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1. 发明授权

US08225803B2 Substrate processing method and apparatus 有权
标题翻译：基板加工方法及装置
公开(公告)号：US08225803B2
公开(公告)日：2012-07-24
申请号：US13100484
申请日：2011-05-04
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
IPC分类号： B08B13/00
CPC分类号： H01L21/68721 , C23C18/163 , C23C18/1632 , C23C18/1886 , C25D7/123 , C25D17/001 , H01L21/67126 , H01L21/67766 , Y10S134/901
摘要： A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
摘要翻译：基板处理方法和装置可以可靠地执行能够在基板的表面的必要区域中均匀镀覆的预镀处理。基板处理方法对作为预镀处理的基板的表面进行清洗处理和催化剂赋予处理，然后在基板的赋予催化剂的表面上化学镀金属膜。在通过催化剂赋予处理赋予催化剂的区域的基板的表面的更宽的区域中进行清洗处理。

2. 发明申请

US20110203518A1 SUBSTRATE PROCESSING METHOD AND APPARATUS 有权
标题翻译：基板加工方法和装置
公开(公告)号：US20110203518A1
公开(公告)日：2011-08-25
申请号：US13100484
申请日：2011-05-04
申请人： Seiji KATSUOKA , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
发明人： Seiji KATSUOKA , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
IPC分类号： B05C11/00
CPC分类号： H01L21/68721 , C23C18/163 , C23C18/1632 , C23C18/1886 , C25D7/123 , C25D17/001 , H01L21/67126 , H01L21/67766 , Y10S134/901
摘要： A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
摘要翻译：基板处理方法和装置可以可靠地执行能够在基板的表面的必要区域中均匀镀覆的预镀处理。基板处理方法对作为预镀处理的基板的表面进行清洗处理和催化剂赋予处理，然后在基板的赋予催化剂的表面上化学镀金属膜。在通过催化剂赋予处理赋予催化剂的区域的基板的表面的更宽的区域中进行清洗处理。

3. 发明申请

US20100221432A1 SUBSTRATE PROCESSING METHOD AND APPARATUS 有权
标题翻译：基板加工方法和装置
公开(公告)号：US20100221432A1
公开(公告)日：2010-09-02
申请号：US12771176
申请日：2010-04-30
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
IPC分类号： B05D3/10
CPC分类号： H01L21/68721 , C23C18/163 , C23C18/1632 , C23C18/1886 , C25D7/123 , C25D17/001 , H01L21/67126 , H01L21/67766 , Y10S134/901
摘要： A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
摘要翻译：基板处理方法和装置可以可靠地执行能够在基板的表面的必要区域中均匀镀覆的预镀处理。基板处理方法对作为预镀处理的基板的表面进行清洗处理和催化剂赋予处理，然后在基板的赋予催化剂的表面上化学镀金属膜。在通过催化剂赋予处理赋予催化剂的区域的基板的表面的更宽的区域中进行清洗处理。

4. 发明申请

US20050158478A1 Substrate processing apparatus and substrate processing method 审中-公开
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US20050158478A1
公开(公告)日：2005-07-21
申请号：US10514030
申请日：2003-05-30
申请人： Seiji Katsuoka , Masahiko Sekimoto , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima , Toshio Yokoyama
发明人： Seiji Katsuoka , Masahiko Sekimoto , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima , Toshio Yokoyama
IPC分类号： C23C18/16 , C25D7/12 , C25D17/00 , C25D17/02 , H01L21/00 , B05D1/18 , B05C3/00
CPC分类号： H01L21/67051 , C23C18/1619 , C25D7/123 , C25D17/001 , C25D17/02
摘要： A substrate processing apparatus has a processing tank (10) for plating a substrate (W) in a plating solution (Q) holds therein, a cover (40) for selectively opening and closing an opening (11) of the processing tank (10), a spraying nozzle (60) mounted on an upper surface of the cover (40), and a substrate head (80) for attracting a reverse side of the substrate (W) to hold the substrate (W). With the cover (40) removed from the opening (11) of the processing tank (10), the substrate head (80) is lowered to dip the substrate (W) in the plating solution (Q) for thereby plating the substrate (W). When the substrate head (80) is lifted and the opening (11) of the processing tank (10) is closed by the cover (40), the substrate (W) is cleaned by the spraying nozzle (60).
摘要翻译：基板处理装置具有用于对电镀液（Q）中保持的基板（W）进行电镀的处理槽（10），用于选择性地打开和关闭处理槽（10）的开口（11）的盖（40），安装在所述盖（40）的上表面上的喷嘴（60），以及用于吸引所述基板（W）的背面以保持所述基板（W）的基板头（80）。在从处理槽（10）的开口（11）移除盖（40）的同时，将基板头（80）下降以将基板（W）浸入电镀液（Q）中，从而对基板（W ）。当基板头（80）抬起并且处理槽（10）的开口（11）被盖（40）封闭时，基板（W）被喷嘴（60）清洁。

5. 发明授权

US07959977B2 Substrate processing method and apparatus 有权
标题翻译：基板加工方法及装置
公开(公告)号：US07959977B2
公开(公告)日：2011-06-14
申请号：US12771176
申请日：2010-04-30
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
IPC分类号： B05D3/10 , C23C18/18 , C23C18/28 , C23C18/30
CPC分类号： H01L21/68721 , C23C18/163 , C23C18/1632 , C23C18/1886 , C25D7/123 , C25D17/001 , H01L21/67126 , H01L21/67766 , Y10S134/901
摘要： A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
摘要翻译：基板处理方法和装置可以可靠地执行能够在基板的表面的必要区域中均匀镀覆的预镀处理。基板处理方法对作为预镀处理的基板的表面进行清洗处理和催化剂赋予处理，然后在基板的赋予催化剂的表面上化学镀金属膜。在通过催化剂赋予处理赋予催化剂的区域的基板的表面的更宽的区域中进行清洗处理。

6. 发明授权

US07735451B2 Substrate processing method and apparatus 有权
标题翻译：基板加工方法及装置
公开(公告)号：US07735451B2
公开(公告)日：2010-06-15
申请号：US10712373
申请日：2003-11-14
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
IPC分类号： B05C21/00
CPC分类号： H01L21/68721 , C23C18/163 , C23C18/1632 , C23C18/1886 , C25D7/123 , C25D17/001 , H01L21/67126 , H01L21/67766 , Y10S134/901
摘要： A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
摘要翻译：基板处理方法和装置可以可靠地执行能够在基板的表面的必要区域中均匀镀覆的预镀处理。基板处理方法对作为预镀处理的基板的表面进行清洗处理和催化剂赋予处理，然后在基板的赋予催化剂的表面上化学镀金属膜。在通过催化剂赋予处理赋予催化剂的区域的基板的表面的更宽的区域中进行清洗处理。

7. 发明授权

US07235135B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US07235135B2
公开(公告)日：2007-06-26
申请号：US10458184
申请日：2003-06-11
申请人： Mitsuru Miyazaki , Seiji Katsuoka , Teruyuki Watanabe , Yasuyuki Motojima
发明人： Mitsuru Miyazaki , Seiji Katsuoka , Teruyuki Watanabe , Yasuyuki Motojima
IPC分类号： B05C3/00
CPC分类号： H01L21/288 , H01L21/67051 , H01L21/6715 , H01L21/67219 , H01L21/76843 , H01L21/76849 , H01L21/76873 , Y10T29/41
摘要： The present invention relates to a substrate processing apparatus and a substrate processing method suitable for processing a substrate with a plurality of liquids. A substrate processing apparatus comprises a substrate holding device for holding a substrate, a container having an opening portion disposed so that the opening portion is opposed to a surface, to be processed, of the substrate, a driving device for moving the container or the substrate holding device between a position at which the container approaches the substrate or a position at which the substrate enters the container, and a position at which the container is positioned away from the substrate, a first treatment liquid supply device for bringing the surface, to be processed, of the substrate which has approached or entered the container into a first treatment liquid, a covering member for covering the opening portion of the container at the position at which the container is positioned away from the substrate, and a second treatment liquid supply device for bringing the surface, to be processed, of the substrate into a second treatment liquid in a state in which the opening portion of the container is covered with the covering member.
摘要翻译：本发明涉及适用于处理具有多种液体的基板的基板处理装置和基板处理方法。基板处理装置包括用于保持基板的基板保持装置，具有开口部的容器，该开口部设置成使得开口部与待处理的表面相对，基板的移动容器或基板的驱动装置保持装置在容器接近基板的位置或基板进入容器的位置之间，以及容器位于远离基板的位置，第一处理液供给装置，用于使表面成为已经接近或进入容器的基板被处理成第一处理液体;覆盖部件，用于在容器位于远离基板的位置处覆盖容器的开口部分;以及第二处理液体供应装置用于使基板的待处理表面在开口的状态下进入第二处理液容器的离子被覆盖部件覆盖。

8. 发明申请

US20070214620A1 Substrate processing apparatus and substrate processing method 审中-公开
公开(公告)号：US20070214620A1
公开(公告)日：2007-09-20
申请号：US11802352
申请日：2007-05-22
申请人： Mitsuru Miyazaki , Seiji Katsuoka , Teruyuki Watanabe , Yasuyuki Motojima
发明人： Mitsuru Miyazaki , Seiji Katsuoka , Teruyuki Watanabe , Yasuyuki Motojima
IPC分类号： H01L21/00
CPC分类号： H01L21/67173 , H01L21/67051 , H01L21/67109 , H01L21/6723
摘要： The present invention relates to a substrate processing apparatus and a substrate processing method suitable for processing a substrate with a plurality of liquids. A substrate processing apparatus comprises a substrate holding device for holding a substrate, a container having an opening portion disposed so that the opening portion is opposed to a surface, to be processed, of the substrate, a driving device for moving the container or the substrate holding device between a position at which the container approaches the substrate or a position at which the substrate enters the container, and a position at which the container is positioned away from the substrate, a first treatment liquid supply device for bringing the surface, to be processed, of the substrate which has approached or entered the container into a first treatment liquid, a covering member for covering the opening portion of the container at the position at which the container is positioned away from the substrate, and a second treatment liquid supply device for bringing the surface, to be processed, of the substrate into a second treatment liquid in a state in which the opening portion of the container is covered with the covering member.

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