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    • 171. 发明授权
    • Semiconductor optical amplifier using laser cavity energy to amplify signal and method of fabrication thereof
    • 使用激光腔能量放大信号的半导体光放大器及其制造方法
    • US06836357B2
    • 2004-12-28
    • US10006435
    • 2001-12-04
    • Shih-Yuan WangMiao ZhuZuhua ZhuHaiqing WeiSaif M. Islam
    • Shih-Yuan WangMiao ZhuZuhua ZhuHaiqing WeiSaif M. Islam
    • H01S300
    • B82Y20/00H01S5/3413H01S5/50H01S5/5027H01S5/5063H01S5/5072H01S2301/02
    • A semiconductor optical amplifier (SOA) apparatus and related methods are described. The SOA comprises a signal waveguide for guiding an optical signal along a signal path, and further comprises one or more laser cavities having a gain medium lying outside the signal waveguide, the gain medium being sufficiently close to the signal waveguide such that, when the gain medium is pumped with an excitation current, the optical signal traveling down the signal waveguide is amplified by an evanescent coupling effect with the laser cavity. When the gain medium is sufficiently pumped to cause lasing action in the laser cavity, gain-clamped amplification of the optical signal is achieved. Additional features relating to segmented laser cavities, separate pumping of laser cavity segments, DFB/DBR gratings, current profiling to improve ASE noise performance, coupled-cavity lasers, avoidance of injection locking effects, manipulation of gain curve peaks, integration with a tunable vertical cavity coupler, integration with a photodetector, integration with an RZ signal modulator, and other described features may be used with the evanescent coupling case or with an SOA having a laser cavity gain medium that is coextensive with the gain medium of the signal waveguide.
    • 描述了一种半导体光放大器(SOA)装置及相关方法。 SOA包括用于沿着信号路径引导光信号的信号波导,并且还包括一个或多个具有位于信号波导外部的增益介质的激光腔,增益介质足够靠近信号波导,使得当增益 介质用激励电流泵浦,沿信号波导下行的光信号通过与激光腔的ev逝耦合效应放大。 当增益介质被充分泵送以在激光腔中引起激光作用时,实现光信号的增益钳位放大。 与分段激光腔相关的附加特征,激光腔段的独立泵浦,DFB / DBR光栅,电流分析以改善ASE噪声性能,耦合腔激光器,避免注入锁定效应,操纵增益曲线峰值,与可调谐垂直线 空腔耦合器,与光电检测器的集成,与RZ信号调制器的集成以及其它所描述的特征可以与ev逝耦合壳体或具有与信号波导的增益介质共同延伸的激光腔增益介质的SOA一起使用。
    • 172. 发明授权
    • Integrated circuit substrate that accommodates lattice mismatch stress
    • 集成电路基板,适应晶格失配应力
    • US06429466B2
    • 2002-08-06
    • US09774199
    • 2001-01-29
    • Yong ChenScott W. CorzineTheodore I. KaminsMichael J. LudowisePierre H. MertzShih-Yuan Wang
    • Yong ChenScott W. CorzineTheodore I. KaminsMichael J. LudowisePierre H. MertzShih-Yuan Wang
    • H01L31072
    • H01L21/7624H01L21/02381H01L21/0245H01L21/02488H01L21/02502H01L21/02538H01L21/0254H01L21/02658H01L21/26533
    • A method for growing a crystalline layer that includes a first material on a growth surface of a crystalline substrate of a second material, wherein the first material and the second material have different lattice constants. A buried layer is generated in the substrate such that the buried layer isolates a layer of the substrate that includes the growth surface from the remainder of the substrate. The second material is then deposited on the growth surface at a growth temperature. The isolated layer of the substrate has a thickness that is less than the thickness at which defects are caused in the crystalline lattice of the first material by the second material crystallizing thereon. The buried layer is sufficiently malleable at the growth temperature to allow the deformation of the lattice of the isolated layer without deforming the remainder of the substrate. The present invention may be utilized for growing III-V semiconducting material layers on silicon substrates. In the case of silicon-based substrates, the buried layer is preferably SiO2 that is sufficiently malleable at the growth temperature to allow the deformation of the isolated substrate layer.
    • 一种用于生长晶体层的方法,其包括在第二材料的晶体衬底的生长表面上的第一材料,其中第一材料和第二材料具有不同的晶格常数。 在衬底中产生掩埋层,使得掩埋层将衬底的包含生长表面的衬底与衬底的其余部分隔离。 然后将第二种材料在生长温度下沉积在生长表面上。 衬底的隔离层的厚度小于在其上结晶第二材料时在第一材料的晶格中产生缺陷的厚度。 掩埋层在生长温度下具有足够的延展性,以允许隔离层的晶格变形,而不使基底的其余部分变形。 本发明可用于在硅衬底上生长III-V半导体材料层。 在硅基基板的情况下,掩埋层优选是在生长温度下足够有韧性的SiO 2,以允许隔离的基底层的变形。
    • 173. 发明授权
    • Buried heterostructure for lasers and light emitting diodes
    • 用于激光器和发光二极管的埋入异质结构
    • US06327288B1
    • 2001-12-04
    • US09263654
    • 1999-03-05
    • Shih-Yuan WangYong Chen
    • Shih-Yuan WangYong Chen
    • H01S500
    • B82Y20/00H01S5/2232H01S5/227H01S5/32341H01S5/34333H01S2304/00H01S2304/04H01S2304/12
    • A laser diode that is constructed in a trench in a manner such that the material in the trench acts as a waveguide. The laser diode includes a first contact layer constructed from a first semiconducting material of a first carrier type, the first semiconducting material having a first index of refraction. The first contact layer has a trench therein. The trench has a layer of a second semiconducting material of the first carrier type on the bottom surface. The index of refraction of the second semiconducting material is at least one percent greater than the index of refraction of the first semiconducting material. The laser also includes a first dielectric layer covering the first layer in those regions outside of the trench and a first cladding layer constructed from a third semiconducting material of the first carrier type. The first cladding layer overlies the dielectric layer. An active layer overlies the first cladding layer. A second cladding layer constructed from a fourth semiconducting material of the opposite carrier type from the first carrier type overlies the active layer. A second contact layer of a fifth semiconducting material of the opposite carrier type from the first carrier type overlies the second cladding layer. The invention is particularly well suited for constructing laser diodes based on group III-V material systems such as GaN.
    • 一种激光二极管,其以沟槽中的材料作为波导的方式构造在沟槽中。 激光二极管包括由第一载体类型的第一半导体材料构成的第一接触层,第一半导体材料具有第一折射率。 第一接触层在其中具有沟槽。 沟槽在底表面上具有第一载体类型的第二半导体材料层。 第二半导体材料的折射率比第一半导体材料的折射率大至少一个百分点。 激光器还包括覆盖在沟槽外的那些区域中的第一层的第一介电层和由第一载流子类型的第三半导体材料构成的第一覆层。 第一包覆层覆盖在电介质层上。 有源层覆盖在第一覆层上。 由与第一载体类型相反的载体类型的第四半导体材料构成的第二覆层覆盖有源层。 与第一载体类型相反的载体类型的第五半导体材料的第二接触层覆盖第二覆层。 本发明特别适用于构建基于III-V族材料体系的诸如GaN的激光二极管。
    • 174. 发明授权
    • N-drive, p-common light-emitting devices fabricated on an n-type
substrate and method of making same
    • 在n型衬底上制造的N驱动p普通发光器件及其制造方法
    • US5892787A
    • 1999-04-06
    • US635838
    • 1996-04-22
    • Michael R. T. TanAlbert T. YuenShih-Yuan WangGhulam HasnainYu-Min Houng
    • Michael R. T. TanAlbert T. YuenShih-Yuan WangGhulam HasnainYu-Min Houng
    • H01S5/00H01L33/00H01L33/30H01S5/042H01S5/183H01S5/30H01S5/42H01S3/19
    • H01L33/30H01L33/0016H01L33/0062H01S5/18308H01S5/0207H01S5/0421H01S5/18305H01S5/2059H01S5/2063H01S5/3054H01S5/3095H01S5/423
    • A substantially n-type substrate structure having a p-type surface for use in semiconductor devices as a substitute for a p-type semiconductor substrate. The substrate structure comprises a substrate region and a buffer region. The substrate region is a region of n-type compound semiconductor, and includes a degeneratively n-doped portion adjacent its first surface. The buffer region is a region of compound semiconductor doped with a p-type dopant. The buffer region is located on the first surface of the substrate region and includes a surface remote from the substrate region that provides the p-type surface of the substrate structure. The buffer region also includes a degeneratively p-doped portion adjacent the degeneratively n-doped portion of the substrate region. The substrate structure includes a tunnel junction between the degeneratively n-doped portion of the substrate region and the degeneratively p-doped portion of the buffer region. The substrate structure is made by degeneratively doping a substrate region of n-type compound semiconductor material adjacent its first surface with an n-type impurity, and depositing a layer of compound semiconductor material doped with a p-type impurity on the first surface of the substrate region to form a buffer region that includes a surface remote from the substrate region. In the course of depositing the compound semiconductor material to form the buffer region, the compound semiconductor material is degeneratively doped with the p-type impurity at least in a portion adjacent the substrate region to form a tunnel junction between the substrate region and the buffer region.
    • 具有用于半导体器件的p型表面作为p型半导体衬底的替代物的基本为n型衬底结构。 衬底结构包括衬底区域和缓冲区域。 衬底区域是n型化合物半导体的区域,并且包括与其第一表面相邻的退化的n-掺杂部分。 缓冲区是掺杂有p型掺杂剂的化合物半导体的区域。 缓冲区域位于衬底区域的第一表面上并且包括远离衬底区域的表面,该表面提供衬底结构的p型表面。 缓冲区还包括与衬底区域的退化的n掺杂部分相邻的退化的p掺杂部分。 衬底结构包括在衬底区域的退化的n掺杂部分和缓冲区域的退化的p掺杂部分之间的隧道结。 衬底结构是通过用n型杂质将邻近其第一表面的n型化合物半导体材料的衬底区域简单地掺杂制成的,并且在第一表面上沉积掺杂有p型杂质的化合物半导体材料层 衬底区域以形成包括远离衬底区域的表面的缓冲区域。 在沉积化合物半导体材料以形成缓冲区的过程中,化合物半导体材料至少在与衬底区域相邻的部分中被p型杂质退变掺杂以在衬底区域和缓冲区域之间形成隧道结 。