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1. 发明授权

US08066365B2 Image forming apparatus and image forming method 有权
标题翻译：图像形成装置及图像形成方法
公开(公告)号：US08066365B2
公开(公告)日：2011-11-29
申请号：US12365224
申请日：2009-02-04
申请人： Masahiko Sekimoto , Ken Hashimoto , Hiroshi Ikeda
发明人： Masahiko Sekimoto , Ken Hashimoto , Hiroshi Ikeda
IPC分类号： B41J2/01 , B41J2/015
CPC分类号： B41J2/0057
摘要： An image forming apparatus that includes: an intermediate transfer member; an ink absorbing particle supplying unit for supplying ink absorbing particles on a surface of the intermediate transfer member; an ink ejecting unit for ejecting ink to the ink absorbing particles; a transfer unit for transferring the ink absorbing particles to a recording medium; a fixing unit for fixing the transferred ink absorbing particles onto the recording medium; a particle collecting unit for collecting remaining ink absorbing particles on the intermediate transfer member; a humidity reducing unit for reducing humidity around the collected ink absorbing particles; and a particle supplying unit for supplying the ink absorbing particles with humidity reduced by the humidity reducing unit.
摘要翻译：一种图像形成装置，包括：中间转印部件; 用于在中间转印部件的表面上提供墨吸收颗粒的吸墨颗粒供给单元; 用于将油墨喷射到吸墨颗粒的喷墨单元; 用于将吸墨粒子转印到记录介质上的转印单元; 固定单元，用于将转移的吸墨颗粒固定到记录介质上; 用于收集中间转印部件上剩余的吸墨颗粒的颗粒收集单元; 用于减少收集的吸墨颗粒周围的湿度的减湿单元; 以及颗粒供给单元，用于向吸墨颗粒供给由减湿单元减少的湿度。

2. 发明申请

US20100073407A1 IMAGE FORMING APPARATUS AND IMAGE FORMING METHOD 有权
标题翻译：图像形成装置和图像形成方法
公开(公告)号：US20100073407A1
公开(公告)日：2010-03-25
申请号：US12365224
申请日：2009-02-04
申请人： Masahiko Sekimoto , Ken Hashimoto , Hiroshi Ikeda
发明人： Masahiko Sekimoto , Ken Hashimoto , Hiroshi Ikeda
IPC分类号： B41J2/01
CPC分类号： B41J2/0057
摘要： An image forming apparatus that includes: an intermediate transfer member; an ink absorbing particle supplying unit for supplying ink absorbing particles on a surface of the intermediate transfer member; an ink ejecting unit for ejecting ink to the ink absorbing particles; a transfer unit for transferring the ink absorbing particles to a recording medium; a fixing unit for fixing the transferred ink absorbing particles onto the recording medium; a particle collecting unit for collecting remaining ink absorbing particles on the intermediate transfer member; a humidity reducing unit for reducing humidity around the collected ink absorbing particles; and a particle supplying unit for supplying the ink absorbing particles with humidity reduced by the humidity reducing unit.
摘要翻译：一种图像形成装置，包括：中间转印部件; 用于在中间转印部件的表面上提供墨吸收颗粒的吸墨颗粒供给单元; 用于将油墨喷射到吸墨颗粒的喷墨单元; 用于将吸墨粒子转印到记录介质上的转印单元; 固定单元，用于将转移的吸墨颗粒固定到记录介质上; 用于收集中间转印部件上剩余的吸墨颗粒的颗粒收集单元; 用于减少收集的吸墨颗粒周围的湿度的减湿单元; 以及颗粒供给单元，用于向吸墨颗粒供给由减湿单元减少的湿度。

3. 发明授权

US08225803B2 Substrate processing method and apparatus 有权
标题翻译：基板加工方法及装置
公开(公告)号：US08225803B2
公开(公告)日：2012-07-24
申请号：US13100484
申请日：2011-05-04
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
IPC分类号： B08B13/00
CPC分类号： H01L21/68721 , C23C18/163 , C23C18/1632 , C23C18/1886 , C25D7/123 , C25D17/001 , H01L21/67126 , H01L21/67766 , Y10S134/901
摘要： A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
摘要翻译：基板处理方法和装置可以可靠地执行能够在基板的表面的必要区域中均匀镀覆的预镀处理。基板处理方法对作为预镀处理的基板的表面进行清洗处理和催化剂赋予处理，然后在基板的赋予催化剂的表面上化学镀金属膜。在通过催化剂赋予处理赋予催化剂的区域的基板的表面的更宽的区域中进行清洗处理。

4. 发明授权

US07575636B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US07575636B2
公开(公告)日：2009-08-18
申请号：US11455777
申请日：2006-06-20
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
IPC分类号： B05C3/02
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
摘要翻译：本发明涉及通过将基板浸渍在处理液中而用于电镀基板或加工基板的基板处理装置。本发明的基板处理装置包括：用于搬入和取出基板的装载/卸载区域; 用于清洁衬底的清洁区域; 以及用于电镀基板的电镀区域。装载/卸载区域设置有具有多个干用设计的手的基板传送机器人，安装有用于容纳基板的盒的装载端口和用于将基板从面朝上翻转的干式设计的反转机面对下来

5. 发明申请

US20090045068A1 Apparatus and method for plating a substrate 有权
标题翻译：电镀基板的装置及方法
公开(公告)号：US20090045068A1
公开(公告)日：2009-02-19
申请号：US12071353
申请日：2008-02-20
申请人： Masahiko Sekimoto , Fumio Kuriyama , Yasuhiko Endo , Stephen Strausser
发明人： Masahiko Sekimoto , Fumio Kuriyama , Yasuhiko Endo , Stephen Strausser
IPC分类号： C25D5/08 , C25D17/00
CPC分类号： C25D5/08
摘要： A plating apparatus and method bubbles generated at the plating surfaces easily removed and the uniformity of the thickness of the plated film within the plated surface can be improved. The plating apparatus has a cassette table for loading a cassette in which a substrate having a plating surface is contained. An aligner for aligning the substrate, a rinser-dryer for rinsing and drying the substrate, and a plating unit for plating the substrate are also provided. The plating unit includes a plating vessel containing a plating solution, and a holder holds the substrate to immerse the substrate in the plating solution in the plating vessel. The plating surface is exposed to a nozzle which ejects the plating solution toward the plating surface.
摘要翻译：可以容易地去除在电镀面上产生的电镀装置和方法，并且可以提高电镀表面内的镀膜厚度的均匀性。电镀装置具有用于装载其中包含具有电镀表面的基板的盒的盒台。还提供了用于对准衬底的校准器，用于冲洗和干燥衬底的洗衣机 - 干燥器，以及用于电镀衬底的电镀单元。电镀单元包括含有电镀液的电镀槽，保持器保持基板将基板浸入电镀槽中的电镀液中。电镀表面暴露于喷镀电镀溶液朝向电镀面的喷嘴。

6. 发明申请

US20070263028A1 Droplet discharge apparatus 审中-公开
标题翻译：滴液排放装置
公开(公告)号：US20070263028A1
公开(公告)日：2007-11-15
申请号：US11585568
申请日：2006-10-24
申请人： Takeshi Zengo , Masahiko Sekimoto , Satoshi Mohri , Toru Nishida
发明人： Takeshi Zengo , Masahiko Sekimoto , Satoshi Mohri , Toru Nishida
IPC分类号： B41J2/165
CPC分类号： B41J2/16552 , B41J2/16535 , B41J2/16585 , B41J11/007 , B41J29/17
摘要： A droplet discharge apparatus, comprising: a droplet discharge head for discharging droplets, an opposing member, facing the droplet discharge head, an applying member which applies, to the opposing member, application liquid having a characteristic of repelling liquid discharged from the droplet discharge head, and a blade which is in contact with the opposing member and cleans the opposing member, the blade having a characteristic of an affinity to the application liquid at least at a contact portion with the opposing member.
摘要翻译：一种液滴喷射装置，包括：用于排出液滴的液滴喷射头，面对液滴喷射头的相对构件;施加构件，其向相对构件施加具有排出从液滴喷射头排出的液体的特性的涂布液以及与相对构件接触并清洁相对构件的叶片，所述叶片具有至少与相对构件的接触部分对施用液体具有亲和性的特性。

7. 发明申请

US20060243205A1 Substrate processing apparatus and substrate processing method 有权
公开(公告)号：US20060243205A1
公开(公告)日：2006-11-02
申请号：US11455777
申请日：2006-06-20
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Daj
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Daj
IPC分类号： B05C3/02 , B05C13/00
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

8. 发明授权

US07087117B2 Substrate processing apparatus and substrate processing method 有权
公开(公告)号：US07087117B2
公开(公告)日：2006-08-08
申请号：US10712348
申请日：2003-11-14
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
IPC分类号： B05C5/02 , B23H7/00
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

9. 发明申请

US20050092600A1 Substrate holder, plating apparatus, and plating method 有权
标题翻译：基板支架，电镀装置和电镀方法
公开(公告)号：US20050092600A1
公开(公告)日：2005-05-05
申请号：US11002060
申请日：2004-12-03
申请人： Junichiro Yoshioka , Seiji Katsuoka , Masahiko Sekimoto , Yasuhiko Endo , Yugang Guo
发明人： Junichiro Yoshioka , Seiji Katsuoka , Masahiko Sekimoto , Yasuhiko Endo , Yugang Guo
IPC分类号： C25D7/12 , C25D17/06 , C25D19/00 , H01L21/00 , H01L21/60 , H01L21/683 , H01L21/687 , C25D17/00
CPC分类号： H01L21/67126 , C25D7/123 , C25D17/001 , C25D17/06 , H01L21/68721 , H01L21/68764 , H01L21/68785
摘要： A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.
摘要翻译：衬底保持器保持衬底，同时气密地密封衬底的外周边缘和反面，并暴露衬底的表面。衬底保持器具有基部和盖，其具有限定在其中的开口并且定位成将基板放置在基部和盖之间。吸引机构将基部和盖彼此连接以将基板保持在基部和盖之间，其中基板的表面通过开口露出。

10. 发明授权

US06682408B2 Polishing apparatus 失效
公开(公告)号：US06682408B2
公开(公告)日：2004-01-27
申请号：US10026763
申请日：2001-12-27
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B100
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

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