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1. 发明授权

US08689812B2 Methods and loadport for purging a substrate carrier 有权
标题翻译：吹扫衬底载体的方法和载荷
公开(公告)号：US08689812B2
公开(公告)日：2014-04-08
申请号：US13605927
申请日：2012-09-06
申请人： Vinay K. Shah , Eric Englhardt , Jeffrey C. Hudgens , Martin R. Elliott
发明人： Vinay K. Shah , Eric Englhardt , Jeffrey C. Hudgens , Martin R. Elliott
IPC分类号： H01L21/00
CPC分类号： H01L21/67393 , H01L21/67017 , H01L21/67353 , Y10S414/135 , Y10S414/137 , Y10T137/0318 , Y10T137/0396
摘要： In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了一种衬底载体，其包括适于可密封的壳体并容纳至少一个衬底。衬底载体包括通向壳体的第一端口，并且适于在衬底载体关闭的同时允许气体流入外壳。提供了许多其他方面。

2. 发明授权

US08672121B2 Methods and apparatus for transporting substrate carriers 有权
标题翻译：用于运输衬底载体的方法和装置
公开(公告)号：US08672121B2
公开(公告)日：2014-03-18
申请号：US12254839
申请日：2008-10-21
申请人： Vinay K. Shah , Jeffrey C. Hudgens
发明人： Vinay K. Shah , Jeffrey C. Hudgens
IPC分类号： B65G15/44 , B65G15/22 , B65G15/60
CPC分类号： B65G15/44 , B65G15/56
摘要： A conveyor apparatus adapted to transport and article is provided. The conveyor apparatus has a belt section including a plurality of slots and a plurality of T-shaped stiffeners extending in the slots. Respective belt sections may be spliced together using a plurality of T-shaped stiffeners extending through slots in diagonally-formed ends of each belt section. Methods of the invention are described as are numerous other aspects.
摘要翻译：提供适于运输和物品的输送设备。输送装置具有带部分，该带部分包括多个槽和在槽中延伸的多个T形加强件。可以使用多个T形加强筋将相应的带部分拼接在一起，每个T形加强件穿过每个带部分的对角线形成的端部中的槽。本发明的方法被描述为许多其它方面。

3. 发明授权

US08601975B2 Methods and loadport apparatus for purging a substrate carrier 有权
标题翻译：用于清洗衬底载体的方法和装载端装置
公开(公告)号：US08601975B2
公开(公告)日：2013-12-10
申请号：US13287534
申请日：2011-11-02
申请人： Vinay K. Shah , Eric Englhardt , Jeffrey C. Hudgens , Martin R. Elliott
发明人： Vinay K. Shah , Eric Englhardt , Jeffrey C. Hudgens , Martin R. Elliott
IPC分类号： H01L21/306 , B05C13/00 , B05C13/02
CPC分类号： H01L21/67393 , H01L21/67017 , H01L21/67353 , Y10S414/135 , Y10S414/137 , Y10T137/0318 , Y10T137/0396
摘要： In a first aspect, a loadport is provided. The loadport has a plate adapted to couple to a door of a substrate carrier to open the substrate carrier wherein the plate includes a first opening adapted to couple to a first port in the door of the substrate carrier on a first side of the plate and to couple to a gas source on a second side of the plate, and wherein the loadport is adapted to allow a flow of gas into the substrate carrier via the first opening in the plate. Methods of purging substrate carriers are provided, as are numerous other aspects.
摘要翻译：在第一方面，提供一种加载端口。装载端口具有适于联接到基板载体的门以打开衬底载体的板，其中板包括适于联接到板的第一侧上的衬底载体的门中的第一端口的第一开口，并且耦合到所述板的第二侧上的气体源，并且其中所述负载端口适于允许气体经由所述板中的所述第一开口流入所述衬底载体。提供清洗衬底载体的方法，以及许多其它方面。

4. 发明授权

US08356968B2 Methods and apparatus for an efficient handshake between material handling and material processing devices for safe material transfer 有权
标题翻译：用于材料处理和材料处理装置之间高效握手的方法和装置，用于安全的材料转移
公开(公告)号：US08356968B2
公开(公告)日：2013-01-22
申请号：US12369722
申请日：2009-02-11
申请人： Vinay K. Shah , Sushant S. Koshti
发明人： Vinay K. Shah , Sushant S. Koshti
IPC分类号： H01L21/677
CPC分类号： G05B19/41815 , G05B2219/31216 , G05B2219/45031 , H01L21/67276 , Y02P90/08 , Y02P90/285
摘要： Methods and systems are provided. The invention includes performing a handshake directly between a load port associated with process equipment and material handling equipment; and transferring a carrier between the material handling equipment and the load port based on the handshake. Numerous other aspects are provided.
摘要翻译：提供方法和系统。本发明包括在与处理设备相关联的负载端口和材料处理设备之间直接进行握手; 并且基于握手在物料搬运设备和装载端口之间传送承运人。提供了许多其他方面。

5. 发明授权

US08258426B2 Laser material removal methods and apparatus 失效
标题翻译：激光材料去除方法和装置
公开(公告)号：US08258426B2
公开(公告)日：2012-09-04
申请号：US12545488
申请日：2009-08-21
申请人： Zhenhua Zhang , Virendra V. S. Rana , Vinay K. Shah , Chris Eberspacher
发明人： Zhenhua Zhang , Virendra V. S. Rana , Vinay K. Shah , Chris Eberspacher
IPC分类号： B23K26/00 , B23K26/02
CPC分类号： B23K26/03 , B23K26/06 , B23K26/0624 , B23K26/082 , B23K26/0853 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L31/022441 , H01L31/0682 , H01L31/18 , Y02E10/547
摘要： Embodiments of the present invention generally provide methods and apparatus for material removal using lasers in the fabrication of solar cells. In one embodiment, an apparatus is provided that precisely removes portions of a dielectric layer deposited on a solar cell substrate according to a desired pattern and deposits a conductive layer over the patterned dielectric layer. In one embodiment, the apparatus also removes portions of the conductive layer in a desired pattern. In certain embodiments, methods for removing a portion of a material via a laser without damaging the underlying substrate are provided. In one embodiment, the intensity profile of the beam is adjusted so that the difference between the maximum and minimum intensity within a spot formed on a substrate surface is reduced to an optimum range. In one example, the substrate is positioned such that the peak intensity at the center versus the periphery of the substrate is lowered. In one embodiment, the pulse energy is improved to provide thermal stress and physical lift-off of a desired portion of a dielectric layer.
摘要翻译：本发明的实施例一般提供了在制造太阳能电池中使用激光去除材料的方法和装置。在一个实施例中，提供了一种装置，其根据期望的图案精确地去除沉积在太阳能电池基板上的电介质层的部分，并且在图案化的电介质层上沉积导电层。在一个实施例中，该装置还以期望的图案去除导电层的部分。在某些实施例中，提供了用于通过激光去除材料的一部分而不损坏下面的衬底的方法。在一个实施例中，调整光束的强度分布，使得在衬底表面上形成的斑点内的最大和最小强度之间的差减小到最佳范围。在一个示例中，衬底被定位成使得在中心处的衬底的峰值强度相对于衬底的周边被降低。在一个实施例中，改善脉冲能量以提供电介质层的期望部分的热应力和物理剥离。

6. 发明授权

US08074597B2 Methods and apparatus for purging a substrate carrier 有权
标题翻译：用于清洗衬底载体的方法和装置
公开(公告)号：US08074597B2
公开(公告)日：2011-12-13
申请号：US11622300
申请日：2007-01-11
申请人： Vinay K. Shah , Eric Englhardt , Jeffrey C. Hudgens , Martin Elliott
发明人： Vinay K. Shah , Eric Englhardt , Jeffrey C. Hudgens , Martin Elliott
IPC分类号： B05C13/00 , B05C13/02 , H01L21/306
CPC分类号： H01L21/67393 , H01L21/67017 , H01L21/67353 , Y10S414/135 , Y10S414/137 , Y10T137/0318 , Y10T137/0396
摘要： In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了一种衬底载体，其包括适于可密封的壳体并容纳至少一个衬底。衬底载体包括通向壳体的第一端口，并且适于在衬底载体关闭的同时允许气体流入外壳。提供了许多其他方面。

7. 发明申请

US20100179683A1 METHODS, SYSTEMS AND APPARATUS FOR RAPID EXCHANGE OF WORK MATERIAL 有权
标题翻译：用于快速交换工作材料的方法，系统和装置
公开(公告)号：US20100179683A1
公开(公告)日：2010-07-15
申请号：US12684660
申请日：2010-01-08
申请人： Vinay K. Shah , Sushant S. Koshti
发明人： Vinay K. Shah , Sushant S. Koshti
IPC分类号： H01L21/677 , G06F7/00
CPC分类号： H01L21/67766
摘要： Systems, apparatus and methods for the rapid exchange of work material in a facility processing substrates (e.g., LCD panels, solar panels, semiconductor wafers, or the like) are disclosed. The system may include load ports associated with a process tool, local storage units, and a work material exchange apparatus adapted to rapidly exchange work material at the ports, units, or other exchange locations. The work material exchange apparatus may include two or more end effectors coupled to one or more actuator members and which may be adapted to rapidly exchange two or more carriers containing work material at an exchange location.
摘要翻译：公开了用于在处理基板（例如，LCD面板，太阳能电池板，半导体晶片等）的设备中快速更换工作材料的系统，装置和方法。系统可以包括与处理工具相关联的装载端口，本地存储单元和适于在端口，单元或其他交换位置快速交换工作材料的工作材料交换装置。工作材料交换装置可以包括耦合到一个或多个致动器构件的两个或更多个端部执行器，并且可以适于在交换位置快速地交换包含工作材料的两个或更多个载体。

8. 发明申请

US20090225160A1 SYSTEM, METHODS AND APPARATUS FOR SUBSTRATE CARRIER CONTENT VERIFICATION USING A MATERIAL HANDLING SYSTEM 有权
标题翻译：使用材料处理系统的基板载体内容验证的系统，方法和装置
公开(公告)号：US20090225160A1
公开(公告)日：2009-09-10
申请号：US12398178
申请日：2009-03-04
申请人： Vinay K. Shah , Sushant S. Koshti , Eric A. Englhardt
发明人： Vinay K. Shah , Sushant S. Koshti , Eric A. Englhardt
IPC分类号： H04N7/18 , H04N5/225
CPC分类号： H01L21/67259 , H01L21/67353 , H01L21/681
摘要： Methods and systems are provided for mapping substrates in a substrate carrier. The invention includes a substrate carrier including one or more windows; and an imaging system coupled to a substrate carrier handling robot and adapted to determine or image substrate positions in the substrate carrier via the one or more windows. Numerous other aspects are provided.
摘要翻译：提供了用于在衬底载体中映射衬底的方法和系统。本发明包括一个包括一个或多个窗的衬底载体; 以及耦合到衬底载体处理机器人并且适于经由所述一个或多个窗口来确定或图像所述衬底载体中的衬底位置的成像系统。提供了许多其他方面。

9. 发明申请

US20090188103A1 METHODS AND APPARATUS FOR MOVING A SUBSTRATE CARRIER 有权
标题翻译：移动基板载体的方法和装置
公开(公告)号：US20090188103A1
公开(公告)日：2009-07-30
申请号：US12359310
申请日：2009-01-24
申请人： Martin R. Elliott , Vinay K. Shah , Eric A. Englhardt , Jeffrey C. Hudgens
发明人： Martin R. Elliott , Vinay K. Shah , Eric A. Englhardt , Jeffrey C. Hudgens
IPC分类号： H05K13/00 , H01L21/677 , H01L21/683
CPC分类号： H01L21/68707 , H01L21/67769 , Y10T29/49002 , Y10T29/49829 , Y10T29/49998 , Y10T29/5136 , Y10T29/5137 , Y10T29/5313 , Y10T29/53257 , Y10T29/53265
摘要： Systems, methods, and apparatus are provided for electronic device manufacturing. The invention includes removing a first substrate carrier and a second substrate carrier from a moving conveyor using an end effector assembly and concurrently transferring the first and second substrate carriers from the moving conveyor to a support location via the end effector assembly. Numerous other aspects are provided.
摘要翻译：为电子设备制造提供了系统，方法和设备。本发明包括使用端部执行器组件从移动的传送器移除第一衬底载体和第二衬底载体，并且同时地将第一和第二衬底载体从移动的传送器经由端部执行器组件传送到支撑位置。提供了许多其他方面。

10. 发明申请

US20080294282A1 USE OF LOGICAL LOTS IN SEMICONDUCTOR SUBSTRATE PROCESSING 审中-公开
标题翻译：在半导体基板处理中使用逻辑元件
公开(公告)号：US20080294282A1
公开(公告)日：2008-11-27
申请号：US12126880
申请日：2008-05-24
申请人： Sushant S. Koshti , Vinay K. Shah , Eric A. Englhardt
发明人： Sushant S. Koshti , Vinay K. Shah , Eric A. Englhardt
IPC分类号： H01L21/67 , G06F17/00 , H01L21/677
CPC分类号： H01L21/67276 , H01L21/67271
摘要： In some embodiments, a method of processing substrates is provided that includes (1) grouping substrates in a plurality of substrate carriers as a logical lot; (2) processing the logical lot as if the substrates were stored in a single substrate carrier; and (3) performing metrology on a representative subset of substrates in the logical lot. Numerous other embodiments are provided.
摘要翻译：在一些实施例中，提供了处理衬底的方法，其包括（1）将多个衬底载体中的衬底分组为逻辑批次; （2）处理逻辑批次，好像基板存储在单个基板载体中; 和（3）在逻辑批次中的代表性基底子集上进行计量。提供了许多其他实施例。

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