专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

101. 发明授权

US06799932B2 Semiconductor wafer processing apparatus 失效
标题翻译：半导体晶片处理装置
公开(公告)号：US06799932B2
公开(公告)日：2004-10-05
申请号：US10457944
申请日：2003-06-09
申请人： Jeffry A. Davis , Kert L. Dolechek , Gary L. Curtis
发明人： Jeffry A. Davis , Kert L. Dolechek , Gary L. Curtis
IPC分类号： B65G49107
CPC分类号： H01L21/67754 , H01L21/67173 , H01L21/6732 , H01L21/67769 , H01L21/67772 , H01L21/67775 , H01L21/67778 , H01L21/67781 , H01L21/68707 , Y10S414/135 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism that is adapted to seal with a pod disposed in the interface section. The article insertion mechanism is disposed to allow insertion of the articles into the pod after processing by the at least one processing station. The article insertion mechanism allows the insertion of the articles without exposing the articles to ambient atmospheric conditions in the interface section.
摘要翻译：阐述了一种用于在基本上清洁的气氛中处理诸如半导体晶片的制品的处理器。处理器包括限定基本封闭的清洁处理室的外壳和设置在处理室中的至少一个处理站。接口部分设置在外壳的接口端附近。接口部分包括至少一个接口端口，通过该至少一个接口端口将包含用于处理的物品的容器装载或者从处理器卸载。接口部分与处理室卫生地分开，因为界面部分通常不像高度卫生的处理室那么干净。采用适于与荚密封的物品提取机构。该机构被设置为允许将容纳在容器内的物品提取到处理室中，而不会使物品暴露于接口部分中的环境大气条件。物品处理器还优选地包括物品插入机构，其适于与设置在界面部分中的容器密封。物品插入机构设置成允许在由至少一个处理站处理之后将物品插入容器中。物品插入机构允许物品的插入，而不会使物品暴露在界面部分中的环境大气条件下。

102. 发明申请

US20040191028A1 Vacuum processing system being able to carry process object into and out of vacuum chamber 失效
标题翻译：真空处理系统能够将工艺物体进出真空室
公开(公告)号：US20040191028A1
公开(公告)日：2004-09-30
申请号：US10806149
申请日：2004-03-23
发明人： Tadamoto Tamai
IPC分类号： B65G001/00
CPC分类号： H01L21/67069 , H01L21/67745 , H01L21/67748 , H01L21/67751 , Y10S414/139
摘要： First and second load-lock mechanisms are installed in a vacuum chamber. An external arm and first and second robot arms are disposed outside of the vacuum chamber. The external arm can hold a process object and can carry the held process object either into the first load-lock mechanism or into the second load-lock mechanism. The first robot arm can transfer the process object between a stock site outside of the vacuum chamber and the first load-lock mechanism and between the stock site and the external arm. The second robot arm can transfer the process object between the stock site and the second load-lock mechanism and between the stock site and the external arm.
摘要翻译：第一和第二加载锁定机构安装在真空室中。外部臂和第一和第二机器人臂设置在真空室的外部。外部臂可以保持加工对象，并且可以将保持的过程对象进入第一加载锁定机构或第二加载锁定机构。第一机器人手臂可以在真空室外部的库位与第一加载锁定机构之间以及库位和外部臂之间转移加工对象。第二机器人手臂可以在库位和第二加载锁定机构之间以及库位和外臂之间传送过程对象。

103. 发明申请

US20040187793A1 Wafer processing apparatus having dust proof function 有权
公开(公告)号：US20040187793A1
公开(公告)日：2004-09-30
申请号：US10706915
申请日：2003-11-14
申请人： TDK CORPORATION
发明人： Tsutomu Okabe , Hiroshi Igarashi
IPC分类号： C23C016/00
CPC分类号： H01L21/67772 , Y10S414/135 , Y10S414/139
摘要： The wafer processing apparatus includes a chamber that is pressurized to a pressure that is higher than the pressure of the exterior thereof, an opening portion through which the interior and the exterior of the chamber are in communication with each other, and a door that closes the opening portion. When the opening portion is closed by the door, a portion of the opening remains as an aperture uncovered by the door. In conventional semiconductor wafer processing apparatus, the interior of the apparatus is sealed and pressurized in order to keep a high degree of cleanness in the wafer processing portion, and therefore airflow is generated due to a pressure difference between the interior and the exterior of the apparatus. With the above feature of the invention, it is possible to suppress creation of such airflow and prevent dust from entering the wafer processing apparatus to eliminate wafer contamination.

104. 发明申请

US20040158348A1 Reticle storage system 审中-公开
公开(公告)号：US20040158348A1
公开(公告)日：2004-08-12
申请号：US10774958
申请日：2004-02-09
申请人： R. Foulke Development Company, LLC
发明人： Richard F. Foulke , Richard F. Foulke JR. , Cord W. Ohlenbusch , Takman Lui
IPC分类号： G06F007/00
CPC分类号： G03F7/70741 , G03F7/70866 , G03F7/70916 , Y10S414/137 , Y10S414/138 , Y10S414/139
摘要： A reticle storage system includes a reticle rack having a series of lateral slots, each for storing a reticle. Access to the reticles is provided on a lateral side of the rack. The enclosure has a series of doors for providing access to the reticles in the slots. An air circulation system flows filtered air past the reticles in the rack to prevent contaminants from accumulating on the reticles. The air circulation system is capable of providing positive air pressure within the enclosure with one door open, thereby preventing contaminants from entering the enclosure through the open door.

105. 发明申请

US20040137741A1 METHODS FOR REDUCING CONTAMINATION OF SEMICONDUCTOR SUBSTRATES 有权
标题翻译：减少半导体衬底污染的方法
公开(公告)号：US20040137741A1
公开(公告)日：2004-07-15
申请号：US10295912
申请日：2002-11-18
发明人： Robert Chebi , David Hemker
IPC分类号： H01L021/311 , H01L021/302 , H01L021/461
CPC分类号： H01L21/67115 , B08B7/0071 , H01L21/67028 , H01L21/67103 , H01L21/67109 , Y10S414/135 , Y10S414/136 , Y10S414/137 , Y10S414/138 , Y10S414/139 , Y10S414/14 , Y10S438/904 , Y10S438/913
摘要： Methods for reducing contamination of semiconductor substrates after processing are provided. The methods include heating the processed substrate to remove adsorbed chemical species from the substrate surface by thermal desorption. Thermal desorption can be performed either in-situ or ex-situ. The substrate can be heated by convection, conduction, and/or radiant heating. The substrate can also be heated by treating the surface of the processed substrate with an inert plasma during which treatment ions in the plasma bombard the substrate surface raising the temperature thereof. Thermal desorption can also be performed ex-situ by applying thermal energy to the substrate during transport of the substrate from the processing chamber and/or by transporting the substrate to a transport module (e.g., a load lock) or to a second processing chamber for heating. Thermal desorption during transport can be enhanced by purging an inert gas over the substrate surface.
摘要翻译：提供了减少处理后的半导体衬底污染的方法。所述方法包括加热经处理的基底以通过热解吸从基底表面除去吸附的化学物质。热解吸可以原位或非原位进行。可以通过对流，传导和/或辐射加热来加热衬底。也可以通过用惰性等离子体处理处理的基板的表面来加热基板，在惰性等离子体中处理等离子体中的离子轰击衬底表面，提高其温度。也可以通过在将衬底从处理室传送过程中向衬底施加热能和/或通过将衬底传送到传输模块（例如，装载锁）或第二处理室来进行热解吸，加热。通过在衬底表面上吹扫惰性气体可以提高运输过程中的热解吸。

106. 发明申请

US20040117059A1 Cluster tool and method for controlling transport 有权
标题翻译：集群工具和控制传输的方法
公开(公告)号：US20040117059A1
公开(公告)日：2004-06-17
申请号：US10473135
申请日：2003-10-06
发明人： Kiyohito IIjima , Seiichi Kaise , Keiko Takahashi , Akira Obi
IPC分类号： G06F007/00
CPC分类号： H01L21/67184 , H01L21/67167 , H01L21/67276 , H01L21/67745 , Y10S414/139
摘要： At a time Tp when a wafer W is transferred into either a load lock chamber LL1 or LL2, periods PSL for the load lock chambers LL1 and LL2 to get ready to permit a transfer of a next wafer W thereinto are calculated based on a timing for exchange of wafers W between the load lock chamber LL1 or LL2 and a loader module LM. When the periods PSL are calculated, a loader arm LA1 or LA2 selects a next wafer W having the shortest period to get ready to be transferable into the load lock chamber LL1 or LL2, from load ports LP1 to LP3. This improves transfer delay in a cluster tool provided with the load lock chambers.
摘要翻译：在将晶片W转移到负载锁定室LL1或LL2中的时间Tp中，根据下述晶片W的定时计算用于负载锁定室LL1和LL2准备好允许下一个晶片W的转移的周期PSL 在负载锁定室LL1或LL2与加载模块LM之间交换晶片W。当计算周期PSL时，装载臂LA1或LA2从加载端口LP1至LP3选择具有最短周期的下一个晶片W以准备可转移到装载锁定室LL1或LL2中。这改善了与装载锁定室一起提供的集群工具中的传输延迟。

107. 发明授权

US06748960B1 Apparatus for supercritical processing of multiple workpieces 有权
标题翻译：多工件超临界加工设备
公开(公告)号：US06748960B1
公开(公告)日：2004-06-15
申请号：US09704642
申请日：2000-11-01
申请人： Maximilian Albert Biberger , Frederick Paul Layman , Thomas Robert Sutton
发明人： Maximilian Albert Biberger , Frederick Paul Layman , Thomas Robert Sutton
IPC分类号： B08B300
CPC分类号： H01L21/67167 , H01L21/67184 , H01L21/67207 , H01L21/67213 , H01L21/67745 , Y10S134/902 , Y10S414/139
摘要： An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.
摘要翻译：一种用于超临界处理多个工件的装置包括传送模块，第一和第二超临界处理模块以及机器人。传送模块包括入口。第一和第二超临界处理模块耦合到传送模块。机器人优选地与传送模块一起定位。在操作中，机器人将第一工件从传送模块的入口传送到第一超临界处理模块。机器人然后将第二工件从入口传送到第二超临界处理模块。在处理工件之后，机器人将第一和第二工件返回到传送模块的入口。或者，该装置包括耦合到传送模块的附加超临界处理模块。

108. 发明申请

US20040089240A1 Chemical vapor deposition apparatus 失效
公开(公告)号：US20040089240A1
公开(公告)日：2004-05-13
申请号：US10695726
申请日：2003-10-28
发明人： Ross S. Dando , Craig M. Carpenter , Philip H. Campbell , Allen P. Mardian
IPC分类号： C23C016/00
CPC分类号： C23C16/45519 , C23C16/4401 , C23C16/54 , Y10S156/914 , Y10S414/139
摘要： A chemical vapor deposition apparatus includes a subatmospheric substrate transfer chamber. A subatmospheric deposition chamber is defined at least in part by a chamber sidewall. A passageway in the chamber sidewall extends from the transfer chamber to the deposition chamber. Semiconductor substrates pass into and out of the deposition chamber through the passageway for deposition processing. A mechanical gate is included within at least one of the deposition chamber and the sidewall passageway, and is configured to open and close at least a portion of the passageway to the chamber. A chamber liner apparatus of a chemical vapor deposition apparatus forms a deposition subchamber within the chamber. At least a portion of the chamber liner apparatus is selectively movable to fully expose and to fully cover the passageway to the chamber.

109. 发明授权

US06729824B2 Dual robot processing system 失效
标题翻译：双机器人处理系统
公开(公告)号：US06729824B2
公开(公告)日：2004-05-04
申请号：US10017039
申请日：2001-12-14
申请人： Lawrence C. Lei , Moris Kori
发明人： Lawrence C. Lei , Moris Kori
IPC分类号： B65G4907
CPC分类号： H01L21/67184 , H01L21/67126 , H01L21/67201 , H01L21/67742 , H01L21/67745 , H01L21/67748 , Y10S414/139
摘要： A substrate processing system having a transfer chamber having two processing chambers and two load lock chambers coupled thereto is generally provided. The transfer chamber includes a body having a first transfer area and a second transfer area defined therein on either side of a center axis. A first passage couples one of the load locks with the first transfer area and a second passage couples the other one of the load locks with the second transfer area. The first passage and the second passage form an acute angle about the center axis. A transfer platform is disposed between the first transfer area and the second transfer area. A first transfer robot and a second transfer robot are disposed in the first and second transfer areas, respectively. Each robot is adapted to transfer substrates between the load locks, the transfer platform and a processing chamber.
摘要翻译：通常提供具有传送室的基板处理系统，该传送室具有两个处理室和与其连接的两个加载锁定室。传送室包括在中心轴线的任一侧上具有限定在其中的第一传送区域和第二传送区域的主体。第一通道将负载锁中的一个与第一传送区域耦合，并且第二通道将另一个负载锁与第二传送区域耦合。第一通道和第二通道围绕中心轴线形成锐角。传送平台设置在第一传送区域和第二传送区域之间。第一传送机器人和第二传送机器人分别设置在第一传送区域和第二传送区域中。每个机器人适于在负载锁，转移平台和处理室之间传送衬底。

110. 发明授权

US06726429B2 Local store for a wafer processing station 失效
标题翻译：晶圆加工站的本地商店
公开(公告)号：US06726429B2
公开(公告)日：2004-04-27
申请号：US10079025
申请日：2002-02-19
申请人： James G. Sackett , David E. Weldon , H. Alexander Anderson
发明人： James G. Sackett , David E. Weldon , H. Alexander Anderson
IPC分类号： B65G4907
CPC分类号： H01L21/67769 , H01L21/67775 , Y10S414/139 , Y10S414/14
摘要： A buffer apparatus includes a vertically moving mechanism containing a plurality of horizontally moving mechanisms to store carriers and transfer carriers to and from a load port, and one or more buffer load ports adjacent to the buffer apparatus to charge and uncharge the buffer apparatus by means of a guided vehicle, an overhead vehicle, or a human. A buffer system includes a buffer apparatus and a processing system load port to transfer carriers from the buffer apparatus to a processing system load port. An arrayed buffer system includes a plurality of buffer systems where each buffer system interacts with an individual set of load ports or a pair of buffer systems interacts with a shared set of load ports. A combination of arrayed buffer systems includes a plurality of adjacent arrayed buffer systems capable of sharing a single, environmental front-end mechanism maintenance space and capable of being serviced from the front.
摘要翻译：缓冲装置包括一个垂直移动机构，其包含多个水平移动机构，用于存储载体并将载体传送到负载端口，以及与缓冲装置相邻的一个或多个缓冲装载端口，用于借助于导向车辆，架空车辆或人类。缓冲系统包括缓冲装置和处理系统负载端口，用于将载体从缓冲装置传送到处理系统负载端口。阵列缓冲系统包括多个缓冲系统，其中每个缓冲器系统与单独的一组加载端口交互，或者一对缓冲系统与共享的一组加载端口交互。排列缓冲系统的组合包括能够共享单个环境前端机构维护空间并且能够从前面服务的多个相邻的排列缓冲系统。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式