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    • 5. 发明公开
    • 광로 변환기, 상기 광로 변환기를 포함하는 반도체 레이저장치 및 상기 광로 변환기 제작 방법
    • 光学路径旋转装置,半导体激光装置,包括光学路径旋转装置和上述光学路径旋转装置制造方法
    • KR1020060124077A
    • 2006-12-05
    • KR1020050045820
    • 2005-05-30
    • 엘지전자 주식회사
    • 하종민김상천김선호
    • H01S3/10
    • H01S3/101H01S5/0071H01S5/4075
    • An optical path rotating device, a semiconductor laser apparatus including the same, and a method for manufacturing the same are provided to enhance optical efficiency and minimize the number of optical components by using a micro-machining process. A method for manufacturing an optical path rotating device(300) includes a process for forming a jig including a plurality of grooves having at least one inclined side arranged in one direction. The method further includes a process for positioning one side of a dove prism on the inclined side. The method further includes a process for depositing a mask layer on a substrate having a predetermined gradient to an upper surface, a process for removing a part of the mask layer, a process for forming the inclined side, and a process for positioning one side of the dove prism on the inclined side.
    • 提供光路旋转装置,包括该光路旋转装置的半导体激光装置及其制造方法,以通过使用微加工工艺来提高光学效率和最小化光学部件的数量。 一种光路旋转装置(300)的制造方法,其特征在于,包括形成具有沿一个方向配置有至少一个倾斜面的多个槽的夹具的工序。 该方法还包括将鸽子棱镜的一侧定位在倾斜侧的工艺。 该方法还包括用于在具有预定梯度的衬底上沉积掩模层至上表面的工艺,用于去除掩模层的一部分的工艺,形成倾斜侧的工艺以及用于定位一侧的工艺 斜面上的鸽子棱镜。
    • 9. 发明授权
    • 원형그레이팅표면방출형레이저다이오드및그어레이
    • 圆形表面发射激光二极管
    • KR100132018B1
    • 1998-04-14
    • KR1019940001404
    • 1994-01-27
    • 학교법인 포항공과대학교
    • 권오대
    • H01S5/18
    • H01S5/18386H01S5/0425H01S5/06243H01S5/105H01S5/4075H01S5/423
    • Put a base material into a vaporizer such as MOCVD or MBE, etc. Vaporize a n+ buffer layer, and an n reflection layer(14) consisting of multiple AIA-AIGaAs pairs on it. Considering periodical change of refraction rate, reflect the light in more than 90% of the reflection rate, making sure a laser should emit toward the surface of a semiconductor, not to an n+ base material(10). And ensure that the band gap energy of a activated layer(20) is smaller than the upper and lower parts of a grating layer(22,18) and the electric charge implanted from the contact area(30,32) is effectively constrained to the activated layer(20), after forming an n cladding(16) and a p cladding(24) layer into Gal-XAS, implant actively into the activated layer(20) in order to form the p+ layer(26). Then form the circular grating layer(28) onto the p+ layer(26), p contact area(30) onto the upper part of the p+ layer(26), outside of the circular grating layer(28), and n contact layer on the n+ base material.
    • 将基材放入诸如MOCVD或MBE等蒸发器中。蒸发n +缓冲层和由其上的多个AIA-AIGAAs对组成的n反射层(14)。 考虑周期性的折射率变化,将光反射到反射率的90%以上,确保激光朝向半导体的表面而不是n +基材(10)发射。 并且确保激活层(20)的带隙能量小于光栅层(22,18)的上部和下部,并且从接触区域(30,32)注入的电荷被有效地约束到 活化层(20),在将n个包层(16)和ap包层(24)层形成到Gal-XAS之后,主动地注入活化层(20)中以形成p +层(26)。 然后将圆形光栅层(28)形成到p +层(26)上,p接触区域(30)到p +层(26)的上部,在圆形光栅层(28)的外部,并且n接触层 n +基材。