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1. 发明授权

US07326858B2 Printed circuit board with embedded capacitors and manufacturing method thereof 失效
标题翻译：具有嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US07326858B2
公开(公告)日：2008-02-05
申请号：US10731246
申请日：2003-12-10
申请人： Seok-Kyu Lee , Byoung-Youl Min , Hyun-Ju Jin , Jang-Kyu Kang
发明人： Seok-Kyu Lee , Byoung-Youl Min , Hyun-Ju Jin , Jang-Kyu Kang
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H05K3/382 , H05K3/429 , H05K3/4652 , H05K2201/0209 , H05K2201/0355 , H05K2201/093 , H05K2201/09309 , H05K2201/09509 , H05K2201/09663 , H05K2201/09718
摘要： Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner layer of the printed circuit board and then semi-dried to a state of B-stage.
摘要翻译：公开了一种印刷电路板，其通过将包含高介电常数的聚合物电容器浆料的电容器包埋在印刷电路板的内层上，然后半干燥至B级的状态而在高容量方面是有利的。

2. 发明授权

US06910266B2 Printed circuit board with embedded capacitors therein, and process for manufacturing the same 失效
标题翻译：具有嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US06910266B2
公开(公告)日：2005-06-28
申请号：US10609618
申请日：2003-07-01
申请人： Seok-Kyu Lee , Jang-Kyu Kang , Hyun-Ju Jin , Byoung-Youl Min
发明人： Seok-Kyu Lee , Jang-Kyu Kang , Hyun-Ju Jin , Byoung-Youl Min
IPC分类号： H05K3/46 , H05K1/16 , H05K3/00 , H05K3/42 , H05K3/30
CPC分类号： H05K1/162 , H05K3/0023 , H05K3/429 , H05K3/4652 , H05K3/4661 , H05K2201/0187 , H05K2201/0209 , H05K2203/0568 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155
摘要： Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating photoresist dry films to a copper clad FR-4, exposing to light and developing the dry films, and etching copper foils of the copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a capacitor paste to the etched regions and curing the capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless copper plating process to form copper foil layers for top electrodes; v) laminating photosensitive dry films to the copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the copper foil layers where the top electrodes are to be formed; and vi) etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.
摘要翻译：这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。制造具有嵌入式电容器的印刷电路板的方法包括以下步骤：i）将光致抗蚀剂干膜层压到铜包覆FR-4上，曝光并显影干膜，并蚀刻铜包覆FR- 4以形成用于形成电容器的底部电极; ii）将感光绝缘树脂施加到底部电极的表面，并暴露于光和显影以蚀刻感光绝缘树脂; iii）将电容器膏施加到蚀刻区域并固化电容器糊; iv）使用化学镀铜工艺电镀固化的电容器浆料和感光绝缘树脂的上部区域，以形成用于顶部电极的铜箔层; v）将感光性干膜层压到用于顶部电极的铜箔层上，暴露于光并显影感光干膜以蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域; 以及vi）蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域，并且除去形成在顶部电极上的干膜，使得电容器糊料离散地位于顶部电极和底部电极形成分立电容。

3. 发明授权

US07570491B2 Printed circuit board with embedded capacitors therein, and process for manufacturing the same 失效
标题翻译：具有嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US07570491B2
公开(公告)日：2009-08-04
申请号：US10728591
申请日：2003-12-04
申请人： Seok-Kyu Lee , Byoung-Youl Min , Chang-Hyun Nam , Hyun-Ju Jin , Jang-Kyu Kang
发明人： Seok-Kyu Lee , Byoung-Youl Min , Chang-Hyun Nam , Hyun-Ju Jin , Jang-Kyu Kang
IPC分类号： H05K1/02 , H05K1/16
CPC分类号： H05K1/162 , H05K3/4652 , H05K2201/0187 , H05K2201/0209 , H05K2201/0355 , H05K2201/0358 , H05K2201/09509 , H05K2203/1461
摘要： Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.
摘要翻译：这里公开了一种其中具有嵌入式电容器的印刷电路板，其包括填充有由BaTiO 3和环氧树脂的复合材料组成的高介电聚合物电容器糊的内部通孔，以及用于制造印刷电路板的工艺。

4. 发明申请

US20050199681A1 Printed circuit board with embedded capacitors therein, and process for manufacturing the same 有权
标题翻译：具有嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US20050199681A1
公开(公告)日：2005-09-15
申请号：US11117315
申请日：2005-04-29
申请人： Seok-Kyu Lee , Jang-Kyu Kang , Hyun-Ju Jin , Byoung-Youl Min
发明人： Seok-Kyu Lee , Jang-Kyu Kang , Hyun-Ju Jin , Byoung-Youl Min
IPC分类号： H05K3/46 , H05K1/16 , H05K3/00 , H05K3/42 , B23K1/00
CPC分类号： H05K1/162 , H05K3/0023 , H05K3/429 , H05K3/4652 , H05K3/4661 , H05K2201/0187 , H05K2201/0209 , H05K2203/0568 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155
摘要： Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto.
摘要翻译：这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。

5. 发明申请

US20090325105A1 PRINTED CIRCUIT BOARD WITH EMBEDDED CAPACITORS THEREIN, AND PROCESS FOR MANUFACTURING THE SAME 审中-公开
标题翻译：具有嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US20090325105A1
公开(公告)日：2009-12-31
申请号：US12491406
申请日：2009-06-25
申请人： Seok-Kyu Lee , Byoung-Youl Min , Chang-Hyun Nam , Hyun-Ju Jin , Jang-Kyu Kang
发明人： Seok-Kyu Lee , Byoung-Youl Min , Chang-Hyun Nam , Hyun-Ju Jin , Jang-Kyu Kang
IPC分类号： H05K3/46 , G03F7/00
CPC分类号： H05K1/162 , H05K3/4652 , H05K2201/0187 , H05K2201/0209 , H05K2201/0355 , H05K2201/0358 , H05K2201/09509 , H05K2203/1461
摘要： Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.
摘要翻译：这里公开了一种其中具有嵌入式电容器的印刷电路板，其包括填充有由BaTiO 3和环氧树脂的复合材料组成的高介电聚合物电容器糊的内部通孔，以及用于制造印刷电路板的工艺。

6. 发明授权

US07092237B2 Printed circuit board with embedded capacitors therein, and process for manufacturing the same 有权
标题翻译：具有嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US07092237B2
公开(公告)日：2006-08-15
申请号：US11117315
申请日：2005-04-29
申请人： Seok-Kyu Lee , Jang-Kyu Kang , Hyun-Ju Jin , Byoung-Youl Min
发明人： Seok-Kyu Lee , Jang-Kyu Kang , Hyun-Ju Jin , Byoung-Youl Min
IPC分类号： H01G4/06 , H01G4/005
CPC分类号： H05K1/162 , H05K3/0023 , H05K3/429 , H05K3/4652 , H05K3/4661 , H05K2201/0187 , H05K2201/0209 , H05K2203/0568 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155
摘要： Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating photo resist dry films to a copper clad FR-4, exposing to light and developing the dry films, and etching copper foils of the copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a capacitor paste to the etched regions and curing the capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless copper plating process to form copper foil layers for top electrodes; v) laminating photosensitive dry films to the copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the copper foil layers where the top electrodes are to be formed; and vi) etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.
摘要翻译：这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。制造具有嵌入式电容器的印刷电路板的方法包括以下步骤：i）将光致抗蚀剂干膜层压到铜包覆FR-4上，曝光并显影干膜，并蚀刻铜包覆FR的铜箔 -4形成用于形成电容器的底部电极; ii）将感光绝缘树脂施加到底部电极的表面，并暴露于光和显影以蚀刻感光绝缘树脂; iii）将电容器膏施加到蚀刻区域并固化电容器糊; iv）使用化学镀铜工艺电镀固化的电容器浆料和感光绝缘树脂的上部区域，以形成用于顶部电极的铜箔层; v）将感光性干膜层压到用于顶部电极的铜箔层上，暴露于光并显影感光干膜以蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域; 以及vi）蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域，并且除去形成在顶部电极上的干膜，使得电容器糊料离散地位于顶部电极和底部电极形成分立电容。

7. 发明授权

US5841291A Exchangeable membrane probe testing of circuits 失效
标题翻译：电路可交换膜探针测试
公开(公告)号：US5841291A
公开(公告)日：1998-11-24
申请号：US764511
申请日：1996-12-12
申请人： Ken Kuang-Fu Liu , Byoung-Youl Min , Robert John Moti , Syed A. Husain
发明人： Ken Kuang-Fu Liu , Byoung-Youl Min , Robert John Moti , Syed A. Husain
IPC分类号： G01R1/073 , H01L21/66 , G01R31/02
CPC分类号： G01R1/0735
摘要： First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester structure. Second and third conductive regions are electrically connected respectively to the power and ground terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region to filter high-frequency noise components from power and ground potentials provided by the power source.
摘要翻译：沿着沿着由柔性基板传导的导电的第一和第二位置电连接的第一和第二凸起分别被定向成与被测试的模具的焊盘和测试器结构的焊盘接触。第二和第三导电区域分别电连接到电源和电气设备的电源和接地端子。第二和第三区域与第一导电区域间隔开，以将高频噪声分量与由电源提供的功率和地电位进行滤波。

8. 发明申请

US20070132536A1 Printed circuit board having embedded electronic components and manufacturing method thereof 失效
标题翻译：具有嵌入式电子部件的印刷电路板及其制造方法
公开(公告)号：US20070132536A1
公开(公告)日：2007-06-14
申请号：US11637664
申请日：2006-12-13
申请人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
发明人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
IPC分类号： H01F5/00
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/0657 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/2919 , H01L2224/32245 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2224/92244 , H01L2225/06524 , H01L2225/06589 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H01L2924/3511 , H05K1/056 , H05K3/4608 , H05K2201/10515 , Y10T29/4913 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.
摘要翻译：公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度因为电子部件安装在芯片的两侧。

9. 发明申请

US20100154210A1 Method of manufacturing a printed circuit board having embedded electronic components 审中-公开
标题翻译：具有嵌入式电子部件的印刷电路板的制造方法
公开(公告)号：US20100154210A1
公开(公告)日：2010-06-24
申请号：US12656781
申请日：2010-02-16
申请人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
发明人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
IPC分类号： H05K3/30
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/0657 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/2919 , H01L2224/32245 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2224/92244 , H01L2225/06524 , H01L2225/06589 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H01L2924/3511 , H05K1/056 , H05K3/4608 , H05K2201/10515 , Y10T29/4913 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing a printed circuit board having embedded electronic components. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.
摘要翻译：一种具有嵌入式电子部件的印刷电路板的制造方法。利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度因为电子部件安装在芯片的两侧。

10. 发明授权

US06380001B1 Flexible pin count package for semiconductor device 有权
标题翻译：半导体器件的灵活引脚数封装
公开(公告)号：US06380001B1
公开(公告)日：2002-04-30
申请号：US09439564
申请日：1999-11-12
申请人： Byoung-Youl Min , Thomas J. Massingill
发明人： Byoung-Youl Min , Thomas J. Massingill
IPC分类号： H01L2144
CPC分类号： H01L24/31 , H01L23/49838 , H01L23/4985 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/12044 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A package for a semiconductor device and a method for packaging a semiconductor device are disclosed. The semiconductor package uses a tape which allows for the production of packaged semiconductor devices having different contact patterns. The contact pattern is configured to the required pin contact pattern by varying the number and placement of balls on the bottom of the tape. In one embodiment, the tape includes bonding pads and an array of contact pads. Each bonding pad is connected to one of the contact pads, and an opening is disposed in the tape below each contact pad. A semiconductor device is connected to the tape and is electrically connected to the bonding pads. The semiconductor device is then sealed on the top and sides by a plastic top which attaches to the tape. Balls are then selectively attached to the tape such that they electrically connect to select contact pads so as to form a desired contact pattern. Packages having different contact patterns are easily formed by altering the number and position of balls deposited on the tape. Thus, a single tape may be used for forming packaged semiconductor devices having different contact patterns. Thus, significant cost savings is realized since different tapes need not be fabricated for each different contact pattern.
摘要翻译：公开了一种用于半导体器件的封装以及用于封装半导体器件的方法。半导体封装使用允许生产具有不同接触图案的封装半导体器件的带。通过改变磁带底部的球的数量和位置，将接触图形配置成所需的针接触图案。在一个实施例中，带包括接合焊盘和接触焊盘阵列。每个接合焊盘连接到接触焊盘中的一个，并且在每个接触焊盘下面的带中设置一个开口。半导体器件连接到带并且电连接到接合焊盘。然后，半导体器件在顶部和侧面通过粘附到带的塑料顶部密封。然后将球选择性地附接到带，使得它们电连接到选择接触垫，以形成期望的接触图案。具有不同接触图案的包装通过改变沉积在带上的滚珠的数量和位置而容易地形成。因此，可以使用单个带来形成具有不同接触图案的封装半导体器件。因此，由于不需要为每个不同的接触图形制造不同的带，所以实现了显着的成本节省。

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