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    • 1. 发明授权
    • Method of generating power vectors for cell power dissipation simulation
    • 为单元功耗模拟生成功率矢量的方法
    • US5673420A
    • 1997-09-30
    • US702852
    • 1996-08-26
    • Alberto J. ReyesGary K. YeapJames P. Garvey
    • Alberto J. ReyesGary K. YeapJames P. Garvey
    • G06F17/50
    • G06F17/5022G06F2217/78
    • A method of generating power vectors to calculate power dissipation for a circuit cell is provided. The method involves formulating the Boolean equations (30) that describe the logical operation for a circuit cell (10). Primitive power vectors that cause an output to transition are generated (32) using Boolean difference functions. Internal power vectors that cause an internal node to transition without transitioning the output are generated (34) using Boolean difference functions. Static power vectors with all possible steady state inputs are also generated (36). The power vectors are minimized (38) to eliminate redundant vectors. The resulting power vectors can be used in a circuit simulation in evaluating (40) the power dissipation of a designed logic circuit.
    • 提供了一种产生功率矢量以计算电路单元的功耗的方法。 该方法涉及制定描述电路单元(10)的逻辑运算的布尔方程(30)。 使用布尔差函数生成导致输出转换的原始权力向量(32)。 使用布尔差分函数生成导致内部节点转换而不转换输出的内部功率矢量(34)。 还产生具有所有可能的稳态输入的静态功率矢量(36)。 功率矢量被最小化(38)以消除冗余矢量。 所得到的功率矢量可以用于评估(40)设计的逻辑电路的功率耗散的电路仿真。
    • 5. 发明授权
    • Two-chip co-design and co-optimization in three-dimensional integrated circuit net assignment
    • 双芯片协同设计和协同优化三维集成电路网络分配
    • US08392870B2
    • 2013-03-05
    • US13019280
    • 2011-02-01
    • Yifan ZhangGary K. YeapYonghua LiaoDalei Wang
    • Yifan ZhangGary K. YeapYonghua LiaoDalei Wang
    • G06F17/50
    • G06F17/505G06F2217/86
    • A method of generating optimized input/output (IO) pair and inter-chip connection combinations for two chips is described. In this method, first and second designs for two chips can be specified. Then inter-chip signals based on the first and second designs can be specified. IO pairs for the first and second chips can be determined based on the inter-chip signals. At this point, electrical contacts between micro-bumps (MBs) of the first and second chips can be formed. Inter-chip paths with through-silicon-vias (TSVs) and MBs of the first and second chips can also be formed. At this point, the costs of assigning the IO pairs to the inter-chip paths can be determined. A cost matrix can be built based on these costs. A bipartite matching algorithm can be applied to the cost matrix to determine the optimized IO pair and inter-chip path combinations.
    • 描述了为两个芯片生成优化的输入/输出(IO)对和芯片间连接组合的方法。 在该方法中,可以指定用于两个芯片的第一和第二设计。 那么可以指定基于第一和第二设计的片间信号。 可以基于芯片间信号来确定用于第一和第二芯片的IO对。 此时,可以形成第一和第二芯片的微凸块(MB)之间的电接触。 还可以形成具有第一和第二芯片的通硅通孔(TSV)和MB的芯片间路径。 此时,可以确定将IO对分配给芯片间路径的成本。 可以基于这些成本构建成本矩阵。 二分法匹配算法可以应用于成本矩阵,以确定优化的IO对和芯片间路径组合。
    • 8. 发明授权
    • Design-for-test-aware hierarchical design planning
    • 设计为测试感知层次设计规划
    • US07937677B2
    • 2011-05-03
    • US12123209
    • 2008-05-19
    • Hung-Chun ChienBen MathewPadmashree TakkarsBang LiuChang-Wei TaiXiao-Ming XiongGary K. Yeap
    • Hung-Chun ChienBen MathewPadmashree TakkarsBang LiuChang-Wei TaiXiao-Ming XiongGary K. Yeap
    • G06F17/50
    • G06F17/505G06F2217/14
    • Full-chip scan data can be advantageously used during design planning to minimize top-level scan wires and scan feedthroughs. The scan cells can be reordered using a modified cost function to promote connecting all scan cells in one plan group before crossing to a scan cell in another plan group. The modified cost function can take into account penalty parameters. The penalty parameters can include at least one of: membership in a plan group or a top-level physical hierarchy, size of a plan group, FLOATING/ORDERED scan element in scan data, location of endpoints of an ORDERED list, location of endpoints of a macro, and membership in a plan group containing a STOP point. Scan data, at the block-level and at the top-level, can be automatically updated to reflect the plan groups and optimized scan chains.
    • 在设计规划期间可以有利地使用全片扫描数据,以最小化顶层扫描线和扫描馈通。 扫描单元可以使用修改的成本函数重新排序,以促进连接一个计划组中的所有扫描单元,然后再与另一个计划组中的扫描单元交叉。 修改的成本函数可以考虑惩罚参数。 惩罚参数可以包括以下中的至少一个:计划组或顶层物理层次结构中的成员身份,计划组的大小,扫描数据中的FLOATING / ORDERED扫描元素,ORDERED列表的端点的位置, 宏,以及包含STOP点的计划组中的成员资格。 可以自动更新块级和顶级的扫描数据,以反映计划组和优化的扫描链。
    • 10. 发明申请
    • Two-Chip Co-Design And Co-Optimization In Three-Dimensional Integrated Circuit Net Assignment
    • 三维集成电路网络分配中的双芯片协同设计与协同优化
    • US20120198409A1
    • 2012-08-02
    • US13019280
    • 2011-02-01
    • Yifan ZhangGary K. YeapYonghua LiaoDalei Wang
    • Yifan ZhangGary K. YeapYonghua LiaoDalei Wang
    • G06F17/50
    • G06F17/505G06F2217/86
    • A method of generating optimized input/output (IO) pair and inter-chip connection combinations for two chips is described. In this method, first and second designs for two chips can be specified. Then inter-chip signals based on the first and second designs can be specified. IO pairs for the first and second chips can be determined based on the inter-chip signals. At this point, electrical contacts between micro-bumps (MBs) of the first and second chips can be formed. Inter-chip paths with through-silicon-vias (TSVs) and MBs of the first and second chips can also be formed. At this point, the costs of assigning the IO pairs to the inter-chip paths can be determined. A cost matrix can be built based on these costs. A bipartite matching algorithm can be applied to the cost matrix to determine the optimized IO pair and inter-chip path combinations.
    • 描述了为两个芯片生成优化的输入/输出(IO)对和芯片间连接组合的方法。 在该方法中,可以指定用于两个芯片的第一和第二设计。 那么可以指定基于第一和第二设计的片间信号。 可以基于芯片间信号来确定用于第一和第二芯片的IO对。 此时,可以形成第一和第二芯片的微凸块(MB)之间的电接触。 还可以形成具有第一和第二芯片的通硅通孔(TSV)和MB的芯片间路径。 此时,可以确定将IO对分配给芯片间路径的成本。 可以基于这些成本构建成本矩阵。 二分法匹配算法可以应用于成本矩阵,以确定优化的IO对和芯片间路径组合。