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    • 2. 发明申请
    • METHOD FOR PATTERNING MO LAYER IN A PHOTOVOLTAIC DEVICE COMPRISING CIGS MATERIAL USING AN ETCH PROCESS
    • 在使用蚀刻工艺的包含CIGS材料的光伏器件中绘制薄膜层的方法
    • US20090111209A1
    • 2009-04-30
    • US12346750
    • 2008-12-30
    • Timothy WEIDMANLi XuPeter G. Borden
    • Timothy WEIDMANLi XuPeter G. Borden
    • H01L21/06
    • H01L31/0749H01L31/03923H01L31/0465H01L31/18Y02E10/541
    • A processing method described herein provides a method of patterning a MoSe2 and/or Mo material, for example a layer of such material(s) in a thin-film structure. According to one aspect, the invention relates to etch solutions that can effectively etch through Mo and/or MoSe2. According to another aspect, the invention relates to etching such materials when such materials are processed with other materials in a thin film photovoltaic device. According to other aspects, the invention includes a process of etching Mo and/or MoSe2 with selectivity to a layer of CIGS material in an overall process flow. According to still further aspects, the invention relates to Mo and/or MoSe2 etch solutions that are useful in an overall photolithographic process for forming a photovoltaic cell and/or interconnects and test structures in a photovoltaic device.
    • 本文所述的处理方法提供了一种图案化MoSe 2和/或Mo材料的方法,例如薄膜结构中的这种材料层。 根据一个方面,本发明涉及可以有效地通过Mo和/或MoSe2蚀刻的蚀刻溶液。 根据另一方面,本发明涉及当这种材料在薄膜光伏器件中用其它材料加工时蚀刻这种材料。 根据其它方面,本发明包括在整个工艺流程中对具有选择性的CIGS材料的Mo和/或MoSe2进行蚀刻的工艺。 根据另外的方面,本发明涉及可用于在光伏器件中形成光伏电池和/或互连和测试结构的整体光刻工艺中的Mo和/或MoSe2蚀刻溶液。
    • 4. 发明授权
    • Method for patterning Mo layer in a photovoltaic device comprising CIGS material using an etch process
    • 使用蚀刻工艺在包括CIGS材料的光伏器件中图案化Mo层的方法
    • US07547569B2
    • 2009-06-16
    • US11562573
    • 2006-11-22
    • Timothy WeidmanLi XuPeter G. Borden
    • Timothy WeidmanLi XuPeter G. Borden
    • H01L21/00H01L21/06
    • H01L31/0749H01L31/03923H01L31/0465H01L31/18Y02E10/541
    • A processing method described herein provides a method of patterning a MoSe2 and/or Mo material, for example a layer of such material(s) in a thin-film structure. According to one aspect, the invention relates to etch solutions that can effectively etch through Mo and/or MoSe2. According to another aspect, the invention relates to etching such materials when such materials are processed with other materials in a thin film photovoltaic device. According to other aspects, the invention includes a process of etching Mo and/or MoSe2 with selectivity to a layer of CIGS material in an overall process flow. According to still further aspects, the invention relates to Mo and/or MoSe2 etch solutions that are useful in an overall photolithographic process for forming a photovoltaic cell and/or interconnects and test structures in a photovoltaic device.
    • 本文所述的处理方法提供了一种图案化MoSe 2和/或Mo材料的方法,例如薄膜结构中的这种材料层。 根据一个方面,本发明涉及可以有效地通过Mo和/或MoSe2蚀刻的蚀刻溶液。 根据另一方面,本发明涉及当这种材料在薄膜光伏器件中用其它材料加工时蚀刻这种材料。 根据其它方面,本发明包括在整个工艺流程中对具有选择性的CIGS材料的Mo和/或MoSe2进行蚀刻的工艺。 根据另外的方面,本发明涉及可用于在光伏器件中形成光伏电池和/或互连和测试结构的整体光刻工艺中的Mo和/或MoSe2蚀刻溶液。
    • 5. 发明申请
    • METHOD FOR PATTERNING MO LAYER IN A PHOTOVOLTAIC DEVICE COMPRISING CIGS MATERIAL USING AN ETCH PROCESS
    • 在使用蚀刻工艺的包含CIGS材料的光伏器件中绘制薄膜层的方法
    • US20080119005A1
    • 2008-05-22
    • US11562573
    • 2006-11-22
    • Timothy WeidmanLi XuPeter G. Borden
    • Timothy WeidmanLi XuPeter G. Borden
    • H01L31/0272
    • H01L31/0749H01L31/03923H01L31/0465H01L31/18Y02E10/541
    • A processing method described herein provides a method of patterning a MoSe2 and/or Mo material, for example a layer of such material(s) in a thin-film structure. According to one aspect, the invention relates to etch solutions that can effectively etch through Mo and/or MoSe2. According to another aspect, the invention relates to etching such materials when such materials are processed with other materials in a thin film photovoltaic device. According to other aspects, the invention includes a process of etching Mo and/or MoSe2 with selectivity to a layer of CIGS material in an overall process flow. According to still further aspects, the invention relates to Mo and/or MoSe2 etch solutions that are useful in an overall photolithographic process for forming a photovoltaic cell and/or interconnects and test structures in a photovoltaic device.
    • 本文所述的处理方法提供了一种图案化MoSe 2和/或Mo材料的方法,例如薄膜结构中的这种材料层。 根据一个方面,本发明涉及可以有效地蚀刻通过Mo和/或MoSe 2的蚀刻溶液。 根据另一方面,本发明涉及当这种材料在薄膜光伏器件中用其它材料加工时蚀刻这种材料。 根据其它方面,本发明包括在整个工艺流程中对具有选择性的CIGS材料的Mo和/或MoSe 2进行蚀刻的工艺。 根据另外的方面,本发明涉及可用于在光伏器件中形成光伏电池和/或互连和测试结构的整体光刻工艺中的Mo和/或MoSe 2 N 2蚀刻溶液。
    • 9. 发明授权
    • Low nickel austenitic stainless steel
    • 低镍奥氏体不锈钢
    • US09028745B2
    • 2015-05-12
    • US13286373
    • 2011-11-01
    • Shouxing ZhuLi XuBalasubramani Nandagopal
    • Shouxing ZhuLi XuBalasubramani Nandagopal
    • C22C38/58C22C38/38C22C38/48C22C38/44
    • C22C38/58
    • Various embodiments of the invention provide a low nickel austenitic stainless steel alloy composition including about 0.6% to about 0.8% by weight carbon; about 16% to about 18% by weight chromium; about 4.5% to about 5.5% by weight nickel; about 2.0% to about 5.0% by weight manganese; about 0.8% to about 1.2% by weight tungsten; about 0.8% to about 1.2% by weight molybdenum; about 0.65% to about 0.85% by weight niobium; about 0.3% to about 1.0% by weight silicon; balance iron and unavoidable impurities, wherein percentages are based on the overall weight of the composition. The invention further provides articles, such as turbine housings, prepared using the inventive alloys.
    • 本发明的各种实施方案提供了一种低镍奥氏体不锈钢合金组合物,其包含约0.6重量%至约0.8重量%的碳; 约16重量%至约18重量%的铬; 约4.5%至约5.5%重量的镍; 约2.0%至约5.0%重量的锰; 约0.8%至约1.2%重量的钨; 约0.8重量%至约1.2重量%的钼; 约0.65重量%至约0.85重量%的铌; 约0.3%至约1.0%重量的硅; 平衡铁和不可避免的杂质,其中百分数是基于组合物的总重量。 本发明还提供了使用本发明合金制备的制品,例如涡轮机壳体。
    • 10. 发明授权
    • Method of producing a plasma-resistant thermal oxide coating
    • 制造耐等离子体热氧化物涂层的方法
    • US08758858B2
    • 2014-06-24
    • US13374980
    • 2012-01-25
    • Jennifer Y. SunLi XuKenneth S. CollinsThomas GravesRen-Guan DuanSenh Thach
    • Jennifer Y. SunLi XuKenneth S. CollinsThomas GravesRen-Guan DuanSenh Thach
    • B05D3/02
    • C23C16/4404H01J37/32467H01J37/32477
    • A method of creating a plasma-resistant thermal oxide coating on a surface of an article, where the article is comprised of a metal or metal alloy which is typically selected from the group consisting of yttrium, neodymium, samarium, terbium, dysprosium, erbium, ytterbium, scandium, hafnium, niobium or combinations thereof. The oxide coating is formed using a time-temperature profile which includes an initial rapid heating rage, followed by a gradual decrease in heating rate, to produce an oxide coating structure which is columnar in nature. The grain size of the crystals which make up the oxide coating is larger at the surface of the oxide coating than at the interface between the oxide coating and the metal or metal alloy substrate, and the oxide coating is in compression at the interface between the oxide coating and the metal or metal alloy substrate.
    • 一种在制品的表面上产生耐等离子体热氧化物涂层的方法,其中制品由金属或金属合金组成,金属或金属合金通常选自钇,钕,钐,铽,镝,铒, 镱,钪,铪,铌或其组合。 使用时间 - 温度曲线形成氧化物涂层,其包括初始的快速加热,然后逐渐降低加热速率,以产生本质上为柱状的氧化物涂层结构。 构成氧化物涂层的晶体的晶粒尺寸在氧化物涂层的表面比在氧化物涂层和金属或金属合金衬底之间的界面处大,并且氧化物涂层在氧化物之间的界面处被压缩 涂层和金属或金属合金基材。