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11. 发明申请

US20080248728A1 Method for manufacturing polishing pad, polishing pad, and method for polishing wafer 有权
标题翻译：制造抛光垫的方法，抛光垫和抛光晶片的方法
公开(公告)号：US20080248728A1
公开(公告)日：2008-10-09
申请号：US12078525
申请日：2008-04-01
申请人： Koichi Kanaya , Masayoshi Sekizawa , Naotaka Toyama
发明人： Koichi Kanaya , Masayoshi Sekizawa , Naotaka Toyama
IPC分类号： B24D11/00 , B24D18/00 , B24B1/00
CPC分类号： B24D18/00 , B24B37/20 , Y10T428/24992
摘要： There is disclosed a method for manufacturing a polishing pad that is formed of a urethane foam pad and attached to a turn table to polish a wafer, the method comprising at least steps of: slicing a urethane foam cake to provide the urethane foam pad; and performing press processing with respect to the urethane foam pad with a pressure of 15000 g/cm2 or above, a polishing pad manufactured by this method, and a method for polishing a wafer by using this polishing pad. There can be provided a method for manufacturing a polishing pad that can stably obtain a wafer with high flatness, etc.
摘要翻译：公开了一种用于制造由聚氨酯泡沫垫形成的抛光垫的方法，该抛光垫安装在转台上以抛光晶片，所述方法至少包括以下步骤：切割聚氨酯泡沫块以提供聚氨酯泡沫垫; 对该聚氨酯泡沫垫进行压力加工，压力为15000g / cm 2以上，通过该方法制造的研磨垫，以及使用该抛光垫来研磨晶片的方法。可以提供一种能够稳定地获得具有高平坦度等的晶片的抛光垫的制造方法。

12. 发明授权

US5784663A System for supervising an image forming apparatus from a remote computer via a communication control unit 失效
标题翻译：用于经由通信控制单元从远程计算机监视图像形成装置的系统
公开(公告)号：US5784663A
公开(公告)日：1998-07-21
申请号：US813592
申请日：1997-03-07
申请人： Masayuki Hayashi , Yoshihiro Mitekura , Koichi Kanaya , Masato Terao , Toshiya Tagawa , Nobuaki Tomidokoro , Masahiro Kitayama , Osamu Kizaki , Yasuo Kawada , Kazuyuki Nakahara , Tomofumi Harada , Yasunari Hashimoto
发明人： Masayuki Hayashi , Yoshihiro Mitekura , Koichi Kanaya , Masato Terao , Toshiya Tagawa , Nobuaki Tomidokoro , Masahiro Kitayama , Osamu Kizaki , Yasuo Kawada , Kazuyuki Nakahara , Tomofumi Harada , Yasunari Hashimoto
IPC分类号： G03G21/00 , G01R31/3185 , G03G15/00 , G06F11/273 , G06F11/34 , H04M11/00 , H04N1/00 , G03C15/00
CPC分类号： G06F11/2294 , G03G15/5079 , G06F11/0733 , G06F11/0748 , G01R31/318516 , G03G15/55 , G03G2215/00113 , G06F11/3485
摘要： A control system for collectively supervising a plurality of copiers or similar image forming apparatuses connected to a control device by communication lines with or without the intermediary of communication control units. To down-load data relating to image formation, the control device determines whether or not a copier of interest is in an inoperative state and, if it is in an inoperative state, automatically sends the data to the copier via a telephone line, an exchange, and a communication control unit. This data is written to storing means built in the copier. To up-load data relating to image formation, the control device causes each copier to automatically send the data stored in the storing means and stores the data in memory means. Up-loading is effected at an optimal time other than the time when the copier is performing an automatic adjustment, is in use, or is quite likely to be used.
摘要翻译：一种控制系统，用于通过具有或不具有通信控制单元的中介的通信线路来共同监督连接到控制设备的多个复印机或类似图像形成设备。为了下载与图像形成有关的数据，控制装置确定感兴趣的复印机是否处于非操作状态，并且如果它处于不工作状态，则经由电话线，交换机自动发送数据到复印机，以及通信控制单元。该数据被写入复印机内置的存储装置。为了加载与图像形成有关的数据，控制装置使每个复印机自动发送存储在存储装置中的数据并将数据存储在存储装置中。在复印机进行自动调整，正在使用或很有可能使用的时间以外的最佳时间进行上载。

13. 发明申请

US20090252942A1 Method for Manufacturing Epitaxial Wafer and Epitaxial Wafer 审中-公开
标题翻译：制造外延晶片和外延晶片的方法
公开(公告)号：US20090252942A1
公开(公告)日：2009-10-08
申请号：US12084627
申请日：2006-10-25
申请人： Koichi Kanaya , Masato Ohnishi
发明人： Koichi Kanaya , Masato Ohnishi
IPC分类号： B32B5/00 , C30B25/16 , C01B33/02
CPC分类号： C30B25/16 , C30B25/02 , C30B25/165 , C30B29/06 , H01L21/02381 , H01L21/02532 , H01L21/0262 , H01L21/02634
摘要： The present invention provides a method for manufacturing an epitaxial wafer by supplying a raw material gas onto a silicon wafer to perform vapor-phase growth of an epitaxial layer, wherein a thickness of the epitaxial layer that is formed at a peripheral portion of the silicon wafer is controlled by controlling a growth rate and/or a growth temperature of the epitaxial layer that is subjected to vapor-phase growth. As a result, there is provided the method that enables manufacturing an epitaxial wafer having a small roll-off value by controlling a thickness of an epitaxial layer near the outermost periphery at the time of epitaxial growth.
摘要翻译：本发明提供一种通过将原料气体供给到硅晶片上以进行外延层的气相生长来制造外延晶片的方法，其中形成在硅晶片的周边部分的外延层的厚度通过控制经历气相生长的外延层的生长速率和/或生长温度来控制。结果，提供了通过在外延生长时控制最外周附近的外延层的厚度，能够制造具有小滚降值的外延晶片的方法。

14. 发明授权

US5165675A Control means for guide members in an intermediate tray in a duplex copier 失效
标题翻译：用于双面复印机中的中间托盘中的引导构件的控制装置
公开(公告)号：US5165675A
公开(公告)日：1992-11-24
申请号：US849835
申请日：1992-03-12
申请人： Koichi Kanaya
发明人： Koichi Kanaya
IPC分类号： G03G15/00 , B41J13/00 , B65H83/02 , G03G15/23 , G03G21/14
CPC分类号： G03G15/23
摘要： A control device for a copier of the type loaded with a recyclic document feeder (RDF) and operable in a two-sided copy mode for producing two-sided copies by sequentially stacking one-sided paper sheets and refeeding them for transferring images on the other side thereof. In the two-sided copy mode, side fences provided on an intermediate tray are moved toward and away from each other in matching relation to the paper size. Even when the entry of a paper sheet in and the refeed of a paper sheet from the intermediate tray occur alternately, paper sheets entered the tray can be accurately controlled in position with no regard to the paper size.
摘要翻译：一种用于复印机的控制装置，其装载有循环文件馈送器（RDF），并且可以双面复印模式操作，以通过顺序地堆叠单面纸张并重新馈送以在另一张纸上传送图像来产生双面复印件侧。在双面复印模式中，设置在中间托盘上的侧挡板相对于纸张尺寸相互移动并彼此远离。即使当纸张进入纸页和中间纸盘的重新进纸交替出现时，进入纸盘的纸张也可以在不考虑纸张尺寸的情况下被准确地控制到位。

15. 发明授权

US5110113A Device for controlling sheet positioning on an intermediate tray 失效
标题翻译：用于在中间托盘上控制纸张定位的装置
公开(公告)号：US5110113A
公开(公告)日：1992-05-05
申请号：US561609
申请日：1990-08-01
申请人： Koichi Kanaya
发明人： Koichi Kanaya
IPC分类号： G03G15/00 , G03G15/23 , G03G21/00
CPC分类号： G03G15/234
摘要： A device for controlling positioning of a sheet carrying an image on one side thereof, or one-sided sheet, in a predetermined position on an intermediate tray of a copier which is operable in a two-sided copy mode. The one-sided sheet is positioned on the intermediate tray by a pair of side fences and a back fence. The side fences and the back fence each is driven by an exclusive pulse motor to move and stop at a position matching the size of the sheet. Particular amounts of displacement are assigned to each fence on a sheet size basis, and each is adjustable on the operation board of the copier.
摘要翻译：一种用于在双面复印模式下操作的复印机的中间托盘上的预定位置中控制在其一侧或单面纸上携带图像的纸张的定位的装置。单面纸通过一对侧栅栏和后围栏位于中间托盘上。侧围栏和后围栏各自由专用脉冲电机驱动，以在与片材尺寸相匹配的位置移动和停止。特定的位移量按照纸张尺寸分配给每个围栏，并且每个挡板可在复印机的操作板上调整。

16. 发明授权

US4976421A Paper feed control device for copier which determines the actual number of sheets remaining 失效
标题翻译：复印机的送纸控制装置，其确定剩余的实际张数
公开(公告)号：US4976421A
公开(公告)日：1990-12-11
申请号：US415476
申请日：1989-10-02
申请人： Koichi Kanaya
发明人： Koichi Kanaya
IPC分类号： B65H1/18 , B65H7/04
CPC分类号： B65H7/04 , B65H1/18 , B65H2511/152 , B65H2511/232 , B65H2553/51 , B65H2557/33
摘要： A paper feed control device for controlling a paper feed level, or height, to a predetermined level by moving up and down a tray which is loaded with a stack of papers by a motor. A proportional relation between the number of paper fed as counted by a paper counter and the number of encoder pulses which is associated with an amount of movement of the tray is calculated to determine how many pulse will appear before a near-paper-end condition is reached. Based on a result of the decision, the paper feed is controlled.

17. 发明授权

US08287331B2 Method for manufacturing polishing pad, and method for polishing wafer 有权
标题翻译：抛光垫的制造方法以及抛光晶片的方法
公开(公告)号：US08287331B2
公开(公告)日：2012-10-16
申请号：US12078525
申请日：2008-04-01
申请人： Koichi Kanaya , Masayoshi Sekizawa , Naotaka Toyama
发明人： Koichi Kanaya , Masayoshi Sekizawa , Naotaka Toyama
IPC分类号： B24B37/04 , B24B1/00
CPC分类号： B24D18/00 , B24B37/20 , Y10T428/24992
摘要： There is disclosed a method for manufacturing a polishing pad that is formed of a urethane foam pad and attached to a turn table to polish a wafer, the method comprising at least steps of: slicing a urethane foam cake to provide the urethane foam pad; and performing press processing with respect to the urethane foam pad with a pressure of 15000 g/cm2 or above, a polishing pad manufactured by this method, and a method for polishing a wafer by using this polishing pad. There can be provided a method for manufacturing a polishing pad that can stably obtain a wafer with high flatness, etc.
摘要翻译：公开了一种用于制造由聚氨酯泡沫垫形成的抛光垫的方法，该抛光垫安装在转台上以抛光晶片，所述方法至少包括以下步骤：切割聚氨酯泡沫块以提供聚氨酯泡沫垫; 对该聚氨酯泡沫垫进行冲压加工，压力为15000g / cm 2以上，通过该方法制造的研磨垫，以及使用该抛光垫对晶片进行研磨的方法。可以提供一种能够稳定地获得具有高平坦度等的晶片的抛光垫的制造方法。

18. 发明授权

US07591908B2 Vapor deposition apparatus and vapor deposition method 有权
标题翻译：蒸镀装置及气相沉积法
公开(公告)号：US07591908B2
公开(公告)日：2009-09-22
申请号：US10565653
申请日：2004-04-26
申请人： Koichi Kanaya , Toru Otsuka , Takao Kanno
发明人： Koichi Kanaya , Toru Otsuka , Takao Kanno
IPC分类号： C23C16/00 , C23F1/00 , H01L21/306
CPC分类号： H01L21/68735 , C30B25/12 , C30B29/06
摘要： In a vapor phase growth apparatus for performing a vapor phase growth of a silicon epitaxial layer on a main surface of a silicon single crystal substrate while heating the silicon single crystal substrate placed on a pocket formed on a susceptor, from both sides, the pocket has an outer peripheral side part which supports a rear surface of the silicon single crystal substrate and an inner peripheral side part which is kept in a state of being more recessed than the outer peripheral side part in the inside of the outer peripheral side part, and the susceptor has a warped inverted U-shaped longitudinal sectional shape.
摘要翻译：在气相生长装置中，在两面均加热形成在基座上的凹穴上的硅单晶衬底的同时，在硅单晶衬底的主表面上进行硅外延层的气相生长，支撑硅单晶基板的后表面的外周侧部分和保持在外周侧部分的内侧比外周侧凹陷的状态的内周侧部分，并且基座具有翘曲的倒U形纵截面形状。

19. 发明申请

US20090039581A1 Holding Gripper and Holding Method for Semiconductor Wafer and Shape Measuring Apparatus 有权
标题翻译：用于半导体晶片和形状测量装置的夹持和夹持方法
公开(公告)号：US20090039581A1
公开(公告)日：2009-02-12
申请号：US11885189
申请日：2006-03-09
申请人： Masato Onishi , Koichi Kanaya
发明人： Masato Onishi , Koichi Kanaya
IPC分类号： B23Q1/26 , B25B5/14
CPC分类号： H01L21/68707 , H01L21/67288 , H01L21/683
摘要： The present invention provides a strip-like holding gripper which holds a semiconductor wafer when measuring a shape of the semiconductor wafer, wherein a side where the semiconductor wafer is held has a round shape, a groove which holds an edge of the semiconductor wafer along a side surface of the round shape portion is provided on the side surface, and the groove comes into contact with the edge of the semiconductor wafer from a periphery of the wafer to hold the semiconductor wafer. As a result, it is possible to provide the gripper, which can stably hold the wafer in a fixed state even if the gripper is inclined when holding the wafer, a holding method, and a shape measuring apparatus.
摘要翻译：本发明提供了一种条状保持夹持器，其在测量半导体晶片的形状时保持半导体晶片，其中保持半导体晶片的一侧具有圆形形状，沿着半导体晶片的边缘保持半导体晶片的边缘圆形部分的侧表面设置在侧表面上，并且槽从晶片的周边与半导体晶片的边缘接触以保持半导体晶片。结果，即使在保持晶片时夹具倾斜的情况下，也可以提供能够将晶片稳定地保持在固定状态的夹持器，保持方法和形状测量装置。

20. 发明授权

US06958094B2 Single crystal cutting method 有权
标题翻译：单晶切割方法
公开(公告)号：US06958094B2
公开(公告)日：2005-10-25
申请号：US10332433
申请日：2001-07-06
申请人： Tadahiro Ohmi , Shigetoshi Sugawa , Toshikuni Shinohara , Tatsuo Ito , Koichi Kanaya
发明人： Tadahiro Ohmi , Shigetoshi Sugawa , Toshikuni Shinohara , Tatsuo Ito , Koichi Kanaya
IPC分类号： B23K26/00 , B23K26/06 , B23K26/12 , B23K26/40 , B28D1/22 , H01L21/304 , C30B25/12 , C30B25/14
CPC分类号： H01L21/304 , B23K26/0624 , B23K26/12 , B23K26/123 , B23K26/127 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D1/221
摘要： The present invention provides a method for slicing a single crystal, wherein the single crystal is sliced by irradiating a portion to be sliced with an ultra short pulse laser beam while supplying a gas containing gaseous molecules or radicals that react with atoms constituting the single crystal to become stable gaseous molecules in the vicinity of the portion under slicing. Thus, there is provided a method for slicing a single crystal by using a laser processing, in which a single crystal is processed while obtaining a good sliced surface and markedly reducing a slicing loss.
摘要翻译：本发明提供一种单晶切片方法，其中通过用超短脉冲激光束照射待切片的部分，同时将包含与构成单晶的原子反应的气态分子或自由基的气体供给到在切片部分附近成为稳定的气态分子。因此，提供了一种通过使用激光处理来切割单晶的方法，其中在获得良好的切片表面的同时处理单晶并显着降低切片损耗。

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