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    • 92. 发明授权
    • Method for fabricating a floating gate semiconductor device
    • 浮栅半导体器件的制造方法
    • US06420249B1
    • 2002-07-16
    • US09536931
    • 2000-03-27
    • Trung Tri DoanTyler A. Lowrey
    • Trung Tri DoanTyler A. Lowrey
    • H01L218247
    • H01L29/66825H01L21/28273
    • A method for forming a floating gate semiconductor device such as an electrically erasable programmable read only memory is provided. The device includes a silicon substrate having an electrically isolated active area. A gate oxide, as well as other components of a FET (e.g., source, drain) are formed in the active area. A self aligned floating gate is formed by depositing a conductive layer (e.g., polysilicon) into the recess and over the gate oxide. The conductive layer is then chemically mechanically planarized to an endpoint of the isolation layer so that all of the conductive layer except material in the recess and on the gate oxide is removed. Following formation of the floating gate an insulating layer is formed on the floating gate and a control gate is formed on the insulating layer.
    • 提供了一种用于形成诸如电可擦除可编程只读存储器的浮置栅极半导体器件的方法。 该器件包括具有电隔离的有源区的硅衬底。 栅极氧化物以及FET的其它部件(例如,源极,漏极)形成在有源区域中。 通过将导电层(例如多晶硅)沉积到栅极氧化物上而形成自对准浮栅。 然后将导电层化学机械平面化到隔离层的端点,使得去除凹部中和栅极氧化物上的材料以外的所有导电层。 在形成浮栅之后,在浮栅上形成绝缘层,在绝缘层上形成控制栅。
    • 94. 发明授权
    • Semiconductor processing methods of forming contact openings
    • 形成接触开口的半导体加工方法
    • US06391756B1
    • 2002-05-21
    • US09387040
    • 1999-08-31
    • Pai-Hung PanLuan C. TranTyler A. Lowrey
    • Pai-Hung PanLuan C. TranTyler A. Lowrey
    • H01L2144
    • H01L27/10888H01L21/32051H01L21/76895H01L21/76897H01L27/10855H01L27/10885
    • Methods of forming contact openings, memory circuitry, and dynamic random access memory (DRAM) circuitry are described. In one implementation, an array of word lines and bit lines are formed over a substrate surface and separated by an intervening insulative layer. Conductive portions of the bit lines are outwardly exposed and a layer of material is formed over the substrate and the exposed conductive portions of the bit lines. Selected portions of the layer of material are removed along with portions of the intervening layer sufficient to (a) expose selected areas of the substrate surface and to (b) re-expose conductive portions of the bit lines. Conductive material is subsequently formed to electrically connect exposed substrate areas with associated conductive portions of individual bit lines.
    • 描述形成接触开口,存储器电路和动态随机存取存储器(DRAM)电路的方法。 在一个实施方案中,字线阵列和位线形成在衬底表面上并由中间绝缘层隔开。 位线的导电部分向外露出,并且在衬底和位线的暴露的导电部分上形成一层材料。 材料层的选定部分与中间层的部分一起被移除,足以使(a)暴露衬底表面的选定区域,并且(b)重新暴露位线的导电部分。 随后形成导电材料以将暴露的衬底区域与各个位线的相关联的导电部分电连接。