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    • 96. 发明申请
    • Compositions and methods for forming a semiconducting and/or silicon-containing film, and structures formed therefrom
    • 用于形成半导体和/或含硅膜的组合物和方法,以及由其形成的结构
    • US20050008880A1
    • 2005-01-13
    • US10616147
    • 2003-07-08
    • Klaus KunzeScott HaubrichFabio ZurcherBrent RidleyJoerg Rockenberger
    • Klaus KunzeScott HaubrichFabio ZurcherBrent RidleyJoerg Rockenberger
    • B32B9/04B32B13/04C09D11/00H01L21/20H01L21/208H01L21/336H01L21/44
    • C23C18/14C09D11/52C23C18/1204C23C18/1212C23C18/122C23C18/1225C23C18/127C23C18/1275H01L21/02532H01L21/02601H01L21/02636H01L29/66757Y10T428/24802Y10T428/24926Y10T428/31663
    • Compositions, inks and methods for forming a patterned silicon-containing film and patterned structures including such a film. The composition generally includes (a) passivated semiconductor nanoparticles and (b) first and second cyclic Group IVA compounds in which the cyclic species predominantly contains Si and/or Ge atoms. The ink generally includes the composition and a solvent in which the composition is soluble. The method generally includes the steps of (1) printing the composition or ink on a substrate to form a pattern, and (2) curing the patterned composition or ink. In an alternative embodiment, the method includes the steps of (i) curing either a semiconductor nanoparticle composition or at least one cyclic Group IVA compound to form a thin film, (ii) coating the thin film with the other, and (iii) curing the coated thin film to form a semiconducting thin film. The semiconducting thin film includes a sintered mixture of semiconductor nanoparticles in hydrogenated, at least partially amorphous silicon and/or germanium. The thin film exhibits improved conductivity, density, adhesion and/or carrier mobility relative to an otherwise identical structure made by an identical process, but without either the semiconductor nanoparticles or the hydrogenated Group IVA element polymer. The present invention advantageously provides semiconducting thin film structures having qualities suitable for use in electronics applications, such as display devices or RF ID tags, while enabling high-throughput printing processes that form such thin films in seconds or minutes, rather than hours or days as with conventional photolithographic processes.
    • 用于形成图案化含硅膜的组合物,油墨和方法以及包括这种膜的图案化结构。 组合物通常包括(a)钝化的半导体纳米颗粒和(b)其中环状物质主要含有Si和/或Ge原子的第一和第二环状IVA族化合物。 油墨通常包括组合物和其中组合物可溶的溶剂。 该方法通常包括以下步骤:(1)在基材上印刷组合物或油墨以形成图案,和(2)固化图案化的组合物或油墨。 在替代实施方案中,该方法包括以下步骤:(i)固化半导体纳米颗粒组合物或至少一种环状IVA族化合物以形成薄膜,(ii)将薄膜与另一种膜相涂,和(iii)固化 涂覆的薄膜形成半导体薄膜。 半导体薄膜包括在氢化,至少部分非晶硅和/或锗中的半导体纳米颗粒的烧结混合物。 相对于通过相同方法制造的其它相同结构,但不含半导体纳米颗粒或氢化IVA族元素聚合物,该薄膜表现出改进的导电性,密度,粘附性和/或载流子迁移率。 本发明有利地提供了具有适合用于电子应用(例如显示装置或RF ID标签)的质量的半导体薄膜结构,同时能够在数秒或数分钟而不是几小时或几天内形成这种薄膜的高通量印刷工艺, 与传统的光刻工艺。
    • 98. 发明授权
    • Flexible cement textured building tile and tile manufacturing process
    • 柔性水泥纹理瓷砖和瓷砖制造工艺
    • US5927034A
    • 1999-07-27
    • US718088
    • 1996-09-17
    • Larry Cole
    • Larry Cole
    • B29C67/24B32B13/04B44C5/04C04B26/06C04B28/02E04F13/14E04F15/02E04C2/00
    • E04F15/02B29C67/243B32B13/04B44C5/0438C04B26/06C04B28/02E04F13/0873E04F13/148C04B2111/00612C04B2111/50Y10T428/1476Y10T428/1486Y10T428/163
    • A building tile for covering a building surface includes a flexible backing layer having a rearward face for securing to the building surface and a forward face; and a flexible cement layer secured to the forward face. The tile preferably additionally includes adhesive material, where at least part of the rearward face is covered with the adhesive material for mounting the tile to the building surface. The flexible cement layer is preferably textured to be aesthetically appealing. The flexible cement layer preferably includes a mixture of a cement aggregate; an acrylic resin; a water-based paint; and a waterproof rubber material. The backing layer may be formed of laminate sheet material, peg board or formica sheet material. A process is also provided of manufacturing a building tile, including the steps of providing a flexible backing layer having a backing layer forward face and a backing layer rearward face; abrading the backing layer forward face; mixing an aggregate cement with an acrylic resin until a false set is reached; mixing into the aggregate cement and acrylic resin mixture a waterproof rubber material; and spreading the mixture over the backing layer forward face. The process preferably includes the additional steps of adding adhesive as needed to reach a mixture consistency suitable for spreading, coloring the mixture, texturing the mixture, and sealing the mixture using with a surface sealer.
    • 用于覆盖建筑物表面的建筑瓦片包括柔性背衬层,其具有用于固定到建筑物表面的后表面和前表面; 以及固定到前表面的柔性水泥层。 瓦片优选地另外包括粘合剂材料,其中后面的至少一部分被用于将瓦片安装到建筑物表面的粘合剂材料覆盖。 柔性水泥层优选地被纹理化以具有美学吸引力。 柔性水泥层优选包括水泥骨料的混合物; 丙烯酸树脂; 水性油漆; 和防水橡胶材料。 背衬层可以由层叠片材,栓板或甲酸板材料形成。 还提供了一种制造建筑砖的方法,包括提供具有背衬层前表面和背衬层后表面的柔性背衬层的步骤; 研磨背衬层前面; 将骨料水泥与丙烯酸树脂混合,直至达到假设; 混合成骨料水泥和丙烯酸树脂混合物一种防水橡胶材料; 并将混合物铺展在背衬层前面上。 该方法优选包括附加步骤,根据需要添加粘合剂以达到适于扩散,着色混合物,使混合物变色,以及用表面密封剂密封混合物的混合物稠度。