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1. 发明授权

US11646246B2 Method of fabricating a glass substrate with a plurality of vias 有权
公开(公告)号：US11646246B2
公开(公告)日：2023-05-09
申请号：US16461970
申请日：2017-11-17
申请人： SAMTEC INC.
发明人： Tim Mobley , Roupen Leon Keusseyan
IPC分类号： H01L29/40 , H01L29/06 , H01L23/48 , H01L21/00 , H01K3/10 , H01L23/15 , H01L23/498 , H05K3/40 , H05K3/46 , H05K3/10 , H01L21/48 , C03C4/14 , C03C8/04 , C03C8/18 , H01B1/22 , H05K1/16 , H05K1/03 , H05K1/09 , H05K3/42 , H05K3/00 , H01L23/367
CPC分类号： H01L23/481 , C03C4/14 , C03C8/04 , C03C8/18 , H01B1/22 , H01L21/486 , H01L23/15 , H01L23/49827 , H01L23/49883 , H05K3/101 , H05K3/102 , H05K3/107 , H05K3/4061 , H05K3/4076 , H05K3/4614 , H05K3/4629 , C03C2204/00 , C03C2205/00 , H01L23/367 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H05K1/0306 , H05K1/095 , H05K1/097 , H05K1/16 , H05K1/162 , H05K1/167 , H05K3/0029 , H05K3/403 , H05K3/423 , H05K2201/0272 , H05K2201/0391 , H05K2201/068 , H05K2201/09254 , H05K2201/09836 , H05K2201/09854 , H05K2201/1006 , H05K2203/0182 , H05K2203/107 , H05K2203/1126 , H05K2203/1131 , H05K2203/1461 , H05K2203/1476
摘要： Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

2. 发明授权

US10014244B2 Through-hole electrode substrate 有权
公开(公告)号：US10014244B2
公开(公告)日：2018-07-03
申请号：US15214532
申请日：2016-07-20
申请人： Dai Nippon Printing Co., Ltd.
发明人： Takamasa Takano
IPC分类号： H05K1/16 , H01L23/498 , H01L21/48 , H01L21/768 , H01L23/14 , H01L23/48 , H05K1/11 , H05K3/42 , H01L23/00 , H05K3/44
CPC分类号： H01L23/49827 , H01L21/486 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49833 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L24/17 , H01L2224/05647 , H01L2224/16225 , H01L2224/16235 , H01L2924/01024 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/15747 , H01L2924/15786 , H01L2924/1579 , H05K1/113 , H05K3/426 , H05K3/445 , H05K2201/09436 , H05K2201/09581 , H05K2201/09609 , H05K2201/09836 , H05K2201/09854 , H05K2201/10378 , H05K2203/0733 , H05K2203/1178 , Y10T29/49117 , Y10T29/49124 , Y10T29/49165
摘要： A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.

3. 发明授权

US09961768B2 Multilayer wiring substrate, manufacturing method therefor, and substrate for probe card 有权
公开(公告)号：US09961768B2
公开(公告)日：2018-05-01
申请号：US14919058
申请日：2015-10-21
申请人： Murata Manufacturing Co., Ltd.
发明人： Yoshihito Otsubo , Toru Meguro , Tatsunori Kan
IPC分类号： H05K1/00 , H05K1/09 , H05K1/11 , H05K3/40 , H05K3/46 , H05K1/02 , H05K3/00 , H05K3/42 , H01L23/498 , H01L21/48 , H05K3/34
CPC分类号： H05K1/09 , H01L21/4867 , H01L23/49822 , H01L2224/16225 , H01L2924/0002 , H01L2924/19105 , H05K1/0298 , H05K1/112 , H05K1/115 , H05K3/0058 , H05K3/3436 , H05K3/4038 , H05K3/4084 , H05K3/42 , H05K3/4629 , H05K3/4644 , H05K3/4667 , H05K2201/0376 , H05K2201/0382 , H05K2201/09545 , H05K2201/09627 , H05K2201/09836 , H05K2201/09845 , H05K2201/1006 , H05K2203/0278 , H05K2203/063 , H05K2203/068 , H05K2203/1126 , H01L2924/00
摘要： A multilayer wiring substrate that can realize a higher-density wiring structure is obtained. Provided is a multilayer wiring substrate, where a multilayer body including a first insulating layer and a second insulating layer stacked on the bottom surface of the first insulating layer includes printed wiring electrodes; the printed wiring electrodes are formed by printing with and sintering conductive paste; the printed wiring electrodes respectively include first wiring electrode portions located on the second insulating layer and second wiring electrode portions respectively joined to first wiring electrode portions; and the second wiring electrode portions respectively extend into through holes and, further, are exposed at the top surface of the first insulating layer.

4. 发明申请

US20160242290A1 BUS BAR PLATE, ELECTRONIC COMPONENT UNIT, AND WIRE HARNESS 有权
标题翻译：总线板，电子元件单元和线束
公开(公告)号：US20160242290A1
公开(公告)日：2016-08-18
申请号：US15041104
申请日：2016-02-11
申请人： Yazaki Corporation
发明人： Akemi MAEBASHI , Pharima AKANITSUK
IPC分类号： H05K1/18
CPC分类号： H05K3/3447 , H05K2201/09818 , H05K2201/09827 , H05K2201/09836 , H05K2201/09845 , H05K2201/10272
摘要： An electronic component unit and a wire harness are provided with a bus bar plate. The bus bar plate is provided with a metallic bus bar that is built in a resin material, and including a through-hole in which a terminal of a relay mounted on a mounting surface is soldered. The through-hole is provided with a bus bar through-hole which penetrates the bus bar, and a resin material through-hole which penetrates the resin material and is formed to be larger than the bus bar through-hole to expose the surface of the bus bar. When an inner diameter of the bus bar through-hole is defined as r and an inner diameter of the resin material through-hole is defined as R, 1.5r≦R is satisfied.
摘要翻译：电子元件单元和线束设有汇流条板。汇流条板设置有内置在树脂材料中的金属汇流条，并且包括安装在安装表面上的继电器的端子被焊接在其中的通孔。通孔设有贯穿母线的汇流条通孔，以及穿过树脂材料形成为比母线通孔大的树脂材料通孔，露出该母线的表面母线。当汇流条通孔的内径被定义为r并且树脂材料通孔的内径被定义为R时，满足1.5r≤R。

5. 发明授权

US09029711B2 Method for manufacturing a printed wiring board having a through-hole conductor 有权
标题翻译：一种具有通孔导体的印刷电路板的制造方法
公开(公告)号：US09029711B2
公开(公告)日：2015-05-12
申请号：US13242166
申请日：2011-09-23
申请人： Tomoyuki Ikeda
发明人： Tomoyuki Ikeda
IPC分类号： H05K1/03 , H05K1/11 , H05K3/00 , H05K3/42
CPC分类号： H05K3/0026 , C25D5/02 , H05K1/119 , H05K3/0032 , H05K3/0094 , H05K3/422 , H05K3/423 , H05K3/427 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126
摘要： A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.
摘要翻译：一种制造印刷电路板的方法，包括：提供具有第一和第二表面的绝缘树脂基板，在第一表面上照射激光，使得形成在第一表面上具有开口并向内逐渐变细的第一开口部分，在第二表面上照射激光形成第二开口部，该第二开口部在第二面上形成有向内侧逐渐变细并且与第一开口部连通的第二开口部，形成有具有第一开口部和第二开口部的贯通孔，在内部形成无电解电镀膜并且在所述化学镀膜上形成电解镀膜，使得在所述贯通孔中形成贯通孔导体结构。第一部分的开口具有相对于第二开口部分的开口偏心的重心轴线。

6. 发明授权

US08544169B2 Method of manufacturing a through-hole electrode substrate 有权
标题翻译：制造通孔电极基板的方法
公开(公告)号：US08544169B2
公开(公告)日：2013-10-01
申请号：US12875644
申请日：2010-09-03
申请人： Takamasa Takano
发明人： Takamasa Takano
IPC分类号： H01K3/10
CPC分类号： H01L23/49827 , H01L21/486 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49833 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L24/17 , H01L2224/16225 , H01L2224/16235 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/15747 , H01L2924/15786 , H01L2924/1579 , H05K1/113 , H05K3/426 , H05K3/445 , H05K2201/09436 , H05K2201/09581 , H05K2201/09609 , H05K2201/09836 , H05K2201/09854 , H05K2201/10378 , H05K2203/0733 , H05K2203/1178 , Y10T29/49117 , Y10T29/49124 , Y10T29/49165 , H01L2224/05647 , H01L2924/01024 , H01L2924/01079
摘要： A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.
摘要翻译：一种制造通孔电极基板的方法包括在基板上形成多个通孔，通过在多个通孔中填充导电材料形成多个通孔电极，在一个通孔上形成第一绝缘层在所述第一绝缘层上形成多个第一开口，所述多个第一开口将与所述多个通孔电极中的每一个相对应的多个通孔电极暴露在所述第一绝缘层上，并且使用所述关系来校正所述多个第一开口的位置在多个通孔中的倾斜通孔的打开位置的测量距离值的偏移量与多个通孔中的倾斜通孔的打开位置的设计距离值之间，相对于基板的中心位置。

7. 发明申请

US20130093308A1 ORGANIC EL ILLUMINATION DEVICE 有权
标题翻译：有机EL照明设备
公开(公告)号：US20130093308A1
公开(公告)日：2013-04-18
申请号：US13643955
申请日：2011-04-27
申请人： Akihito Kagotani , Makoto Arisawa , Hideki Kamada
发明人： Akihito Kagotani , Makoto Arisawa , Hideki Kamada
IPC分类号： H05B33/06 , H05B33/04 , H05B33/02
CPC分类号： H05B33/06 , B32B17/10036 , B32B17/10541 , F21V29/74 , F21V29/89 , F21Y2105/00 , F21Y2115/20 , H01L51/5203 , H01L51/524 , H01L51/5253 , H01L51/529 , H01L2251/5361 , H05B33/02 , H05B33/04 , H05K1/14 , H05K3/323 , H05K3/361 , H05K2201/041 , H05K2201/09027 , H05K2201/09836 , H05K2201/10128
摘要： Disclosed is an organic EL illumination device—which is provided with: an organic EL element (13) on a glass substrate (10); and a plurality of anode terminal electrodes (11) and cathode terminal electrodes (12) for evenly supplying current to the aforementioned organic EL element (13) on the aforementioned glass substrate (10)—wherein the organic EL illumination device is provided with a wiring board (1) to which a circuit having anode wiring (1a) corresponding to the position of each of the aforementioned anode terminal electrodes (11), and a circuit having cathode wiring (1b) corresponding to the position of each of the aforementioned cathode terminal electrodes (12) are formed.
摘要翻译：公开了一种有机EL照明装置，其设置有：玻璃基板（10）上的有机EL元件（13）。以及用于向上述玻璃基板（10）上的上述有机EL元件（13）均匀地供给电流的多个阳极端子电极（11）和阴极端子电极（12），在有机EL照明装置中设置有布线具有与上述阳极端子电极（11）的位置对应的阳极配线（1a）的电路的电路板（1）和与上述阴极端子的位置对应的阴极配线（1b）的电路形成电极（12）。

8. 发明申请

US20120261177A1 DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD 审中-公开
标题翻译：装置包装结构和装置包装方法
公开(公告)号：US20120261177A1
公开(公告)日：2012-10-18
申请号：US13452362
申请日：2012-04-20
申请人： Satoshi YAMAMOTO , Hiroyuki HIRANO , Takanao SUZUKI
发明人： Satoshi YAMAMOTO , Hiroyuki HIRANO , Takanao SUZUKI
IPC分类号： H05K1/11 , H01K3/10
CPC分类号： H01L21/486 , H01L23/3107 , H01L23/49827 , H01L25/0657 , H01L2224/16225 , H01L2225/06517 , H01L2225/06572 , H01L2225/06589 , H01L2924/09701 , H01L2924/1461 , H05K1/113 , H05K3/101 , H05K2201/09263 , H05K2201/09836 , H05K2201/10545 , Y10T29/49165 , H01L2924/00
摘要： Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface.
摘要翻译：本发明提供一种器件封装结构，其特征在于，包括：内插基板，具有基板和形成在从第一主面朝向第二主面的贯穿基板的多个通孔内形成的多个通孔布线，所述第一主面作为基板的一个主表面，第二主表面是其另一个主表面; 第一装置，其包括多个电极，并且被布置成使得这些电极面对第一主表面; 以及第二装置，其包括多个电极，其布置与第一装置的每个电极的布置不同，并且被布置成使得这些电极面对第二主表面。

9. 发明申请

US20120175155A1 Printed Wiring Board And A Method Of Production Thereof 有权
标题翻译：印刷接线板及其生产方法
公开(公告)号：US20120175155A1
公开(公告)日：2012-07-12
申请号：US13422884
申请日：2012-03-16
申请人： Tomoyuki IKEDA
发明人： Tomoyuki IKEDA
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： H05K3/0026 , C25D5/02 , H05K1/119 , H05K3/0032 , H05K3/0094 , H05K3/422 , H05K3/423 , H05K3/427 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126
摘要： A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.
摘要翻译：印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体。所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。

10. 发明授权

US08076591B2 Circuit boards 失效
标题翻译：电路板
公开(公告)号：US08076591B2
公开(公告)日：2011-12-13
申请号：US11794652
申请日：2005-12-22
申请人： Martin Joseph Agnew , Gary David Panaghiston , Murray Jerel Niman , Nicholas Chandler
发明人： Martin Joseph Agnew , Gary David Panaghiston , Murray Jerel Niman , Nicholas Chandler
IPC分类号： H01B17/04
CPC分类号： H05K1/0218 , H05K1/142 , H05K1/144 , H05K1/145 , H05K3/368 , H05K3/403 , H05K2201/0397 , H05K2201/0715 , H05K2201/0919 , H05K2201/09836
摘要： The invention relates to circuit boards and to screening circuits and components on such boards from stray rf interference when they are mounted as arrays or stacks of such circuit boards. The circuit boards (12, 14) are individually screened by conductive screening layers (16, 18) as known in the art and the individual screening layers are coupled together by layered interconnects (34) which connect corresponding screening layers (16, 18) of the individual circuit boards (12, 14) together, instead of by vias.
摘要翻译：本发明涉及电路板，并且当这些电路板被安装为这种电路板的阵列或叠层时，将这些电路板上的电路和组件从杂散干扰中筛选出来。电路板（12,14）由本领域已知的导电屏蔽层（16,18）单独地屏蔽，并且单独的屏蔽层通过分层互连（34）耦合在一起，分层互连（34）将相应的屏蔽层（16,18）各个电路板（12,14）组合在一起，而不是通孔。

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