专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20080264684A1 Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same 审中-公开
标题翻译：用于发送电路的载体构件，使用载体构件的无芯印刷电路板及其制造方法
公开(公告)号：US20080264684A1
公开(公告)日：2008-10-30
申请号：US12003669
申请日：2007-12-28
申请人： Myung Sam Kang , Byoung Youl Min , Je Gwang Yoo , Jung Hyun Park , Chang Sup Ryu , Jin Yong Ahn
发明人： Myung Sam Kang , Byoung Youl Min , Je Gwang Yoo , Jung Hyun Park , Chang Sup Ryu , Jin Yong Ahn
IPC分类号： H05K3/10 , H05K1/00 , H05K1/11
CPC分类号： H05K3/428 , H05K3/205 , H05K3/383 , H05K3/384 , H05K3/4602 , H05K3/4658 , H05K2201/0394 , H05K2201/09563 , H05K2203/1536 , Y10T29/49155
摘要： Disclosed herein is a carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.
摘要翻译：本文公开了一种用于传输电路的载体构件，其是具有嵌入其中的电路图案的无芯印刷电路板的部件，其可用于通过仅在下部形成突起来提供高密度和高可靠性的印刷电路板电路图案的端部，使用载体部件的无芯印刷电路板，以及制造载体部件和无芯印刷电路板的方法。

12. 发明授权

US07408120B2 Printed circuit board having axially parallel via holes 有权
标题翻译：具有轴向平行通孔的印刷电路板
公开(公告)号：US07408120B2
公开(公告)日：2008-08-05
申请号：US11042360
申请日：2005-01-24
申请人： Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Han Kim
发明人： Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Han Kim
IPC分类号： H01R12/04
CPC分类号： H05K1/115 , H05K3/429 , H05K3/4602 , H05K2201/09536 , H05K2201/096 , H05K2201/09809
摘要： Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole.
摘要翻译：公开了一种PCB，其具有轴向平行的通孔，其中用作接地的外部接地通孔围绕用于PCB中的电路连接的通孔形成，从而最小化由通孔引起的噪声的影响。

13. 发明授权

US07326858B2 Printed circuit board with embedded capacitors and manufacturing method thereof 失效
标题翻译：具有嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US07326858B2
公开(公告)日：2008-02-05
申请号：US10731246
申请日：2003-12-10
申请人： Seok-Kyu Lee , Byoung-Youl Min , Hyun-Ju Jin , Jang-Kyu Kang
发明人： Seok-Kyu Lee , Byoung-Youl Min , Hyun-Ju Jin , Jang-Kyu Kang
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H05K3/382 , H05K3/429 , H05K3/4652 , H05K2201/0209 , H05K2201/0355 , H05K2201/093 , H05K2201/09309 , H05K2201/09509 , H05K2201/09663 , H05K2201/09718
摘要： Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner layer of the printed circuit board and then semi-dried to a state of B-stage.
摘要翻译：公开了一种印刷电路板，其通过将包含高介电常数的聚合物电容器浆料的电容器包埋在印刷电路板的内层上，然后半干燥至B级的状态而在高容量方面是有利的。

14. 发明申请

US20070132536A1 Printed circuit board having embedded electronic components and manufacturing method thereof 失效
标题翻译：具有嵌入式电子部件的印刷电路板及其制造方法
公开(公告)号：US20070132536A1
公开(公告)日：2007-06-14
申请号：US11637664
申请日：2006-12-13
申请人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
发明人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
IPC分类号： H01F5/00
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/0657 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/2919 , H01L2224/32245 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2224/92244 , H01L2225/06524 , H01L2225/06589 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H01L2924/3511 , H05K1/056 , H05K3/4608 , H05K2201/10515 , Y10T29/4913 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.
摘要翻译：公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度因为电子部件安装在芯片的两侧。

15. 发明授权

US06910266B2 Printed circuit board with embedded capacitors therein, and process for manufacturing the same 失效
标题翻译：具有嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US06910266B2
公开(公告)日：2005-06-28
申请号：US10609618
申请日：2003-07-01
申请人： Seok-Kyu Lee , Jang-Kyu Kang , Hyun-Ju Jin , Byoung-Youl Min
发明人： Seok-Kyu Lee , Jang-Kyu Kang , Hyun-Ju Jin , Byoung-Youl Min
IPC分类号： H05K3/46 , H05K1/16 , H05K3/00 , H05K3/42 , H05K3/30
CPC分类号： H05K1/162 , H05K3/0023 , H05K3/429 , H05K3/4652 , H05K3/4661 , H05K2201/0187 , H05K2201/0209 , H05K2203/0568 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155
摘要： Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating photoresist dry films to a copper clad FR-4, exposing to light and developing the dry films, and etching copper foils of the copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a capacitor paste to the etched regions and curing the capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless copper plating process to form copper foil layers for top electrodes; v) laminating photosensitive dry films to the copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the copper foil layers where the top electrodes are to be formed; and vi) etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.
摘要翻译：这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。制造具有嵌入式电容器的印刷电路板的方法包括以下步骤：i）将光致抗蚀剂干膜层压到铜包覆FR-4上，曝光并显影干膜，并蚀刻铜包覆FR- 4以形成用于形成电容器的底部电极; ii）将感光绝缘树脂施加到底部电极的表面，并暴露于光和显影以蚀刻感光绝缘树脂; iii）将电容器膏施加到蚀刻区域并固化电容器糊; iv）使用化学镀铜工艺电镀固化的电容器浆料和感光绝缘树脂的上部区域，以形成用于顶部电极的铜箔层; v）将感光性干膜层压到用于顶部电极的铜箔层上，暴露于光并显影感光干膜以蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域; 以及vi）蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域，并且除去形成在顶部电极上的干膜，使得电容器糊料离散地位于顶部电极和底部电极形成分立电容。

16. 发明授权

US08143727B2 Adhesive on wire stacked semiconductor package 有权
标题翻译：粘合剂在线堆叠半导体封装
公开(公告)号：US08143727B2
公开(公告)日：2012-03-27
申请号：US12927533
申请日：2010-11-16
申请人： Kwang Seok Oh , Jong Wook Park , Young Kuk Park , Byoung Youl Min
发明人： Kwang Seok Oh , Jong Wook Park , Young Kuk Park , Byoung Youl Min
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/28 , H01L23/02
CPC分类号： H01L24/85 , H01L23/13 , H01L23/16 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48472 , H01L2224/48479 , H01L2224/48599 , H01L2224/48699 , H01L2224/73265 , H01L2224/85051 , H01L2224/85986 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01057 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85186 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.
摘要翻译：半导体封装及其制造方法具有基板。第一半导体芯片耦合到衬底的表面。第一半导体芯片本质上具有基本平坦的第一和第二表面。粘合剂层耦合到第一半导体芯片的第二表面。进一步提供第二半导体芯片，其具有基本上平坦的第一表面和第二表面。绝缘体耦合到第二半导体芯片的第一表面，以防止引线短路。第二半导体芯片通过耦合到其第一表面的绝缘体耦合到粘合剂层。

17. 发明申请

US20110115121A1 Method of manufacturing heat radiation substrate having metal core 有权
公开(公告)号：US20110115121A1
公开(公告)日：2011-05-19
申请号：US12926864
申请日：2010-12-14
申请人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
发明人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
IPC分类号： B29C45/00 , B82Y30/00
CPC分类号： H05K1/056 , B82Y10/00 , H01L21/486 , H01L21/4871 , H01L23/3677 , H01L23/373 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20481 , H05K2201/026 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24917
摘要： A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

18. 发明授权

US07888599B2 Printed circuit board including embedded capacitor and method of fabricating same 有权
标题翻译：包括嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US07888599B2
公开(公告)日：2011-02-15
申请号：US12203081
申请日：2008-09-02
申请人： Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Woo Lim Chae , Han Kim
发明人： Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Woo Lim Chae , Han Kim
IPC分类号： H05K1/00
CPC分类号： H05K1/162 , H05K3/0047 , H05K3/427 , H05K2201/0187 , H05K2201/09645 , H05K2201/09836 , H05K2201/09981 , H05K2203/1476 , Y10T29/49155 , Y10T29/49156
摘要： Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.
摘要翻译：公开了一种包括嵌入式电容器的PCB及其制造方法。长的嵌入式电容器通过绝缘层形成，使得高电容和各种电容设计成为可能。

19. 发明授权

US5841291A Exchangeable membrane probe testing of circuits 失效
标题翻译：电路可交换膜探针测试
公开(公告)号：US5841291A
公开(公告)日：1998-11-24
申请号：US764511
申请日：1996-12-12
申请人： Ken Kuang-Fu Liu , Byoung-Youl Min , Robert John Moti , Syed A. Husain
发明人： Ken Kuang-Fu Liu , Byoung-Youl Min , Robert John Moti , Syed A. Husain
IPC分类号： G01R1/073 , H01L21/66 , G01R31/02
CPC分类号： G01R1/0735
摘要： First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester structure. Second and third conductive regions are electrically connected respectively to the power and ground terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region to filter high-frequency noise components from power and ground potentials provided by the power source.
摘要翻译：沿着沿着由柔性基板传导的导电的第一和第二位置电连接的第一和第二凸起分别被定向成与被测试的模具的焊盘和测试器结构的焊盘接触。第二和第三导电区域分别电连接到电源和电气设备的电源和接地端子。第二和第三区域与第一导电区域间隔开，以将高频噪声分量与由电源提供的功率和地电位进行滤波。

20. 发明申请

US20110089564A1 ADHESIVE ON WIRE STACKED SEMICONDUCTOR PACKAGE 有权
标题翻译：电线堆叠半导体封装
公开(公告)号：US20110089564A1
公开(公告)日：2011-04-21
申请号：US12927533
申请日：2010-11-16
申请人： Kwang Seok Oh , Jong Wook Park , Young Kuk Park , Byoung Youl Min
发明人： Kwang Seok Oh , Jong Wook Park , Young Kuk Park , Byoung Youl Min
IPC分类号： H01L23/498
CPC分类号： H01L24/85 , H01L23/13 , H01L23/16 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48472 , H01L2224/48479 , H01L2224/48599 , H01L2224/48699 , H01L2224/73265 , H01L2224/85051 , H01L2224/85986 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01057 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85186 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.
摘要翻译：半导体封装及其制造方法具有基板。第一半导体芯片耦合到衬底的表面。第一半导体芯片本质上具有基本平坦的第一和第二表面。粘合剂层耦合到第一半导体芯片的第二表面。进一步提供第二半导体芯片，其具有基本上平坦的第一表面和第二表面。绝缘体耦合到第二半导体芯片的第一表面，以防止引线短路。第二半导体芯片通过耦合到其第一表面的绝缘体耦合到粘合剂层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式