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    • 91. 发明授权
    • Input stage for a CTD low-pass filter
    • CTD低通滤波器的输入级
    • US4145676A
    • 1979-03-20
    • US788779
    • 1977-04-19
    • Roger Benoit-GoninJean L. BergerSylvain Fontanes
    • Roger Benoit-GoninJean L. BergerSylvain Fontanes
    • H01L21/339H01L29/76H01L29/762H01L29/768H01L29/772H01L29/78H03H15/02H03H7/28G11C19/28H01L27/10
    • H01L29/76808H03H15/02
    • An input stage for a transversal charge transfer filter, which suppresses parasitic image frequencies. It comprises two parallel channels to which the input signal is applied simultaneously. Sampling of the signal is performed in each channel with a periodicity Te, and a relative phase-shift of Te/2. The two samples are then added in order to eliminate components having periodicities in the neighborhood of Te. The present invention relates to low-pass filters using the phenomenon of electrical charge transfer occurring in a semiconductor. It relates more particularly to an input stage for this kind of CTD (Charge Transfer Device) filter, which attenuates parasitic frequencies. The design of CTD low-pass filters, often referred to as transversal filters, poses a classic problem due to the fact that the input stage is a sampling stage. In other words, when the input signal contains a component of frequency Fs close to the sampling frequency Fe, by a process of frequency mixing, two parasitic signals at the image frequencies Fe + Fs and Fe - Fs are created. Since we are concerned with a low-pass filter, the top image frequency (Fe + Fs) is automatically eliminated but the bottom image frequency (Fe - Fs) can be transmitted by the filter and appear in the output signal if the condition Fe - Fs
    • 用于横向电荷转移滤波器的输入级,其抑制寄生图像频率。 它包括同时施加输入信号的两个并行通道。 在每个通道中以周期Te执行信号的采样,并且执行Te / 2的相对相移。 然后添加两个样品以消除在Te附近具有周期性的组分。
    • 96. 发明授权
    • Method of modifying electrical characteristics of MOS devices using ion
implantation
    • 使用离子注入改善MOS器件的电气特性的方法
    • US4080718A
    • 1978-03-28
    • US750368
    • 1976-12-14
    • Paul Richman
    • Paul Richman
    • H01L27/112G11C17/00G11C17/08H01L21/265H01L21/339H01L21/8236H01L21/8246H01L21/8247H01L27/10H01L29/762H01L29/78H01L29/788H01L29/792H01L21/96
    • H01L27/1126H01L21/8236Y10S438/958
    • A method is disclosed for selectively modifying the electrical characteristics of MOS devices at a late stage in the fabrication process to form, for example, the "1" and "0" data locations of a ROM, or to form enhancement-and depletion-mode devices. In one embodiment of the method, in addition to forming openings in the passivation layer to define location of bonding pads, additional openings are formed in that layer at locations at which a data bit of one of the two levels is to be formed. Subsequently, an ion implantation is performed through the exposed underlying polysilicon gate structure to create an implantation layer at the channel regions of selected MOS devices, and thereby permanently alter the threshold voltages of these MOS devices. Other embodiments of the invention are disclosed in which ion implantation is performed through openings selectively formed in other layers, thereby to form implantation regions at selected locations to modify selected MOS devices at those locations.
    • 公开了一种方法,用于在制造过程中的后期选择性地修改MOS器件的电气特性,以形成例如ROM的“1”和“0”数据位置,或者形成增强和耗尽模式 设备。 在该方法的一个实施例中,除了在钝化层中形成开口以限定接合焊盘的位置之外,在要形成两个电平之一的数据位的位置处,在该层中形成另外的开口。 随后,通过暴露的下面的多晶硅栅极结构进行离子注入,以在选定的MOS器件的沟道区产生注入层,从而永久地改变这些MOS器件的阈值电压。 公开了本发明的其它实施例,其中通过在其它层中选择性地形成的开口进行离子注入,从而在选定位置形成注入区,以在这些位置修饰所选择的MOS器件。
    • 98. 发明授权
    • Uniphase charge coupled devices
    • 单相电荷耦合器件
    • US4047215A
    • 1977-09-06
    • US545954
    • 1975-01-31
    • Robert Charles FryeHorng-Sen FuAl F. Tasch, Jr.
    • Robert Charles FryeHorng-Sen FuAl F. Tasch, Jr.
    • H01L29/762H01L21/339H01L29/10H01L29/768H01L29/78G11C19/28H01L29/04
    • H01L29/66954H01L29/1062H01L29/76866
    • A continuous gate electrode overlies the channel of the CCD and is connected to a uniphase clock pulse source for operation of the CCD. Pairs of gate conductor-insulator-semiconductor regions are defined along the channel. In each pair of regions the surface potential-gate voltage characteristic of one region intersects that of the other region, such that in the OFF condition of a clock pulse the potential well at one region of each pair is deeper than that of the other region; in the ON condition of a clock pulse, this situation is reversed. In this manner, charge packets are propagated along the channel and unidirectionality is achieved by locally implanted potential wells or potential barriers in each of the aforesaid regions. The shift in surface potential gate voltage of one of the regions in each pair of regions, to produce the required intersection, is achieved by an implanted charge accumulation layer at the insulator-semiconductor interface at those regions which, in one embodiment, are defined at locally thickened areas of the insulating layer, so that the threshold voltage is greater than an intermediate regions at which the insulator layer is thinner. In a preferred embodiment, using a uniform thickness insulating layer, the threshold voltage difference is achieved by use of local, heavily doped semiconductor regions spaced along the channel with charge accumulation layers formed at the interface between those regions and the insulating layer. Fabrication techniques employing ion implantation are described for both embodiments.
    • 连续的栅电极覆盖在CCD的通道上,并连接到用于CCD操作的单相时钟脉冲源。 栅极导体 - 绝缘体 - 半导体区域的对沿通道定义。 在每对区域中,一个区域的表面电位栅极电压特性与另一个区域的表面电位栅极电压特性相交,使得在时钟脉冲的OFF状态下,每对的一个区域的电势阱比另一个区域的电势更深; 在时钟脉冲的ON状态下,这种情况相反。 以这种方式,电荷分组沿着通道传播,并且单向性通过每个前述区域中的局部注入的势阱或势垒来实现。 通过在这些区域处的绝缘体 - 半导体界面处的注入电荷累积层来实现每对区域中的一个区域中的一个区域的表面电位栅极电压的偏移以产生所需的交点,在一个实施例中,在 绝缘层的局部加厚区域,使得阈值电压大于绝缘体层较薄的中间区域。 在优选实施例中,使用均匀厚度的绝缘层,通过使用在沟道间隔开的局部重掺杂半导体区域,在这些区域和绝缘层之间的界面处形成电荷累积层来实现阈值电压差。 对于两个实施例描述了使用离子注入的制造技术。