会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Substrate holder, plating apparatus, and plating method
    • 基板支架,电镀装置和电镀方法
    • US08133376B2
    • 2012-03-13
    • US12871083
    • 2010-08-30
    • Junichiro YoshiokaSeiji KatsuokaMasahiko SekimotoYasuhiko EndoYugang Guo
    • Junichiro YoshiokaSeiji KatsuokaMasahiko SekimotoYasuhiko EndoYugang Guo
    • C25D7/12
    • H01L21/67126C25D7/123C25D17/001C25D17/06H01L21/68721H01L21/68764H01L21/68785
    • A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.
    • 一种电镀方法和电镀装置,其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽,与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽,用于将衬底保持在垂直取向的衬底保持器,垂直位移机构 用于将衬底保持器和由此保持在电镀液中的电镀溶液中的衬底垂直浸入电镀槽中,以及横向移位机构或前后移位机构,用于使衬底保持器移动,同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站,以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。
    • 4. 发明申请
    • SUBSTRATE HOLDER, PLATING APPARATUS, AND PLATING METHOD
    • 基板支架,镀层装置和镀层方法
    • US20100320090A1
    • 2010-12-23
    • US12871083
    • 2010-08-30
    • Junichiro YOSHIOKASeiji KatsuokaMasahiko SekimotoYasuhiko EndoYugang Guo
    • Junichiro YOSHIOKASeiji KatsuokaMasahiko SekimotoYasuhiko EndoYugang Guo
    • C25D7/12
    • H01L21/67126C25D7/123C25D17/001C25D17/06H01L21/68721H01L21/68764H01L21/68785
    • A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.
    • 一种电镀方法和电镀装置,其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽,与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽,用于将衬底保持在垂直取向的衬底保持器,垂直位移机构 用于将衬底保持器和由此保持在电镀液中的电镀溶液中的衬底垂直浸入电镀槽中,以及横向移位机构或前后移位机构,用于使衬底保持器移动,同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站,以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。
    • 5. 发明授权
    • Substrate holder, plating apparatus, and plating method
    • 基板支架,电镀装置和电镀方法
    • US07807027B2
    • 2010-10-05
    • US11002060
    • 2004-12-03
    • Junichiro YoshiokaSeiji KatsuokaMasahiko SekimotoYasuhiko EndoYugang Guo
    • Junichiro YoshiokaSeiji KatsuokaMasahiko SekimotoYasuhiko EndoYugang Guo
    • C25D17/00
    • H01L21/67126C25D7/123C25D17/001C25D17/06H01L21/68721H01L21/68764H01L21/68785
    • A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.
    • 一种电镀方法和电镀装置,其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽,与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽,用于将衬底保持在垂直取向的衬底保持器,垂直位移机构 用于将衬底保持器和由此保持在镀液中的衬底垂直浸入电镀槽中,以及横向移位机构或前后移位机构,用于使衬底保持器移动,同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站,以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。