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1. 发明申请

US20050117305A1 Integrated heat sink assembly 审中-公开
标题翻译：集成散热器总成
公开(公告)号：US20050117305A1
公开(公告)日：2005-06-02
申请号：US10725825
申请日：2003-12-01
申请人： Neal Ulen , David Shia , Sandeep Ahuja
发明人： Neal Ulen , David Shia , Sandeep Ahuja
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： Some disclosed embodiments include an integrated heat sink assembly having a standoff press disposed through the bottom of a bore in a support base of the heat sink, a screw disposed through the top of the bore in the support base of the heat sink, a spring adapted to bias the screw against the heat sink, wherein the screw and spring engage the standoff to attach the heat sink to the support base. The integrated heat sink assembly may be used to maintain contact between a heat sink and a processor on a motherboard. Other embodiments are disclosed and claimed.
摘要翻译：一些公开的实施例包括集成散热器组件，其具有穿过散热器的支撑底座中的孔的底部设置的支架压盖，穿过散热器的支撑基座中的孔的顶部设置的螺钉，适于以将所述螺钉偏置抵靠所述散热器，其中所述螺钉和弹簧接合所述支座以将所述散热器附接到所述支撑基座。集成散热器组件可用于保持散热器与主板上的处理器之间的接触。公开和要求保护其他实施例。

2. 发明授权

US07988459B2 Unified retention mechanism for CPU/socket loading and thermal solution attach 有权
标题翻译： CPU /插座加载和散热解决方案的统一保留机制
公开(公告)号：US07988459B2
公开(公告)日：2011-08-02
申请号：US12459312
申请日：2009-06-30
申请人： Neal Ulen , David Llapitan
发明人： Neal Ulen , David Llapitan
IPC分类号： H01R13/62 , H01R13/00
CPC分类号： H05K7/1053 , Y10T29/49988
摘要： An apparatus for removably retaining an IC package in engagement with a socket such that the contacts of both the IC package and the socket are properly engaged is disclosed. Specifically, a universal retention mechanism (URM) which may be fabricated in a diecast material, may comprise a retention frame to engage a socket. A load plate hinged to the retention frame may be caused to press the socket and IC package together through force selectively applied through the use of a load lever. In addition, the frame may contain features to attach a thermal solution (e.g. a heat sink or other cooling device) directly to the frame thus eliminating the need to attach it directly to a motherboard or through a backplate.
摘要翻译：公开了一种用于可拆卸地保持IC封装与插座接合的装置，使得IC封装和插座两者的触点正确接合。具体地，可以以压电材料制造的通用保持机构（URM）可以包括接合插座的保持框架。铰链到保持框架的负载板可以通过使用负载杆选择性地施加的力而将插座和IC封装在一起。此外，框架可以包含将热溶液（例如散热器或其他冷却装置）直接附接到框架的特征，从而消除将其直接附接到母板或通过背板的需要。

3. 发明申请

US20100330824A1 Unified retention mechanism for CPU/socket Loading and thermal solution attach 有权
标题翻译：统一的CPU /插座加载和散热解决方案
公开(公告)号：US20100330824A1
公开(公告)日：2010-12-30
申请号：US12459312
申请日：2009-06-30
申请人： Neal Ulen , David Llapitan
发明人： Neal Ulen , David Llapitan
IPC分类号： H01R13/62 , H01R12/16 , B23P17/00 , H01R43/00
CPC分类号： H05K7/1053 , Y10T29/49988
摘要： An apparatus for removably retaining an IC package in engagement with a socket such that the contacts of both the IC package and the socket are properly engaged is disclosed. Specifically, a universal retention mechanism (URM) which may be fabricated in a diecast material, may comprise a retention frame to engage a socket. A load plate hinged to the retention frame may be caused to press the socket and IC package together through force selectively applied through the use of a load lever. In addition, the frame may contain features to attach a thermal solution (e.g. a heat sink or other cooling device) directly to the frame thus eliminating the need to attach it directly to a motherboard or through a backplate.
摘要翻译：公开了一种用于可拆卸地保持IC封装与插座接合的装置，使得IC封装和插座两者的触点正确接合。具体地，可以以压电材料制造的通用保持机构（URM）可以包括接合插座的保持框架。铰链到保持框架的负载板可以通过使用负载杆选择性地施加的力而将插座和IC封装在一起。此外，框架可以包含将热溶液（例如散热器或其他冷却装置）直接附接到框架的特征，从而消除将其直接附接到母板或通过背板的需要。

4. 发明授权

US06483704B2 Microprocessor heat sink retention module 失效
标题翻译：微处理器散热器固定模块
公开(公告)号：US06483704B2
公开(公告)日：2002-11-19
申请号：US09823625
申请日：2001-03-29
申请人： Neal Ulen , Chris H. Hanes , Ed Unrein
发明人： Neal Ulen , Chris H. Hanes , Ed Unrein
IPC分类号： H05K720
CPC分类号： H05K7/20509 , H05K7/1431
摘要： A microprocessor heat sink retention module is described. That module comprises a first frame that has a first side and a second side. The first side is separated from the second side by a distance that is sufficient to enable a microprocessor to fit within the frame. The first and second sides each have at least one aperture for receiving a microprocessor heat sink. The module also has a heat transfer platform, which is integrated with the first frame. The heat transfer platform comprises a substantially flat metal slab for dissipating heat that is generated by a voltage regulator. Also described are an assembly for a computer and a computer system that include this microprocessor heat sink retention module.
摘要翻译：描述了微处理器散热器保持模块。该模块包括具有第一侧和第二侧的第一框架。第一侧与第二侧隔开足以使微处理器安装在框架内的距离。第一和第二侧每个具有用于接收微处理器散热器的至少一个孔。该模块还具有与第一框架集成的传热平台。传热平台包括用于散热由电压调节器产生的基本平坦的金属板。还描述了一种用于计算机和计算机系统的组件，其包括该微处理器散热器保持模块。

5. 发明申请

US20050068740A1 Heat sink mounting and interface mechanism and method of assembling same 失效
标题翻译：散热器安装及接口机构及组装方法
公开(公告)号：US20050068740A1
公开(公告)日：2005-03-31
申请号：US10672022
申请日：2003-09-26
申请人： Neal Ulen , David Shia , Sandeep Ahuja
发明人： Neal Ulen , David Shia , Sandeep Ahuja
IPC分类号： H01L23/40 , H01L23/42 , H01L23/427 , H05K7/20
CPC分类号： H01L23/4006 , H01L23/42 , H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： In some embodiments, a method includes providing a circuit board having a plurality of holes formed therethrough and mounting a spring to an underside of the circuit board such that the mounted spring has a plurality of holes each of which is aligned with a respective one of the holes in the circuit board.
摘要翻译：在一些实施例中，一种方法包括提供具有穿过其形成的多个孔的电路板，并将弹簧安装到电路板的下侧，使得安装的弹簧具有多个孔，每个孔与电路板上的孔。

6. 发明授权

US06563213B1 Integrated circuit heat sink support and retention mechanism 有权
标题翻译：集成电路散热器支撑和保持机构
公开(公告)号：US06563213B1
公开(公告)日：2003-05-13
申请号：US09419964
申请日：1999-10-18
申请人： Thomas Wong , Neal Ulen , Peter Davison , Ketan Shah
发明人： Thomas Wong , Neal Ulen , Peter Davison , Ketan Shah
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
摘要： The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force may be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.
摘要翻译：本发明提供一种改进的散热器保持组件，使得散热器由基座而不是由集成电路物理支撑。传统的散热器具有对准特征，其通过特征与集成电路的接触来物理对准和支撑散热器，并且将施加到散热器的力传递到集成电路。这种转移的力可以被看作是诸如针阵列的集成电路的引脚处的剪切应力，并且可能损坏集成电路的完整性或其与外部电路的连接。本发明提供了远离与集成电路接触的对准和支撑特征，并因此以不会对集成电路施加相当大的应力的方式为散热器提供支撑。

7. 发明授权

US06529378B2 Integrated circuit heat sink support and retention mechanism 有权
公开(公告)号：US06529378B2
公开(公告)日：2003-03-04
申请号：US09754973
申请日：2001-01-05
申请人： Thomas Wong , Neal Ulen , Peter Davison , Ketan Shah
发明人： Thomas Wong , Neal Ulen , Peter Davison , Ketan Shah
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
摘要： The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force may be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.

8. 发明授权

US06243265B1 Processor EMI shielding 有权
标题翻译：处理器EMI屏蔽
公开(公告)号：US06243265B1
公开(公告)日：2001-06-05
申请号：US09413417
申请日：1999-10-06
申请人： Thomas Wong , Neal Ulen
发明人： Thomas Wong , Neal Ulen
IPC分类号： H05K720
CPC分类号： H05K9/0039 , H01L23/4093 , H01L23/552 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A heat sink retention module provides physical support for a heat sink while providing an electrical ground path for the heat sink. The retention module includes a ground strip that maintains an electrical contact with the heat sink while contacting a circuit board ground connection. In one embodiment, the ground strip includes upwardly extending spring members that contact the heat sink. In another embodiment, the ground strip includes a Faraday Cage formed from downwardly extending tabs. The retention module can be used in conjunction with an electrically conductive heat sink to provide a ground plane over an integrated circuit to shield the circuit from electromagnetic interference.
摘要翻译：散热器保持模块为散热器提供物理支撑，同时为散热器提供电接地路径。保持模块包括接地条，其在接触电路板接地连接时保持与散热器的电接触。在一个实施例中，接地条包括接触散热器的向上延伸的弹簧部件。在另一个实施例中，接地条包括由向下延伸的突片形成的法拉第笼。保持模块可以与导电散热器结合使用，以在集成电路上提供接地平面以屏蔽电路免受电磁干扰。

9. 发明授权

US06205026B1 Heat sink retention components and system 有权
标题翻译：散热器固定部件和系统
公开(公告)号：US06205026B1
公开(公告)日：2001-03-20
申请号：US09494807
申请日：2000-01-31
申请人： Thomas J. Wong , Neal Ulen , Ketan R. Shah , Ishfaqur Raza
发明人： Thomas J. Wong , Neal Ulen , Ketan R. Shah , Ishfaqur Raza
IPC分类号： H05K720
CPC分类号： H01L23/552 , H01L23/4093 , H01L2924/0002 , H01L2924/3011 , Y10T24/44026 , Y10T24/44556 , H01L2924/00
摘要： An integrated circuit system has an increased reliability when subjected to stress and vibration. The system includes heat sink retention clips that provide support to the retention system when an upward force is applied to a heat sink. An EMI shield can be provided that provides peripheral shielding for the circuit package thermally coupled to the heat sink.
摘要翻译：集成电路系统在受到应力和振动时具有增加的可靠性。该系统包括散热器保持夹，当向上的力施加到散热器时，其提供对保持系统的支撑。可以提供EMI屏蔽，其为热耦合到散热器的电路封装提供外围屏蔽。

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