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    • 4. 发明公开
    • 플래시 메모리 장치 및 그것의 소거 방법
    • 闪存存储器件及其擦除方法
    • KR1020090082755A
    • 2009-07-31
    • KR1020080008691
    • 2008-01-28
    • 삼성전자주식회사
    • 곽동훈
    • G11C16/14G11C16/16G11C16/34
    • G11C16/16G11C11/5635G11C16/0483G11C16/3404G11C16/3409G11C16/3413G11C16/30G11C16/3436
    • A flash memory device and an erasing method thereof are provided to prevent data sensing error by minimizing the change of the threshold voltage due to the coupling between the memory cells. A memory cell array(10) includes a plurality of memory blocks. A control circuit(50) controls the post program about the erased memory cells so that the minimum threshold voltage is 0V or approximate to 0V. A voltage generating circuit(60) generates the plurality of voltage used in the post program according to the control of the control circuit and the verification reading about the post program. A write/read circuit(20) perform the verification reading of the post program according to the control of the control circuit. The minimum threshold voltage is 0V or a positive or negative voltage approximate to 0V.
    • 提供闪速存储器件及其擦除方法以通过最小化由于存储器单元之间的耦合引起的阈值电压的变化来防止数据感测误差。 存储单元阵列(10)包括多个存储块。 控制电路(50)控制关于擦除的存储器单元的后期程序,使得最小阈值电压为0V或接近0V。 电压产生电路(60)根据控制电路的控制和关于后期程序的验证读数产生在后期程序中使用的多个电压。 写入/读取电路(20)根据控制电路的控制执行后期程序的验证读取。 最小阈值电压为0V或正或负电压约为0V。
    • 5. 发明公开
    • 반도체 메모리장치 및 데이터기록방법
    • 半导体存储器件及其数据写入方法,其中存储器单元包括可变电阻器
    • KR1020040048854A
    • 2004-06-10
    • KR1020030087207
    • 2003-12-03
    • 샤프 가부시키가이샤
    • 모리모토히데노리이노우에코지
    • G11C16/00
    • G11C13/0069G11C11/5685G11C13/0007G11C13/0064G11C13/0097G11C16/3413G11C2013/0073G11C2213/31G11C2213/79
    • PURPOSE: A semiconductor memory device and its data writing method are provided to erase data per memory cell and to write data at a high speed and in a high accuracy. CONSTITUTION: A memory array(50) includes a plurality of nonvolatile semiconductor memory cells(10). A gate electrode(21) of each memory cell is connected to word lines(WL00-WL0n-1) respectively. A variable resistor(30) connected to a drain area of each memory cell is connected to bit lines(BL00-BL0n-1) respectively. The memory cells are arranged in a matrix. Each memory cell in the memory array is selected by a control voltage applied to each word line and each bit line. Data is written to the selected memory cell, or is erased or read from the selected memory cell.
    • 目的:提供一种半导体存储器件及其数据写入方法,用于每个存储单元擦除数据并以高精度和高精度写入数据。 构成:存储器阵列(50)包括多个非易失性半导体存储单元(10)。 每个存储单元的栅电极(21)分别连接到字线(WL00-WL0n-1)。 连接到每个存储单元的漏极区域的可变电阻器(30)分别连接到位线(BL00-BL0n-1)。 存储单元被布置成矩阵。 通过施加到每个字线和每个位线的控制电压来选择存储器阵列中的每个存储器单元。 数据被写入所选择的存储单元,或被擦除或从所选存储单元读取。