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    • 93. 发明授权
    • Oxygen sensor control apparatus
    • 氧传感器控制装置
    • US08959988B2
    • 2015-02-24
    • US13531203
    • 2012-06-22
    • Hiroshi InagakiKentaro Mori
    • Hiroshi InagakiKentaro Mori
    • G01N27/419G01N27/409
    • G01N27/409F01N2560/025
    • In an oxygen sensor control apparatus, a CPU obtains a correction coefficient for calibrating the relation between output value of an oxygen sensor and oxygen concentration when a fuel cut operation is performed. When the amount of scavenging air (total supply amount of air) becomes equal to or greater than a predetermined amount in each fuel cut period, the CPU calculates an average output value Ipav from a plurality of output values (concentration corresponding values) Ipr of the oxygen sensor, from which values deviating from a predetermined range R1 have been removed. Subsequently, the CPU averages the values obtained in a plurality of fuel cut periods to thereby obtain a plural-time average output value Ipavf. The CPU obtains a correction coefficient for correcting the actual output value Ip of the oxygen sensor 20 on the basis of the Ipavf value and a previously set reference output value.
    • 在氧传感器控制装置中,CPU执行校正氧传感器的输出值与进行燃料切断动作时的氧浓度之间的关系的校正系数。 当每个燃料切断期间的清扫空气量(总空气供给量)变为规定量以上时,CPU从多个输出值(浓度对应值)Ipr计算平均输出值Ipav 氧传感器,从其偏离预定范围R1的值已被去除。 随后,CPU对在多个燃料切断时段中获得的值进行平均,从而获得多次平均输出值Ipavf。 CPU根据Ipavf值和预先设定的基准输出值,求出校正氧传感器20的实际输出值Ip的校正系数。
    • 97. 发明授权
    • Apparatus for detecting concentration of nitrogen oxide
    • 用于检测氮氧化物浓度的装置
    • US07462266B2
    • 2008-12-09
    • US10329489
    • 2002-12-27
    • Shigeru MiyataNoriaki KondoHiroshi Inagaki
    • Shigeru MiyataNoriaki KondoHiroshi Inagaki
    • G01N27/407
    • G01N27/417G01N27/4074G01N27/419
    • Apparatus for detecting the NOx concentration includes a first measurement chamber 20 communicating with the gas under measurement via a diffusion rate defining layer 4d and a second measurement chamber 26 communicating with the first measurement chamber 20 via diffusion limiting layers 6d, 22d. A first pump current IP1 is controlled so that an output of a Vs cell 6 will be equal to the reference voltage VCO for controlling the oxygen concentration in the first measurement chamber 20 to a pre-set low value. A constant voltage is applied across the second pump cell 8 for decomposing the NOx component in the second measurement chamber 26 for pumping out oxygen for detecting the NOx concentration from a second pump current IP2. The sensor temperature is detected from the internal resistance of the Vs cell for controlling the current supplied to the heaters 12, 14. If the temperature of the gas under measurement is changed rapidly, the sensor temperature is changed. The detected second pump current IP2 is corrected depending on an offset of the detected sensor temperature from the target temperature assuring detection of the NOx concentration to high accuracy.
    • 用于检测NOx浓度的装置包括通过扩散速率限定层4d与测量的气体连通的第一测量室20和经由扩散限制层6d,22d与第一测量室20连通的第二测量室26。 控制第一泵电流IP1,使得Vs单元6的输出将等于用于将第一测量室20中的氧浓度控制为预定的低值的参考电压VCO。 在第二泵电池8上施加恒定电压,以分解第二测量室26中的NOx组分,以从第二泵电流IP2泵出用于检测NOx浓度的氧气。 从Vs单元的内部电阻检测传感器温度,用于控制供给到加热器12,14的电流。如果测量气体的温度快速变化,则传感器温度变化。 检测到的第二泵电流IP2根据检测到的传感器温度与目标温度的偏移量进行校正,确保将NOx浓度检测到高精度。
    • 98. 发明申请
    • Method for producing silicon wafer
    • 硅晶片的制造方法
    • US20060005762A1
    • 2006-01-12
    • US10533147
    • 2003-10-31
    • Susumu MaedaHiroshi InagakiShigeki KawashimaShoei KurosakaKozo Nakamura
    • Susumu MaedaHiroshi InagakiShigeki KawashimaShoei KurosakaKozo Nakamura
    • C30B15/00C30B21/06C30B23/00C30B30/04C30B27/02
    • C30B29/06C30B15/203
    • The present invention is to produce a silicon crystal wherein the boron concentration in the silicon crystal and the growth condition V/G are controlled so that the boron concentration in the silicon crystal is no less than 1×1018 atoms/cm3 and the growth condition V/G falls within the epitaxial defect-free region α2 whose lower limit line LN1 is the line indicating that the growth rate V gradually drops as the boron concentration increases. Further, the present invention is to produce a silicon wafer wherein the boron concentration in the silicon crystal and the growth condition V/G are controlled so as to include at least the epitaxial defect region β1, and the heat treatment condition of the silicon crystal and the oxygen concentration in the silicon crystal are controlled so that no OSF nuclei grow to OSFs. Moreover, the present invention is to produce a silicon crystal wherein the boron concentration in the silicon crystal and the growth condition V/G are controlled so that they fall in the vicinity of the lower limit line LN3 within the epitaxial defect-free region α1.
    • 本发明是为了制造硅晶体,其中硅晶体中的硼浓度和生长条件V / G被控制,使得硅晶体中的硼浓度不低于1×10 18原子/ cm 3,并且生长条件V / G落在外延无缺陷区域α2N中,其下限线LN1是表示生长速率V逐渐下降的线 硼浓度增加。 此外,本发明是为了制造硅晶片,其中硅晶体中的硼浓度和生长条件V / G被控制为至少包括外延缺陷区β1,并且 控制硅晶体的热处理条件和硅晶体中的氧浓度,使得OSF核不生长到OSF。 此外,本发明是为了制造硅晶体,其中硅晶体中的硼浓度和生长条件V / G被控制为使得它们落入外延缺陷区域内的下限线LN3附近, SUB> 1
    • 99. 发明申请
    • Process for producing single-crystal semiconductor and apparatus for producing single-crystal semiconductor
    • 单晶半导体的制造方法及单晶半导体的制造装置
    • US20050139149A1
    • 2005-06-30
    • US11005180
    • 2004-12-06
    • Susumu MaedaHiroshi InagakiShigeki KawashimaShoei KurosakaKozo Nakamura
    • Susumu MaedaHiroshi InagakiShigeki KawashimaShoei KurosakaKozo Nakamura
    • C30B15/00C30B15/20C30B15/22C30B15/36C30B29/06C30B21/06C30B27/02C30B28/10C30B30/04
    • C30B29/06C30B15/20C30B15/22C30B15/36Y10S117/90Y10T117/1004
    • A process for producing a single-crystal semiconductor and an apparatus therefor. A single-crystal semiconductor of large diameter and large weight can be lifted with the use of existing equipment not having any substantial change thereto while not influencing the oxygen concentration of single-crystal semiconductor and the temperature of melt and while not unduly raising the temperature of seed crystal. In particular, the relationship (L1, L2, L3) between the allowable temperature difference (ΔT) and the diameter (D) of seed crystal (14) is preset so that the temperature difference between the seed crystal (14) at the time the seed crystal (14) is immersed in the melt and the melt (5) falls within the allowable temperature difference (ΔT) at which dislocations are not introduced into the seed crystal (14). In accordance with the relationship (L1, L2, L3), the allowable temperature difference (ΔT) corresponding to the diameter (D) of seed crystal (14) to be immersed in the melt is determined. Temperature control is conducted so that at the time the seed crystal (14) is immersed in the melt (5) the temperature difference between the seed crystal (14) and the melt (5) falls within the determined allowable temperature difference (ΔT).
    • 一种单晶半导体的制造方法及其装置。 可以使用不具有任何显着变化的现有设备来提升大直径和大重量的单晶半导体,同时不影响单晶半导体的氧浓度和熔体的温度,同时不会过度地提高温度 晶种。 特别地,预设晶种(14)的允许温差(DeltaT)和直径(D)之间的关系(L 1,L 2,L 3),使得晶种(14)在 籽晶(14)浸入熔体中的时间和熔体(5)落入未被引入到晶种(14)中的位错的允许温度差(DeltaT)之内。 根据关系(L 1,L 2,L 3),确定与浸入熔体中的晶种(14)的直径(D)相对应的允许温度差(DeltaT)。 进行温度控制,使晶种(14)浸入熔融物(5)中时晶种(14)和熔体(5)之间的温度差落在确定的允许温差(DeltaT)之内。