专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5935768A Method of processing a substrate in a photolithography system utilizing a thermal process module 失效
标题翻译：利用热处理模块在光刻系统中处理衬底的方法
公开(公告)号：US5935768A
公开(公告)日：1999-08-10
申请号：US872345
申请日：1997-06-10
申请人： Michael R. Biche , H. Alexander Anderson
发明人： Michael R. Biche , H. Alexander Anderson
IPC分类号： G03F7/26 , B65G49/07 , H01L21/00 , H01L21/027 , H01L21/677 , H01L21/683 , G03F7/40
CPC分类号： H01L21/67017 , H01L21/67098 , H01L21/6838 , Y10S414/136
摘要： An apparatus and a method for baking and cooling silicon substrates are disclosed. Both baking and cooling of silicon substrates are done in a single integrated thermal process module. Each thermal process module includes two hot plate assemblies, a cool plate assembly, two local linear transfer arms and a micro-processor based module controller. Both transfer arms are capable of transferring substrates among the cool and hot plate assemblies. The module controller ensures that there are no conflicts in use of the transfer arms or in use of the hot and cool plate assemblies and so that a transfer arm is always available when a substrate is finished baking. A central substrate handling robot transports substrates only from and to the cool plate assembly of the thermal process module. Also, the vacuum tubing is routed via a unique pulley arrangement to achieve compact mounting and eliminate loose tubing.
摘要翻译：公开了一种用于烘焙和冷却硅衬底的设备和方法。硅基板的烘烤和冷却都是在单个集成的热处理模块中完成的。每个热处理模块包括两个热板组件，冷板组件，两个局部线性传输臂和基于微处理器的模块控制器。两个传送臂都能够在冷和热板组件之间传送基板。模块控制器确保在使用转移臂或使用热和冷板组件时不存在冲突，并且当基材完成烘烤时总是可以使用传送臂。中央基板处理机器人仅从热处理模块的冷板组件传送基板。此外，真空管通过独特的滑轮装置布置，以实现紧凑的安装并消除松动的管道。

2. 发明授权

US06726429B2 Local store for a wafer processing station 失效
标题翻译：晶圆加工站的本地商店
公开(公告)号：US06726429B2
公开(公告)日：2004-04-27
申请号：US10079025
申请日：2002-02-19
申请人： James G. Sackett , David E. Weldon , H. Alexander Anderson
发明人： James G. Sackett , David E. Weldon , H. Alexander Anderson
IPC分类号： B65G4907
CPC分类号： H01L21/67769 , H01L21/67775 , Y10S414/139 , Y10S414/14
摘要： A buffer apparatus includes a vertically moving mechanism containing a plurality of horizontally moving mechanisms to store carriers and transfer carriers to and from a load port, and one or more buffer load ports adjacent to the buffer apparatus to charge and uncharge the buffer apparatus by means of a guided vehicle, an overhead vehicle, or a human. A buffer system includes a buffer apparatus and a processing system load port to transfer carriers from the buffer apparatus to a processing system load port. An arrayed buffer system includes a plurality of buffer systems where each buffer system interacts with an individual set of load ports or a pair of buffer systems interacts with a shared set of load ports. A combination of arrayed buffer systems includes a plurality of adjacent arrayed buffer systems capable of sharing a single, environmental front-end mechanism maintenance space and capable of being serviced from the front.
摘要翻译：缓冲装置包括一个垂直移动机构，其包含多个水平移动机构，用于存储载体并将载体传送到负载端口，以及与缓冲装置相邻的一个或多个缓冲装载端口，用于借助于导向车辆，架空车辆或人类。缓冲系统包括缓冲装置和处理系统负载端口，用于将载体从缓冲装置传送到处理系统负载端口。阵列缓冲系统包括多个缓冲系统，其中每个缓冲器系统与单独的一组加载端口交互，或者一对缓冲系统与共享的一组加载端口交互。排列缓冲系统的组合包括能够共享单个环境前端机构维护空间并且能够从前面服务的多个相邻的排列缓冲系统。

3. 发明授权

US5651823A Clustered photolithography system 失效
标题翻译：集群光刻系统
公开(公告)号：US5651823A
公开(公告)日：1997-07-29
申请号：US412650
申请日：1995-03-29
申请人： Michael L. Parodi , Michael R. Biche , H. Alexander Anderson , Alexander Lurye
发明人： Michael L. Parodi , Michael R. Biche , H. Alexander Anderson , Alexander Lurye
IPC分类号： G03F7/16 , G03F7/20 , G03F7/26 , G03F7/30 , H01L21/00 , H01L21/027 , H01L21/677 , B65G25/00
CPC分类号： H01L21/67167 , G03F7/30 , G03F7/3021 , G03F7/70691 , H01L21/67178 , H01L21/67184 , H01L21/67225 , H01L21/67742 , H01L21/67772 , H01L21/67775 , Y10S414/14
摘要： A substrate photolithography system includes a substrate handling robot which pivots about a fixed point and transfers substrates between photoresist coater, a developer, and a heating/cooling unit, all of which are clustered about the robot. The end effector of the robot is capable of both vertical and lateral movement so that individual modules of the heating/cooling unit may be stacked. An apparatus and a method for baking and cooling silicon substrates are disclosed. Both baking and cooling of silicon substrates are done in a single integrated thermal process module. Each thermal process module includes two hot plate assemblies, a cool plate assembly, two local linear transfer arms and a micro-processor based module controller. Both transfer arms are capable of transferring substrates among the cool and hot plate assemblies. A cassette input/output unit handles cassettes which contain semiconductor wafers or other substrates that are to be delivered to or withdrawn from a semiconductor processing system. The input/output unit includes a drawer front which rotates 90.degree. about a horizontal axis as it is opened.
摘要翻译：基板光刻系统包括基板处理机器人，其基于固定点枢转并且在光致抗蚀剂涂布器，显影剂和加热/冷却单元之间传送基板，所有这些基板处理机器人围绕机器人聚集。机器人的末端执行器能够垂直和横向移动，从而可以堆叠加热/冷却单元的各个模块。公开了一种用于烘焙和冷却硅衬底的设备和方法。硅基板的烘烤和冷却都是在单个集成的热处理模块中完成的。每个热处理模块包括两个热板组件，冷板组件，两个局部线性传输臂和基于微处理器的模块控制器。两个传送臂都能够在冷和热板组件之间传送基板。盒式磁带输入/输出单元处理包含半导体晶片或将被输送到半导体处理系统或从半导体处理系统退出的其它基板的盒。输入/输出单元包括一个抽屉前端，它在打开时围绕水平轴线旋转90°。

4. 发明授权

US5957764A Modular wafer polishing apparatus and method 失效
标题翻译：模块化晶圆抛光装置及方法
公开(公告)号：US5957764A
公开(公告)日：1999-09-28
申请号：US964930
申请日：1997-11-05
申请人： H. Alexander Anderson , Linh X. Can , Tsungnan Cheng , Garry K. Kwong , Albert Hu , David Chen , Shu-Wong S. Lee
发明人： H. Alexander Anderson , Linh X. Can , Tsungnan Cheng , Garry K. Kwong , Albert Hu , David Chen , Shu-Wong S. Lee
IPC分类号： B24B21/04 , B24B37/04 , B24B5/00 , B24B29/00
CPC分类号： B24B21/04 , B24B37/04
摘要： A wafer polishing apparatus includes a module frame; a continuous belt rotatable with respect to the frame, the belt having at least one vertically-oriented belt transverse portion including a polishing pad assembly; and at least one pivotable wafer-holding head drive within the frame and having a distal end portion movable to a vertical first position parallel and juxtaposed to the belt transverse portion. The head drive includes a wafer carrier for holding a wafer on the distal end portion of the head drive, while a drive moves the distal end portion and a held wafer into a vertical polishing position abutting the belt transverse portion and pressure is applied to the held-wafer against the polishing pad assembly while the wafer-holding distal end portion is rotated and swept side-by-side. After polishing the drive is reversed and the head drive is pivoted away from the belt transverse portion to a horizontal or other orientation and the then polished wafer removed. Multiple modules may be placed end-to-end or side-by-side with a robot pathway therebetween to load unpolished wafers and to unload polished wafers to a buffing station, to a cassette or other processing station.
摘要翻译：晶片抛光装置包括模块框架; 相对于框架可旋转的连续带，所述带具有包括抛光垫组件的至少一个垂直定向的带横向部分; 以及在所述框架内的至少一个可枢转的晶片保持头驱动器，并且具有可移动到平行并并列到所述带横向部分的垂直第一位置的远端部分。头驱动器包括用于将晶片保持在头驱动器的远端部分的晶片载体，同时驱动器将远端部分和保持的晶片移动到邻近带横向部分的垂直抛光位置，并且压力施加到保持的 - 在晶片保持前端部分旋转并且并排扫掠的同时，抵靠抛光垫组件。在抛光之后，驱动器被反转并且头驱动器从带横向部分转动到水平或其它方向，并且然后抛光晶片。多个模块可以端对端或并排地放置在其间的机器人通路以加载未抛光的晶片并将抛光的晶片卸载到抛光台，到盒或其它处理站。

5. 发明授权

US5947802A Wafer shuttle system 失效
标题翻译：晶圆穿梭系统
公开(公告)号：US5947802A
公开(公告)日：1999-09-07
申请号：US965037
申请日：1997-11-05
申请人： John Weiguo Zhang , H. Alexander Anderson
发明人： John Weiguo Zhang , H. Alexander Anderson
IPC分类号： B24B21/04 , B24B37/04 , B24B47/20 , B24B47/02
CPC分类号： B24B21/04 , B24B37/04
摘要： A shuttle system for transferring a semiconductor wafer from a receiving station to a horizontal-oriented head drive of a wafer polishing machine includes a linear horizontal rail extending from a first position to a second position; a wafer transfer assembly adjacent to the first position; a wafer conveying assembly movable along the rail from adjacent the first position to adjacent the second position; and wherein the wafer conveying assembly includes a vertically movable and radially movable gripper for gripping peripheral edges of a wafer to be transferred and conveyed from the transfer assembly to the head drive. The transfer assembly includes a transfer receiver for receiving an unpolished wafer from a cassette which receiver is movable to the second position where the gripper is movable to edge-grip the received unpolished wafer. The gripper includes a series of radially movable segments having edge-contacting fingers depending therefrom for gripping the wafer edges. A polished wafer is conveyed by the gripper along the rail to a rinsing bath including an unloading ring movable up and down in the bath.
摘要翻译：用于将半导体晶片从接收站传送到晶片抛光机的水平取向头驱动器的穿梭系统包括从第一位置延伸到第二位置的直线水平轨道; 与第一位置相邻的晶片传送组件; 晶片传送组件，其可沿着所述轨道从所述第一位置相邻移动到所述第二位置; 并且其中所述晶片传送组件包括可垂直移动的和可径向移动的夹持器，用于夹持要从所述传送组件传输和传送到所述头驱动器的晶片的周边边缘。传送组件包括用于从盒接收未抛光晶片的传送接收器，该接收器可移动到第二位置，在该位置，夹持器可移动到边缘夹持接收的未抛光晶片。夹持器包括一系列径向可移动的部分，其具有从其附近的用于夹持晶片边缘的边缘接触指状物。抛光的晶片由夹持器沿着轨道传送到漂洗槽，该冲洗槽包括可在浴中上下移动的卸载环。

6. 发明授权

US5553994A Thermal process module for substrate coat/develop system 失效
标题翻译：衬底涂层/开发系统的热处理模块
公开(公告)号：US5553994A
公开(公告)日：1996-09-10
申请号：US321333
申请日：1994-10-11
申请人： Michael R. Biche , H. Alexander Anderson
发明人： Michael R. Biche , H. Alexander Anderson
IPC分类号： G03F7/26 , B65G49/07 , H01L21/00 , H01L21/027 , H01L21/677 , H01L21/683 , B65G25/00
CPC分类号： H01L21/67017 , H01L21/67098 , H01L21/6838 , Y10S414/136
摘要： In a photolithography system, baking and cooling of semiconductor substrates is done in a thermal process module that uses a unique mechanism including pulleys to route vacuum tubing to a transfer arm. Specifically, the mechanism includes a pair of pulleys and a vacuum tube wrapped around the pulleys. The vacuum tube has a movable portion connected to the transfer arm which is reciprocable between the pair of pulleys. The vacuum tube also has a stationary portion that is connected to the movable portion to form an endless loop. The stationary portion of the vacuum tube is rigidly connected to a vacuum supply line in the housing of the thermal process module.
摘要翻译：在光刻系统中，半导体衬底的烘烤和冷却在热处理模块中进行，该热处理模块使用包括滑轮的独特机构将真空管路路由到传送臂。具体地说，该机构包括一对皮带轮和缠绕在皮带轮上的真空管。真空管具有连接到传送臂的可移动部分，其可在一对滑轮之间往复运动。真空管还具有固定部分，其连接到可动部分以形成无限循环。真空管的固定部分刚性连接到热处理模块壳体中的真空供应管线。

7. 发明授权

US6149512A Linear pad conditioning apparatus 失效
标题翻译：线性调节装置
公开(公告)号：US6149512A
公开(公告)日：2000-11-21
申请号：US965514
申请日：1997-11-06
申请人： Ethan C. Wilson , H. Alexander Anderson , Gregory Appel
发明人： Ethan C. Wilson , H. Alexander Anderson , Gregory Appel
IPC分类号： B24B53/007 , B24B53/017 , B24B53/00
CPC分类号： B24B53/017 , Y10S977/775
摘要： A linear pad conditioning mechanism provides a linear in situ or ex situ conditioning for a polishing pad mounted on a polishing belt of a CMP apparatus. The linear pad conditioning mechanism includes a linear oscillation mechanism for driving a conditioning pad in a direction orthogonal to the polishing belt's direction of travel. In one example, multiple conditioning assemblies are provided to each provide a trapezoidal conditioning pad, and the conditioning assemblies are positioned such that a constant-width area in the polishing belt's direction of travel is provided. In that example, a rotational mechanism is provided to position the conditioning pad between a conditioning position against the polishing pad, and a cleaning position in a bath of cleaning fluid. Further, each conditioning assembly is provided a fluid delivery system to a conditioner block, so that a conditioner fluid can be delivered at the point of use.
摘要翻译：线性垫调节机构为安装在CMP设备的抛光带上的抛光垫提供线性原位或非原位调节。线性调节机构包括用于在与研磨带的行进方向正交的方向上驱动调节垫的线性振荡机构。在一个示例中，提供多个调节组件以各自提供梯形调节垫，并且调节组件被定位成使得抛光带的行进方向上的恒定宽度区域被设置。在该示例中，提供旋转机构以将调节垫定位在抵靠抛光垫的调节位置和清洗液槽中的清洁位置之间。此外，每个调理组件设置到调节器块的流体输送系统，使得可以在使用时输送调理液。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式