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    • 12. 发明授权
    • Methods, systems and apparatus for rapid exchange of work material
    • 用于快速交换工作材料的方法,系统和装置
    • US08886354B2
    • 2014-11-11
    • US12684660
    • 2010-01-08
    • Vinay K. ShahSushant S. Koshti
    • Vinay K. ShahSushant S. Koshti
    • G06F7/00H01L21/677
    • H01L21/67766
    • Systems, apparatus and methods for the rapid exchange of work material in a facility processing substrates (e.g., LCD panels, solar panels, semiconductor wafers, or the like) are disclosed. The system may include load ports associated with a process tool, local storage units, and a work material exchange apparatus adapted to rapidly exchange work material at the ports, units, or other exchange locations. The work material exchange apparatus may include two or more end effectors coupled to one or more actuator members and which may be adapted to rapidly exchange two or more carriers containing work material at an exchange location.
    • 公开了用于在处理基板(例如,LCD面板,太阳能电池板,半导体晶片等)的设备中快速更换工作材料的系统,装置和方法。 系统可以包括与处理工具相关联的装载端口,本地存储单元和适于在端口,单元或其他交换位置快速交换工作材料的工作材料交换装置。 工作材料交换装置可以包括耦合到一个或多个致动器构件的两个或更多个端部执行器,并且可以适于在交换位置快速地交换包含工作材料的两个或更多个载体。
    • 13. 发明授权
    • Automated substrate handling and film quality inspection in solar cell processing
    • 太阳能电池加工中的自动基板处理和薄膜质量检测
    • US08318512B2
    • 2012-11-27
    • US12769517
    • 2010-04-28
    • Vinay K. ShahSuresh KumaraswamiDamon K. Cox
    • Vinay K. ShahSuresh KumaraswamiDamon K. Cox
    • H01L21/66H04N7/18
    • H01L21/67259H01L21/67155
    • The present invention generally provides an apparatus and a method for automatically calibrating the placement of fragile substrates into a substrate carrier. Embodiments of the present invention also provide an apparatus and a method for inspecting the fragile substrates prior to processing to prevent damaged substrates from being further processed or broken in subsequent transferring steps. Embodiments of the invention also generally provide an apparatus and a method for determining the alignment and orientation substrates that are to be delivered into or removed from a substrate carrier. Embodiments of the invention further provide an apparatus and method for accurately positioning the substrate carrier for substrate loading. The substrate carriers are generally used to support a batch of substrates that are to be processed in a batch processing chamber.
    • 本发明总体上提供了一种用于自动校准易碎基底放置到基底载体中的装置和方法。 本发明的实施例还提供了一种用于在处理之前检查脆性基底以防止损坏的基底在随后的转移步骤中被进一步加工或破裂的装置和方法。 本发明的实施例还总体上提供了一种用于确定将被输送到衬底载体或从衬底载体移除的对准和取向衬底的装置和方法。 本发明的实施例还提供了一种用于精确地定位用于衬底加载的衬底载体的装置和方法。 衬底载体通常用于支持待批处理室中待处理的一批衬底。
    • 14. 发明申请
    • SUBSTRATE ALIGNMENT APPARATUS
    • 基板对准装置
    • US20110116900A1
    • 2011-05-19
    • US12948111
    • 2010-11-17
    • Tristan R. HoltamKeith B. PorthouseVinay K. Shah
    • Tristan R. HoltamKeith B. PorthouseVinay K. Shah
    • H01L21/677B65G47/22H01L21/68B65G47/24
    • H01L21/68H01L21/67766H01L21/67781H01L21/6779
    • Embodiments of the present invention generally relate to an apparatus and method for accurately aligning a plurality of substrates arranged in a planar array for batch processing. In one embodiment, the substrate alignment apparatus includes an array of oversized, recessed pockets for receiving the plurality of substrates. The substrate alignment apparatus may pick up the plurality of substrates from a location in which each substrate is not accurately positioned. Each pocket is configured at an angle from horizontal such that each substrate slides to a predefined corner of the pocket resulting in accurate alignment of each substrate. A vibration, tilting, directional brushes, or gas cushion may be provided to the substrate alignment apparatus to aid in low friction alignment of each substrate within its respective pocket. In one embodiment, the substrate alignment apparatus is an end effector for use on a transfer robot for use in a cluster-type processing system. In another embodiment, the substrate alignment apparatus is an alignment table for use in an in-line processing system.
    • 本发明的实施例总体上涉及用于准确地对准布置在平面阵列中的多个基板以进行批量处理的装置和方法。 在一个实施例中,基板对准装置包括用于容纳多个基板的尺寸过大的凹陷凹坑阵列。 基板对准装置可以从每个基板未准确定位的位置拾取多个基板。 每个口袋配置成与水平方向成一定角度,使得每个基底滑动到口袋的预定角度,导致每个基底的精确对准。 可以向基板对准装置提供振动,倾斜,方向刷或气垫,以帮助每个基板在其相应的凹部内的低摩擦对准。 在一个实施例中,基板对准装置是用于在簇型处理系统中使用的传送机器人上的端部执行器。 在另一个实施例中,衬底对准装置是用于在线处理系统中的对准工作台。
    • 15. 发明申请
    • LASER MATERIAL REMOVAL METHODS AND APPARATUS
    • 激光材料去除方法和装置
    • US20100055901A1
    • 2010-03-04
    • US12545488
    • 2009-08-21
    • Zhenhua ZhangVirendra V.S. RanaVinay K. ShahChris Eberspacher
    • Zhenhua ZhangVirendra V.S. RanaVinay K. ShahChris Eberspacher
    • H01L21/30B23K26/38B05C11/00
    • B23K26/03B23K26/06B23K26/0624B23K26/082B23K26/0853B23K26/364B23K26/40B23K2101/40B23K2103/50H01L31/022441H01L31/0682H01L31/18Y02E10/547
    • Embodiments of the present invention generally provide methods and apparatus for material removal using lasers in the fabrication of solar cells. In one embodiment, an apparatus is provided that precisely removes portions of a dielectric layer deposited on a solar cell substrate according to a desired pattern and deposits a conductive layer over the patterned dielectric layer. In one embodiment, the apparatus also removes portions of the conductive layer in a desired pattern. In certain embodiments, methods for removing a portion of a material via a laser without damaging the underlying substrate are provided. In one embodiment, the intensity profile of the beam is adjusted so that the difference between the maximum and minimum intensity within a spot formed on a substrate surface is reduced to an optimum range. In one example, the substrate is positioned such that the peak intensity at the center versus the periphery of the substrate is lowered. In one embodiment, the pulse energy is improved to provide thermal stress and physical lift-off of a desired portion of a dielectric layer.
    • 本发明的实施例一般提供了在制造太阳能电池中使用激光去除材料的方法和装置。 在一个实施例中,提供了一种装置,其根据期望的图案精确地去除沉积在太阳能电池基板上的电介质层的部分,并且在图案化的电介质层上沉积导电层。 在一个实施例中,该装置还以期望的图案去除导电层的部分。 在某些实施例中,提供了用于通过激光去除材料的一部分而不损坏下面的衬底的方法。 在一个实施例中,调整光束的强度分布,使得在衬底表面上形成的斑点内的最大和最小强度之间的差减小到最佳范围。 在一个示例中,衬底被定位成使得在中心处的衬底的峰值强度相对于衬底的周边被降低。 在一个实施例中,改善脉冲能量以提供电介质层的期望部分的热应力和物理剥离。