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1. 发明申请

US20080164575A1 METHOD FOR MANUFACTURING A THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND A WAFER USED THEREIN 有权
标题翻译：制造三维半导体器件的方法及其使用的波形
公开(公告)号：US20080164575A1
公开(公告)日：2008-07-10
申请号：US11956560
申请日：2007-12-14
申请人： Hiroaki Ikeda , Masakazu Ishino , Hiroyuki Tenmei , Naoya Kanda , Yasuhiro Naka , Kunihiko Nishi
发明人： Hiroaki Ikeda , Masakazu Ishino , Hiroyuki Tenmei , Naoya Kanda , Yasuhiro Naka , Kunihiko Nishi
IPC分类号： H01L21/46 , H01L29/06
CPC分类号： H01L21/46 , H01L21/76898 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/50 , H01L2224/0361 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/11462 , H01L2224/1147 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16 , H01L2224/81205 , H01L2224/81801 , H01L2224/83194 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/15311 , H01L2224/11 , H01L2224/81 , H01L2924/00014 , H01L2224/13099
摘要： A method for manufacturing a semiconductor device includes the steps of forming first and second semiconductor wafers each including an array of chips and elongate electrodes, forming a groove on scribe lines separating the chips from one another; coating a surface of one of the semiconductor wafers with adhesive; bonding together the semiconductor wafers while allowing the groove to receive therein excessive adhesive; and heating the wafers to connect the elongate electrodes of both the semiconductor wafers.
摘要翻译：一种制造半导体器件的方法包括以下步骤：形成第一和第二半导体晶片，每个半导体晶片均包括芯片和细长电极阵列，在将芯片彼此分开的划线上形成凹槽; 用粘合剂涂覆其中一个半导体晶片的表面; 将半导体晶片粘合在一起，同时允许凹槽在其中容纳过多的粘合剂; 并加热晶片以连接两个半导体晶片的细长电极。

2. 发明授权

US07122087B2 Method of manufacturing RFID 有权
标题翻译：制造RFID的方法
公开(公告)号：US07122087B2
公开(公告)日：2006-10-17
申请号：US10985934
申请日：2004-11-12
申请人： Naoya Kanda , Kosuke Inoue , Madoka Minagawa , Shigeharu Tsunoda
发明人： Naoya Kanda , Kosuke Inoue , Madoka Minagawa , Shigeharu Tsunoda
IPC分类号： B32B37/00
CPC分类号： G06K19/0775 , G06K19/07745 , G06K19/07749 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/81191 , H01L2224/81395 , H01L2924/01079
摘要： There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.
摘要翻译：存在制造RFID的方法，其中具有存储器的半导体芯片被结合到天线，使得可以通过天线发送记录在存储器中的信息。在RFID中，使用PET膜，PEN膜或纸张作为天线的基材。该方法包括：将半导体芯片与相对于天线的金凸块对准，其中由铝或铝合金形成的金属箔粘附到包括聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的基材上; 将半导体芯片按压到天线; 并在低于聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的玻璃化转变温度的环境温度下施加超声波，从而结合金凸块和金属箔。因此，该方法抑制天线的变形。

3. 发明授权

US06610934B2 Semiconductor module and method of making the device 失效
公开(公告)号：US06610934B2
公开(公告)日：2003-08-26
申请号：US09995772
申请日：2001-11-29
申请人： Yoshihide Yamaguchi , Takao Terabayashi , Hiroyuki Tenmei , Hiroshi Hozoji , Naoya Kanda
发明人： Yoshihide Yamaguchi , Takao Terabayashi , Hiroyuki Tenmei , Hiroshi Hozoji , Naoya Kanda
IPC分类号： H01R1204
CPC分类号： H05K3/0044 , H01L21/486 , H01L23/147 , H01L23/15 , H01L23/49816 , H01L23/5383 , H01L23/5384 , H01L24/48 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/16225 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/1433 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H05K1/0271 , H05K1/0306 , H05K1/115 , H05K3/4605 , H05K3/4688 , H05K2201/0154 , H05K2201/068 , H05K2201/0949 , H05K2201/09518 , H05K2201/09536 , H05K2201/0959 , H05K2201/09827 , H05K2203/025 , H05K2203/1581 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.

4. 发明授权

US08035522B2 RFID tag 有权
标题翻译： RFID标签
公开(公告)号：US08035522B2
公开(公告)日：2011-10-11
申请号：US12233900
申请日：2008-09-19
申请人： Noriyuki Oroku , Naoya Kanda , Hidehiko Kando , Kouichi Uesaka
发明人： Noriyuki Oroku , Naoya Kanda , Hidehiko Kando , Kouichi Uesaka
IPC分类号： G08B13/14
CPC分类号： G06K19/07749
摘要： A circuit chip having a loop-shaped antenna coil on a main surface and a tag sheet having an antenna pattern on a main surface are prepared, and the circuit chip is mounted on the main surface of the tag sheet so as not to place over the antenna pattern. The circuit chip is placed closely to the antenna pattern, and at least the half of the main surface is desirably faced against the antenna pattern. Thus, signals and/or power can be securely exchanged between the circuit chip (or antenna coil) and the antenna pattern. Therefore, a high-performance and rigid RFID tag can be obtained by roughly aligning the circuit chip and the tag sheet.
摘要翻译：制备在主表面上具有环形天线线圈的电路芯片和在主表面上具有天线图案的标签片，并且将电路芯片安装在标签片的主表面上，以便不会放置在天线方向图。电路芯片靠近天线图案放置，并且至少主表面的一半期望面对天线图案。因此，可以在电路芯片（或天线线圈）和天线图案之间可靠地交换信号和/或功率。因此，通过粗略地对准电路芯片和标签片，可以获得高性能和刚性的RFID标签。

5. 发明授权

US08009047B2 RFID tag 失效
标题翻译： RFID标签
公开(公告)号：US08009047B2
公开(公告)日：2011-08-30
申请号：US12211150
申请日：2008-09-16
申请人： Naoya Kanda , Noriyuki Oroku
发明人： Naoya Kanda , Noriyuki Oroku
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K19/07775 , G06K19/07779 , G06K19/07798
摘要： For protecting information stored in an RFID chip and ensuring its authenticity, radio communication between the RFID chip and an external terminal is positively interrupted when a seal type RFID tag including the RFID chip is peeled from an adherend, while ensuring solidity integrity when the RFID tag is put on the adherend. In the seal type RFID tag which includes the RFID chip fixed on a mounting surface of a base member having an adhesive layer applied thereto and which is put on the adherend by using the adhesive layer, an antenna formed on a main surface of the RFID chip is embedded in adhesive layers together with the RFID chip and an adhesive bonding strength between the antenna and the adhesive layer is made greater than a joining strength between the antenna and the RFID chip.
摘要翻译：为了保护存储在RFID芯片中的信息并确保其真实性，当将RFID芯片的密封型RFID标签从被粘物剥离时，RFID芯片和外部端子之间的无线电通信被确实地中断，同时当RFID标签被贴在被粘物上。在包括RFID芯片的密封型RFID标签中，RFID芯片固定在具有粘合剂层的基底构件的安装面上，并且通过使用粘合剂层被放置在被粘物上，形成在RFID芯片的主表面上的天线与RFID芯片一起嵌入粘合剂层中，并且天线和粘合剂层之间的粘合剂粘合强度大于天线和RFID芯片之间的接合强度。

6. 发明授权

US07969067B2 Ultrasound probe 失效
标题翻译：超声探头
公开(公告)号：US07969067B2
公开(公告)日：2011-06-28
申请号：US12161962
申请日：2006-11-14
申请人： Takanori Aono , Tatsuya Nagata , Katsunori Asafusa , Takashi Kobayashi , Naoya Kanda
发明人： Takanori Aono , Tatsuya Nagata , Katsunori Asafusa , Takashi Kobayashi , Naoya Kanda
IPC分类号： H01L41/08
CPC分类号： G10K11/002 , A61B8/00
摘要： There is provided an ultrasound probe including a first substrate having a silicon substrate and an ultrasound transmit-receive element, an acoustic lens disposed over an upper surface of the first substrate, and a damping layer disposed under the first substrate, in which a second substrate is disposed between a lower surface of the first substrate and an upper surface of the damping layer, and the second substrate is made of a material having approximately the same linear expansion coefficient and acoustic impedance as the silicon substrate of the first substrate. With this structure, it is possible to provide the ultrasound probe which can prevent damage to the silicon substrate due to temperature change and has excellent transmission/reception performance and structure reliability while reducing noise by reflected waves in transmission and reception.
摘要翻译：提供一种超声波探头，其包括具有硅衬底和超声波发射接收元件的第一衬底，设置在第一衬底的上表面上的声透镜，以及设置在第一衬底下方的阻尼层，其中第二衬底设置在第一基板的下表面和阻尼层的上表面之间，第二基板由具有与第一基板的硅基板大致相同的线膨胀系数和声阻抗的材料制成。利用这种结构，可以提供能够防止由于温度变化而损坏硅基板的超声波探头，并且在发送和接收中减少反射波的噪声的同时具有优异的发送/接收性能和结构可靠性。

7. 发明授权

US07754581B2 Method for manufacturing a three-dimensional semiconductor device and a wafer used therein 有权
标题翻译：制造其中使用的三维半导体器件和晶片的方法
公开(公告)号：US07754581B2
公开(公告)日：2010-07-13
申请号：US11956560
申请日：2007-12-14
申请人： Hiroaki Ikeda , Masakazu Ishino , Hiroyuki Tenmei , Naoya Kanda , Yasuhiro Naka , Kunihiko Nishi
发明人： Hiroaki Ikeda , Masakazu Ishino , Hiroyuki Tenmei , Naoya Kanda , Yasuhiro Naka , Kunihiko Nishi
IPC分类号： H01L21/30
CPC分类号： H01L21/46 , H01L21/76898 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/50 , H01L2224/0361 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/11462 , H01L2224/1147 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16 , H01L2224/81205 , H01L2224/81801 , H01L2224/83194 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/15311 , H01L2224/11 , H01L2224/81 , H01L2924/00014 , H01L2224/13099
摘要： A method for manufacturing a semiconductor device includes the steps of forming first and second semiconductor wafers each including an array of chips and elongate electrodes, forming a groove on scribe lines separating the chips from one another; coating a surface of one of the semiconductor wafers with adhesive; bonding together the semiconductor wafers while allowing the groove to receive therein excessive adhesive; and heating the wafers to connect the elongate electrodes of both the semiconductor wafers.
摘要翻译：一种制造半导体器件的方法包括以下步骤：形成第一和第二半导体晶片，每个半导体晶片均包括芯片和细长电极阵列，在将芯片彼此分开的划线上形成凹槽; 用粘合剂涂覆其中一个半导体晶片的表面; 将半导体晶片粘合在一起，同时允许凹槽在其中容纳过多的粘合剂; 并加热晶片以连接两个半导体晶片的细长电极。

8. 发明申请

US20070007344A1 RFID tag and manufacturing method thereof 审中-公开
标题翻译： RFID标签及其制造方法
公开(公告)号：US20070007344A1
公开(公告)日：2007-01-11
申请号：US11478645
申请日：2006-07-03
申请人： Kosuke Inoue , Hiroshi Homma , Hitoshi Odashima , Naoya Kanda , Kie Ueda
发明人： Kosuke Inoue , Hiroshi Homma , Hitoshi Odashima , Naoya Kanda , Kie Ueda
IPC分类号： G06K7/00
CPC分类号： G06K19/0775 , G06K19/07749 , H01L24/75 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/7565 , H01L2224/81191 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： In an RFID (radio frequency identification) tag comprising an antenna formed of a conductive paste containing conductive filler like silver flakes on a base member, and an RFID chip connected to the antenna, the present invention cures a pattern of the antenna formed of the conductive paste, and then connects the RFID chip to the antenna with thermoplastic resin contained in the conductive paste by heating bump electrodes of the RFID chip in contact with the antenna. According to the present invention, Since the bump electrodes of the RFID chip and the antenna are connected to each other and establish sufficient electrical conduction therebetween without providing an anisotropic conductive sheet or the like therebetween, a highly reliable RFID tag is supplied at a low cost.
摘要翻译：在包含天线形成的RFID（射频识别）标签中，该天线由包含导电填料，如在基底构件上的银薄片形成的导电膏形成，以及连接到天线的RFID芯片，本发明固化由导电材料形成的天线的图案然后通过加热与天线接触的RFID芯片的凸起电极，将RFID芯片与包含在导电浆料中的热塑性树脂连接到天线。根据本发明，由于RFID芯片和天线的凸起电极彼此连接并且在它们之间建立足够的导电，而不在其间提供各向异性导电片等，所以以低成本提供高可靠性的RFID标签。

9. 发明申请

US20060249829A1 Stacked type semiconductor device 审中-公开
标题翻译：堆叠型半导体器件
公开(公告)号：US20060249829A1
公开(公告)日：2006-11-09
申请号：US11399608
申请日：2006-04-07
申请人： Mitsuaki Katagiri , Masanori Shibamoto , Tsutomu Hara , Koichiro Aoki , Naoya Kanda , Shuji Kikuchi , Hisashi Tanie
发明人： Mitsuaki Katagiri , Masanori Shibamoto , Tsutomu Hara , Koichiro Aoki , Naoya Kanda , Shuji Kikuchi , Hisashi Tanie
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L24/50 , H01L2225/06527 , H01L2225/06551 , H01L2225/06579 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , H01L2924/3011
摘要： A stacked type semiconductor device comprising: a baseboard having a terminal row formed at an end in which connecting terminals is arranged linearly and having a wiring pattern connected to the connecting terminals and external terminals; semiconductor chips having a pad row in which pads is arranged linearly in parallel to the terminal row and being stacked on the baseboard; and interposer boards having a wiring layer including a plurality of wires arranged in parallel with the same length for connecting between pads of the pad row and connecting terminals of the terminal row.
摘要翻译：一种叠层型半导体器件，包括：基板，其端部形成在端部，所述端子排连接端子线性布置，并且具有连接到所述连接端子和外部端子的布线图案; 具有垫排的半导体芯片，其中焊盘与端子排平行布置并且堆叠在基板上; 以及具有布线层的插入板，所述布线层包括以相同长度平行布置的多条布线，用于连接所述焊盘排的焊盘和所述端子排的连接端子。

10. 发明申请

US20060244121A1 Semiconductor device, manufacturing method thereof, and connection method of circuit board 失效
公开(公告)号：US20060244121A1
公开(公告)日：2006-11-02
申请号：US11412977
申请日：2006-04-28
申请人： Masanori Shibamoto , Masahiro Yamaguchi , Naoya Kanda
发明人： Masanori Shibamoto , Masahiro Yamaguchi , Naoya Kanda
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L24/97 , H01L25/50 , H01L2224/32225 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2225/06579 , H01L2924/15311
摘要： Cut pieces of a flexible tape respectively having positioning holes are superposed on a substrate having positioning holes, while positioning the substrate and the cut pieces by inserting a positioning pin into the positioning holes respectively, so that one side of the substrate faces one side of the cut pieces. Subsequently, internal terminals provided on the substrate are ultrasonically joined with internal terminals provided on the cut pieces by pressing an ultrasonic tool from the other side of the cut pieces. As a result, connection between these can be performed highly accurately. Further, since the internal terminals are ultrasonically joined with each other, operation time does not increase in proportion to the number of terminals, as in the connection using a bonding wire, and misregistration due to heat does not occur. Accordingly, connections between circuit boards are performed efficiently, highly accurately, and reliably.

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