专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US07655207B2 Aluminum complex hydroxide salt and method of producing the same 失效
标题翻译：铝复合氢氧化物盐及其制备方法
公开(公告)号：US07655207B2
公开(公告)日：2010-02-02
申请号：US12226470
申请日：2007-04-19
申请人： Madoka Minagawa
发明人： Madoka Minagawa
IPC分类号： C01B33/20 , C01C1/00
CPC分类号： C01F7/002 , C01P2002/22 , C01P2002/72 , C01P2002/86 , C01P2004/62 , C01P2006/10 , C01P2006/12 , C01P2006/60
摘要： An aluminum complex hydroxide salt having Al oxide octahedral layers and a divalent anion among the octahedral layers, wherein an aluminosilicate anion expressed by the following general formula (1), [NapAlqSirOz]2− (1) wherein p, q, r and z are positive numbers satisfying, 5≦z≦20, z=(p/2)+(3q/2)+2r+1, 0
摘要翻译：在八面体层中具有Al氧化物八面体层和二价阴离子的铝复合氢氧化物盐，其中由以下通式（1）表示的铝硅酸盐阴离子，[NapAlqSirOz] 2-（1）其中p，q，r和z为正数满足，5 <= z <= 20，z =（p / 2）+（3q / 2）+ 2r + 1,0

12. 发明授权

US07172130B2 Electronic device, rubber product, and methods for manufacturing the same 有权
标题翻译：电子装置，橡胶制品及其制造方法
公开(公告)号：US07172130B2
公开(公告)日：2007-02-06
申请号：US10960074
申请日：2004-10-08
申请人： Shigeharu Tsunoda , Hiroshi Hozoji , Madoka Minagawa
发明人： Shigeharu Tsunoda , Hiroshi Hozoji , Madoka Minagawa
IPC分类号： G06K19/06 , H05B3/30 , B29V45/14 , G08B13/14
CPC分类号： G06K19/07749 , G06K19/07728 , G06K19/07764
摘要： The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.
摘要翻译：本发明旨在提高RFID芯片入口的耐久性。包括与天线对应的RFID芯片的模块被具有粘合剂层的聚酰亚胺膜覆盖以构成RFID入口。然后，RFID入口的外表面被处理的表面覆盖以增加基部的表面润滑性。当RFID入口用于橡胶制品时，它被安装到橡胶制品的橡胶基座上，RFID入口的暴露表面被未硫化橡胶覆盖，然后将未硫化橡胶压制和加热，使得RFID 入口嵌入橡胶底座。

13. 发明授权

US07122087B2 Method of manufacturing RFID 有权
标题翻译：制造RFID的方法
公开(公告)号：US07122087B2
公开(公告)日：2006-10-17
申请号：US10985934
申请日：2004-11-12
申请人： Naoya Kanda , Kosuke Inoue , Madoka Minagawa , Shigeharu Tsunoda
发明人： Naoya Kanda , Kosuke Inoue , Madoka Minagawa , Shigeharu Tsunoda
IPC分类号： B32B37/00
CPC分类号： G06K19/0775 , G06K19/07745 , G06K19/07749 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/81191 , H01L2224/81395 , H01L2924/01079
摘要： There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.
摘要翻译：存在制造RFID的方法，其中具有存储器的半导体芯片被结合到天线，使得可以通过天线发送记录在存储器中的信息。在RFID中，使用PET膜，PEN膜或纸张作为天线的基材。该方法包括：将半导体芯片与相对于天线的金凸块对准，其中由铝或铝合金形成的金属箔粘附到包括聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的基材上; 将半导体芯片按压到天线; 并在低于聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的玻璃化转变温度的环境温度下施加超声波，从而结合金凸块和金属箔。因此，该方法抑制天线的变形。

14. 发明授权

US06706249B1 Composite polybasic salt, process for producing the same, and use 失效
标题翻译：复合多元盐，生产方法及用途
公开(公告)号：US06706249B1
公开(公告)日：2004-03-16
申请号：US09786423
申请日：2001-03-06
申请人： Yoshinobu Komatsu , Hitoshi Ishida , Hiroshi Igarashi , Masami Kondo , Madoka Minagawa , Tetsu Sato , Teiji Sato
发明人： Yoshinobu Komatsu , Hitoshi Ishida , Hiroshi Igarashi , Masami Kondo , Madoka Minagawa , Tetsu Sato , Teiji Sato
IPC分类号： C01F776
CPC分类号： C09K21/02 , B01J41/10 , C01B13/363 , C01F7/005 , C01G1/00 , C01P2002/01 , C01P2002/22 , C01P2002/72 , C01P2002/80 , C01P2002/82 , C01P2002/88 , C01P2004/03 , C08K3/22
摘要： A composite metal polybasic salt containing a trivalent metal and magnesium as metal components and having a novel crystal structure, and a method of preparing the same. The invention further deals with a composite metal polybasic salt which has anion-exchanging property, which by itself is useful as an anion-exchanger, capable of introducing anions suited for the use upon anion-exchange, and finds a wide range of applications, and a method of preparing the same. The composite metal polybasic salt has a particular chemical composition and X-ray diffraction peaks, and further has a degree of orientation (Io) of not smaller than 1.5.
摘要翻译：含有三价金属和镁作为金属成分并具有新的晶体结构的复合金属多元盐及其制备方法。本发明还涉及具有阴离子交换性质的复合金属多元盐，其本身可用作阴离子交换剂，能够引入适用于阴离子交换的阴离子，并且可广泛应用，并且其制备方法。复合金属多元盐具有特定的化学组成和X射线衍射峰，并且还具有不小于1.5的取向度（Io）。

15. 发明申请

US20100209041A1 PHOTOELECTRIC COMPOSITE WIRING MODULE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：光电复合接线模块及其制造方法
公开(公告)号：US20100209041A1
公开(公告)日：2010-08-19
申请号：US12623686
申请日：2009-11-23
申请人： Naoki MATSUSHIMA , Norio CHUJO , Yasunobu MATSUOKA , Toshiki SUGAWARA , Madoka MINAGAWA , Saori HAMAMURA , Satoshi KANEKO , Tsutomu KONO
发明人： Naoki MATSUSHIMA , Norio CHUJO , Yasunobu MATSUOKA , Toshiki SUGAWARA , Madoka MINAGAWA , Saori HAMAMURA , Satoshi KANEKO , Tsutomu KONO
IPC分类号： G02B6/12 , H01L21/00 , G02B6/36
CPC分类号： G02B6/4214 , H05K1/0274 , H05K1/185 , H05K3/4602 , H05K3/4644
摘要： A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.
摘要翻译：光电复合布线模块包括电路基板，光学装置，具有驱动器的LSI和用于光学装置的放大器，以及具有电布线的薄膜布线层。光学器件通过电线与LSI连接。光学器件形成在电路基板上，并且光耦合到形成在电路基板中的光波导。在光学器件上形成薄膜布线层，以确保光学器件与薄膜布线层的电气布线电连接。 LSI与薄膜布线层安装在电连接上。

16. 发明授权

US06930388B2 Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure 有权
标题翻译：半导体器件及其制造方法以及半导体器件安装结构
公开(公告)号：US06930388B2
公开(公告)日：2005-08-16
申请号：US09811401
申请日：2001-03-20
申请人： Yoshihide Yamaguchi , Hiroyuki Tenmei , Kosuke Inoue , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Naoya Kanda , Madoka Minagawa , Ichiro Anjo , Asao Nishimura , Kenji Ujiie , Akira Yajima
发明人： Yoshihide Yamaguchi , Hiroyuki Tenmei , Kosuke Inoue , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Naoya Kanda , Madoka Minagawa , Ichiro Anjo , Asao Nishimura , Kenji Ujiie , Akira Yajima
IPC分类号： H01L23/29 , H01L21/56 , H01L21/60 , H01L23/12 , H01L23/31 , H01L23/485 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/12 , H01L23/3114 , H01L23/3171 , H01L24/11 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05171 , H01L2224/05644 , H01L2224/13099 , H01L2224/16 , H01L2224/45144 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/30105 , H01L2924/351 , H01L2924/00 , H01L2924/01034 , H01L2924/00014
摘要： A semiconductor device is provided which enables a flip chip connection without use of underfill. The semiconductor device includes a semiconductor element having circuit electrodes and a circuit surface coated with a protecting film. A stress relaxation layer is provided by coating a cured thermoplastic resin onto the protecting film of the circuit surface in a manner which leaves the circuit electrodes exposed and curing it and having an inclination in the edge portion thereof. A wiring layer with wirings is connected to each of the circuit electrodes and disposed so as to make an electrical connection from the circuit electrodes, via the edge portion of the stress relaxation layer, and to a desired portion on the surface of the stress relaxation layer. A protecting film is provided thereon, and an external connection terminal is also provided.
摘要翻译：提供一种半导体器件，其能够在不使用底部填充物的情况下实现倒装芯片连接。半导体器件包括具有电路电极的半导体元件和涂有保护膜的电路表面。通过将固化的热塑性树脂以使电路电极暴露并固化并且在其边缘部分具有倾斜的方式将固化的热塑性树脂涂覆到电路表面的保护膜上来提供应力松弛层。具有布线的布线层连接到每个电路电极，并布置成经由应力松弛层的边缘部分和电路电极的电连接到应力松弛层的表面上的期望部分。在其上设置有保护膜，并且还设置有外部连接端子。

17. 发明申请

US20050101060A1 Electronic device, rubber product, and methods for manufacturing the same 有权
标题翻译：电子装置，橡胶制品及其制造方法
公开(公告)号：US20050101060A1
公开(公告)日：2005-05-12
申请号：US10960074
申请日：2004-10-08
申请人： Shigeharu Tsunoda , Hiroshi Hozoji , Madoka Minagawa
发明人： Shigeharu Tsunoda , Hiroshi Hozoji , Madoka Minagawa
IPC分类号： G06K19/07 , G06K19/00 , G06K19/077 , H01L21/44 , H01L25/00
CPC分类号： G06K19/07749 , G06K19/07728 , G06K19/07764
摘要： The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.
摘要翻译：本发明旨在提高RFID芯片入口的耐久性。包括与天线对应的RFID芯片的模块被具有粘合剂层的聚酰亚胺膜覆盖以构成RFID入口。然后，RFID入口的外表面被处理的表面覆盖以增加基部的表面润滑性。当RFID入口用于橡胶制品时，它被安装到橡胶制品的橡胶基座上，RFID入口的暴露表面被未硫化橡胶覆盖，然后将未硫化橡胶压制和加热，使得RFID 入口嵌入橡胶底座。

18. 发明授权

US06624504B1 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06624504B1
公开(公告)日：2003-09-23
申请号：US09698185
申请日：2000-10-30
申请人： Kosuke Inoue , Hiroyuki Tenmei , Yoshihide Yamaguchi , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Madoka Minagawa , Naoya Kanda , Ichiro Anjo , Asao Nishimura , Akira Yajima , Kenji Ujiie
发明人： Kosuke Inoue , Hiroyuki Tenmei , Yoshihide Yamaguchi , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Madoka Minagawa , Naoya Kanda , Ichiro Anjo , Asao Nishimura , Akira Yajima , Kenji Ujiie
IPC分类号： H01L23495
CPC分类号： H01L23/293 , H01L21/563 , H01L23/295 , H01L23/3114 , H01L23/3157 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05568 , H01L2224/05569 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3025 , H01L2924/00 , H01L2924/01033 , H01L2924/01034
摘要： A semiconductor apparatus includes a semiconductor device having circuit electrodes aligned centrally of the semiconductor apparatus. A first electrically insulating layer is formed on said semiconductor device with said circuit electrodes being exposed from said first insulating layer. A second electrically insulating layer is formed on said first insulating layer, and external connection terminals are formed on said second insulating layer. A wiring is formed on said second insulating layer to electrically connect said external connect terminals to said circuit electrodes of said semiconductor device, and a third electrically insulating layer is formed on said second insulating layer and on said wiring. Particles are provided in the second insulating layer to control a shape of said second insulating layer.
摘要翻译：半导体装置包括具有对准半导体装置中心的电路电极的半导体装置。在所述半导体器件上形成第一电绝缘层，所述电路电极从所述第一绝缘层露出。在所述第一绝缘层上形成第二电绝缘层，在所述第二绝缘层上形成外部连接端子。在所述第二绝缘层上形成布线，以将所述外部连接端子电连接到所述半导体器件的所述电路电极，并且在所述第二绝缘层和所述布线上形成第三电绝缘层。在第二绝缘层中提供颗粒以控制所述第二绝缘层的形状。

19. 发明授权

US08406581B2 Photoelectric composite wiring module and method for manufacturing same 有权
标题翻译：光电复合布线模块及其制造方法
公开(公告)号：US08406581B2
公开(公告)日：2013-03-26
申请号：US13382459
申请日：2010-06-02
申请人： Saori Hamamura , Naoki Matsushima , Madoka Minagawa , Satoshi Kaneko , Norio Chujo , Yasunobu Matsuoka , Toshiki Sugawara , Tsutomu Kono
发明人： Saori Hamamura , Naoki Matsushima , Madoka Minagawa , Satoshi Kaneko , Norio Chujo , Yasunobu Matsuoka , Toshiki Sugawara , Tsutomu Kono
IPC分类号： G02B6/12
CPC分类号： G02B6/4201 , G02B6/424 , G02B6/4244 , G02B6/4246 , G02B6/4257 , G02B6/428 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/19 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/3512 , Y10T29/49146
摘要： A photoelectric composite wiring module, being superior in performances and mass-productivity thereof, and a transmission apparatus of applying that therein are provided.Optical devices 2a and 2b are disposed on a circuit board 1, so that they are optically coupled with optical guides 11 formed on the circuit board 1, wherein a filet-like resin is formed on a side surface of a bump, which is formed on side surfaces or/and upper portions of the optical devices, on an upper layer thereof being compressed a resin film to be adhered thereon, thereby forming an insulation film 31, and an electric wiring layer 3 is laminated, so that the electrodes of the optical devices 2 and wirings of the electric wiring layer are electrically connected with, and further thereon is mounted a semiconductor element 4; thereby obtaining the structure for brining the transmission speed to be high per channel, and for preventing the power consumption from increasing. Also, it has the structure of not causing deterioration of the optical devices due to ill influences of moisture, thereby achieving high reliability. Further, it also produces an easy connecting method with a transmission apparatus, and high productivity thereof.
摘要翻译：提供了一种性能优良，批量生产率高的光电复合布线模块以及其中应用的发送装置。光学器件2a和2b设置在电路板1上，使得它们与形成在电路板1上的光导11光学耦合，其中在凸起的侧表面上形成file状树脂，其形成在光学元件的侧表面或/或上部在其上层被压缩以粘附在其上的树脂膜，从而形成绝缘膜31，并且层叠电布线层3，使得光学器件的电极器件2和布线层的布线电连接，并且其上安装有半导体元件4; 从而获得用于使传输速度提高到每个通道高的结构，并且用于防止功耗增加。此外，其具有不会由于湿气的不良影响而导致光学元件劣化的结构，从而实现高可靠性。此外，它还产生与传动装置的简单连接方法，并且其生产率高。

20. 发明申请

US20120024959A1 RFID INLET AND RFID TAG, AND METHOD FOR MANUFACTURING RFID INLET AND RFID TAG 审中-公开
标题翻译： RFID入口和RFID标签，以及制造RFID入口和RFID标签的方法
公开(公告)号：US20120024959A1
公开(公告)日：2012-02-02
申请号：US13077390
申请日：2011-03-31
申请人： Madoka MINAGAWA , Naoya KANDA , Isao SAKAMA , Shigeru SAGAWA , Daisuke SHIBATA
发明人： Madoka MINAGAWA , Naoya KANDA , Isao SAKAMA , Shigeru SAGAWA , Daisuke SHIBATA
IPC分类号： G06K19/077 , H01L21/98
CPC分类号： H01Q1/2208 , G06K19/0772 , G06K19/07722 , G06K19/07754 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191 , H01L2924/00014 , H01L2224/0401
摘要： An RFID inlet by including: a base film; an antenna pattern formed on the base film; an insulation film layer formed on the antenna pattern and having a hole; an IC chip coupled to the antenna pattern inside the hole of the insulation film layer; and an underfill filled between the IC chip, the antenna, and the base film. The height of the IC chip top surface is at a higher level than the top surface of the insulation film layer, the underfill is formed between the IC chip and a wall surface of the hole of the insulation film layer.
摘要翻译：一种RFID入口，包括：基膜; 形成在基膜上的天线图案; 形成在所述天线图案上并具有孔的绝缘膜层; IC芯片，耦合到绝缘膜层的孔内的天线图案; 以及填充在IC芯片，天线和基膜之间的底部填充物。 IC芯片顶面的高度比绝缘膜层的顶面高，在IC芯片与绝缘膜层的孔的壁面之间形成底部填充物。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式