printed circuit board, the frame comprising four structural members surrounding an aperture, an integrated circuit chip secured to the printed circuit board and positioned within the aperture and a heat sink secured to the frame, the heat sink positioned above the integrated circuit chip and at least partially within the aperture.
摘要翻译：公开了一种组件，其包括印刷电路板，固定到印刷电路板的单件散热器保持框架，该框架包括围绕孔的四个结构构件，固定到印刷电路板并位于孔内的集成电路芯片，以及固定到所述框架的散热器，所述散热器位于所述集成电路芯片上方并且至少部分地位于所述孔内。

4. 发明授权

US06205026B1 Heat sink retention components and system 有权
标题翻译：散热器固定部件和系统
公开(公告)号：US06205026B1
公开(公告)日：2001-03-20
申请号：US09494807
申请日：2000-01-31
申请人： Thomas J. Wong , Neal Ulen , Ketan R. Shah , Ishfaqur Raza
发明人： Thomas J. Wong , Neal Ulen , Ketan R. Shah , Ishfaqur Raza
IPC分类号： H05K720
CPC分类号： H01L23/552 , H01L23/4093 , H01L2924/0002 , H01L2924/3011 , Y10T24/44026 , Y10T24/44556 , H01L2924/00
摘要： An integrated circuit system has an increased reliability when subjected to stress and vibration. The system includes heat sink retention clips that provide support to the retention system when an upward force is applied to a heat sink. An EMI shield can be provided that provides peripheral shielding for the circuit package thermally coupled to the heat sink.
摘要翻译：集成电路系统在受到应力和振动时具有增加的可靠性。该系统包括散热器保持夹，当向上的力施加到散热器时，其提供对保持系统的支撑。可以提供EMI屏蔽，其为热耦合到散热器的电路封装提供外围屏蔽。

5. 发明授权

US06515862B1 Heat sink assembly for an integrated circuit 失效
标题翻译：用于集成电路的散热器组件
公开(公告)号：US06515862B1
公开(公告)日：2003-02-04
申请号：US09539825
申请日：2000-03-31
申请人： Thomas J. Wong , Ketan R. Shah , Joseph S. Alina
发明人： Thomas J. Wong , Ketan R. Shah , Joseph S. Alina
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for a microprocessor includes a thermally conductive base having a plurality of substantially parallel, arcuate fin structures extending outwardly in a vertical direction from the thermally conductive base. The plurality of substantially parallel fin structures have a high fin density to enhance heat dissipation from the heat sink. In one embodiment, a shroud encloses the fin structures and is attached to the thermally conductive base via latches that fit into a pair of grooves in the bottom surface of the thermally conductive base. A fan is attached to the shroud to direct a convection medium through the plurality of substantially parallel fin structures. Also described is a method of fabricating a heat sink assembly.
摘要翻译：用于微处理器的散热器包括导热底座，其具有多个基本上平行的弧形翅片结构，其从导热基座沿垂直方向向外延伸。多个基本平行的翅片结构具有高翅片密度以增强散热器的散热。在一个实施例中，护罩封闭翅片结构，并且通过嵌入到导热基底的底表面中的一对凹槽中的闩锁附接到导热基座。风扇附接到护罩以引导对流介质穿过多个基本平行的翅片结构。还描述了制造散热器组件的方法。

6. 发明授权

US6101093A Wrap around clip for an electronic cartridge 失效
标题翻译：缠绕电子墨盒的夹子
公开(公告)号：US6101093A
公开(公告)日：2000-08-08
申请号：US140871
申请日：1998-08-27
申请人： Thomas J. Wong , Michael T. Crocker
发明人： Thomas J. Wong , Michael T. Crocker
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/3011
摘要： An electronic assembly which includes a heat sink that is attached to a substrate by a clip. The assembly includes an integrated circuit package that is mounted to the substrate. The clip has an arm which extends around an edge of the substrate and attaches the heat sink to the substrate. The clip also presses the heat sink into the package. Attaching the heat sink directly to the package may reduce the flatness requirements of the sink and the cost of producing the assembly.
摘要翻译：一种电子组件，其包括通过夹子附接到基板的散热器。组件包括安装到基板的集成电路封装。夹子具有围绕基板的边缘延伸的臂，并将散热器附接到基板。夹子还将散热器压入包装中。将散热器直接连接到包装可能会降低水槽的平坦度要求和生产组件的成本。

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