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    • 2. 发明公开
    • 마이크로기계 장치
    • 微生物装置
    • KR1020010050327A
    • 2001-06-15
    • KR1020000051999
    • 2000-09-04
    • 센소노르 아사
    • 다니엘라파다투테르제크비스터로이헨릭쟈코브센
    • G01P3/00
    • B81B7/0048B81B3/0072B81B2201/032B81B2203/0109G01C19/5755G01P1/006G01P15/0802G01P2015/0828Y10S73/01
    • PURPOSE: A micromechanical device is provided to reduce the assembly-related strains, stress and associated temperature-induced variations of the overall device, thus simplifying the evaluation electronics of the device. CONSTITUTION: A pedestal structure and its fabrication method provide a stress release assembly of micromechanical sensors, in particular acceleration sensors, angular rate sensors, inclination sensors or angular acceleration sensors. At least one silicon seismic mass(32) is used as sensing element. The at least one silicon seismic mass(32) is joined to the silicon frame via at least one elongate assembly pedestal, the surface of which is bonded to a covering wafer, either glass or silicon. Signals may be transmitted via buried conductors in the pedestal. The bonding area is reduced by shallow transversal recesses in the surface of the pedestal.
    • 目的:提供一种微机械装置,以减少与装置有关的应变,应力和相关温度引起的整个装置的变化,从而简化了装置的评估电子装置。 构造:基座结构及其制造方法提供微机械传感器的应力释放组件,特别是加速度传感器,角速度传感器,倾斜传感器或角加速度传感器。 至少有一个硅质量块(32)用作传感元件。 所述至少一个硅抗震块(32)经由至少一个细长的组件基座接合到所述硅框架,所述细长组件基座的表面与玻璃或硅的覆盖晶片结合。 信号可以通过基座中的埋地导体传输。 接合区域由底座表面的浅横向凹槽减少。
    • 3. 发明公开
    • 센서 패키지 및 그 제조 방법
    • 传感器封装及其制造方法
    • KR1020160070514A
    • 2016-06-20
    • KR1020140177557
    • 2014-12-10
    • 삼성전기주식회사
    • 이강현
    • G01P15/12G01P15/125H01L29/84
    • G01P15/12G01P15/125H01L29/84Y10S73/01
    • 본발명은본 발명의목적은이물질이내부로침투하는것을효과적으로차단할수 있는센서패키지및 그제조방법에관한것이다. 이를위한본 발명의실시예에따른센서패키지는, 내부에질량체가배치되는베이스, 상기베이스의일면에결합되어상기질량체가배치된공간을밀봉하는적어도하나의캡, 및상기베이스와상기캡을상호접합하는접합부재를포함하며, 상기캡은상기접합부재가접합되는접합면에적어도하나의확장홈이형성되고, 상기접합부재는상기확장홈에충진될수 있다.
    • 传感器封装及其制造方法技术领域本发明涉及传感器封装及其制造方法。 根据本发明,传感器封装可以有效地防止异物进入传感器封装的内部。 为此,根据本发明的实施例,传感器封装包括:具有布置在其中的质量的基座; 至少一个帽连接到所述基座的一个表面以密封所述质量被布置的空间; 以及接合部件,其相互接合所述基部和所述盖。 盖具有接合部件接合的接合面,并且在接合面上形成有至少一个延伸槽。 接合部件可以填充延伸槽。
    • 4. 发明授权
    • 촉감-음향정보탐지및측정장치및그방법
    • 촉감 - 음향정보탐지및측정장치및그방법
    • KR100364096B1
    • 2003-04-10
    • KR1019970700706
    • 1995-08-04
    • 아폴론' 스 앨지브라지브랄타리미티드제롬, 쟝-뽈
    • 제롬,쟝-뽈
    • G01V1/00G01V9/00
    • G01V9/00G01V1/001Y10S47/09Y10S73/01
    • PCT No. PCT/IB95/00615 Sec. 371 Date Jan. 31, 1997 Sec. 102(e) Date Jan. 31, 1997 PCT Filed Aug. 4, 1995 PCT Pub. No. WO96/04574 PCT Pub. Date Feb. 15, 1996A tactile-acoustic transducer comprises a vibrator plate, microphone means and first and second electrode members which are connected to a source of information through a tuneable network. The microphone means are coupled to a computer having display devices and a control output delivering control signals to the tuneable network. Rubbing the vibrator plate with the fingertip of his middle finger allows an operator to assess two different states of the transducer, perceived as "stick" and "non-stick" rubbing conditions, the "stick" condition being accompanied by emission of a characteristic sound and occurring when the network is tuned exactly in accordance with the phenomenon or condition of the source to be detected or measured.
    • PCT No.PCT / IB95 / 00615 Sec。 371日期1997年1月31日Sec。 102(e)日期1997年1月31日PCT申请日1995年8月4日PCT Pub。 WO96 / 04574 PCT Pub。 日期1996年2月15日触觉 - 声学换能器包括振动器板,麦克风装置以及通过可调谐网络连接到信息源的第一和第二电极构件。 麦克风装置耦合到具有显示装置和控制输出端的计算机,控制输出端向可调谐网络传送控制信号。 用他的中指的指尖摩擦振动器板允许操作者评估换能器的两种不同状态,被感知为“棒” 和“不粘” 摩擦条件,“棒” 条件伴随着特征性声音的发射,并且当网络根据要被检测或测量的源的现象或条件精确调谐时发生。