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1. 发明授权

US08048282B2 Apparatus and method for plating a substrate 有权
标题翻译：电镀基板的装置及方法
公开(公告)号：US08048282B2
公开(公告)日：2011-11-01
申请号：US12071353
申请日：2008-02-20
申请人： Masahiko Sekimoto , Fumio Kuriyama , Yasuhiko Endo , Stephen Strausser
发明人： Masahiko Sekimoto , Fumio Kuriyama , Yasuhiko Endo , Stephen Strausser
IPC分类号： C25D5/02 , C25D17/00
CPC分类号： C25D5/08
摘要： A plating apparatus and method bubbles generated at the plating surfaces easily removed and the uniformity of the thickness of the plated film within the plated surface can be improved. The plating apparatus has a cassette table for loading a cassette in which a substrate having a plating surface is contained. An aligner for aligning the substrate, a rinser-dryer for rinsing and drying the substrate, and a plating unit for plating the substrate are also provided. The plating unit includes a plating vessel containing a plating solution, and a holder holds the substrate to immerse the substrate in the plating solution in the plating vessel. The plating surface is exposed to a nozzle which ejects the plating solution toward the plating surface.
摘要翻译：可以容易地去除在电镀面上产生的电镀装置和方法，并且可以提高电镀表面内的镀膜厚度的均匀性。电镀装置具有用于装载其中包含具有电镀表面的基板的盒的盒台。还提供了用于对准衬底的校准器，用于冲洗和干燥衬底的洗衣机 - 干燥器，以及用于电镀衬底的电镀单元。电镀单元包括含有电镀液的电镀槽，保持器保持基板将基板浸入电镀槽中的电镀液中。电镀表面暴露于喷镀电镀溶液朝向电镀面的喷嘴。

2. 发明申请

US20130015075A1 PLATING APPARATUS AND PLATING METHOD 审中-公开
公开(公告)号：US20130015075A1
公开(公告)日：2013-01-17
申请号：US13616050
申请日：2012-09-14
申请人： Masahiko SEKIMOTO , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami , Kenji Kamoda
发明人： Masahiko SEKIMOTO , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami , Kenji Kamoda
IPC分类号： C25D5/02 , C25D17/00
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.

3. 发明申请

US20060141157A1 Plating apparatus and plating method 审中-公开
标题翻译：电镀装置及电镀方法
公开(公告)号：US20060141157A1
公开(公告)日：2006-06-29
申请号：US10544623
申请日：2004-05-25
申请人： Masahiko Sekimoto , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami
发明人： Masahiko Sekimoto , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami
IPC分类号： B05D1/32 , B05D3/00 , B05D1/18 , B05C11/00 , B05C3/00 , B05D5/00
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
摘要翻译：电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理，被配置为在灰化过程之后向基板的表面提供亲水性。电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504）种子层形成在基底上。

4. 发明申请

US20090301395A1 PLATING APPARATUS AND PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：US20090301395A1
公开(公告)日：2009-12-10
申请号：US12543832
申请日：2009-08-19
申请人： Masahiko SEKIMOTO , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami , Kenji Kamoda
发明人： Masahiko SEKIMOTO , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami , Kenji Kamoda
IPC分类号： B05C13/02
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
摘要翻译：电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理，被配置为在灰化过程之后向基板的表面提供亲水性。电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504）种子层形成在基底上。

5. 发明申请

US20090045068A1 Apparatus and method for plating a substrate 有权
标题翻译：电镀基板的装置及方法
公开(公告)号：US20090045068A1
公开(公告)日：2009-02-19
申请号：US12071353
申请日：2008-02-20
申请人： Masahiko Sekimoto , Fumio Kuriyama , Yasuhiko Endo , Stephen Strausser
发明人： Masahiko Sekimoto , Fumio Kuriyama , Yasuhiko Endo , Stephen Strausser
IPC分类号： C25D5/08 , C25D17/00
CPC分类号： C25D5/08
摘要： A plating apparatus and method bubbles generated at the plating surfaces easily removed and the uniformity of the thickness of the plated film within the plated surface can be improved. The plating apparatus has a cassette table for loading a cassette in which a substrate having a plating surface is contained. An aligner for aligning the substrate, a rinser-dryer for rinsing and drying the substrate, and a plating unit for plating the substrate are also provided. The plating unit includes a plating vessel containing a plating solution, and a holder holds the substrate to immerse the substrate in the plating solution in the plating vessel. The plating surface is exposed to a nozzle which ejects the plating solution toward the plating surface.
摘要翻译：可以容易地去除在电镀面上产生的电镀装置和方法，并且可以提高电镀表面内的镀膜厚度的均匀性。电镀装置具有用于装载其中包含具有电镀表面的基板的盒的盒台。还提供了用于对准衬底的校准器，用于冲洗和干燥衬底的洗衣机 - 干燥器，以及用于电镀衬底的电镀单元。电镀单元包括含有电镀液的电镀槽，保持器保持基板将基板浸入电镀槽中的电镀液中。电镀表面暴露于喷镀电镀溶液朝向电镀面的喷嘴。

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