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    • 2. 发明公开
    • 잉곳 절단 방법
    • 切割的方法
    • KR1020120090669A
    • 2012-08-17
    • KR1020110011217
    • 2011-02-08
    • 에스케이실트론 주식회사
    • 이경무정환연윤용균
    • B28D5/04B24B27/06H01L21/304
    • B28D5/045B28D5/007
    • PURPOSE: An ingot cutting method is provided to attach an ingot to an attachment block and then cut the ingot, thereby minimizing the cut of a wire. CONSTITUTION: An ingot cutting method comprises the steps of: attaching one side of an ingot(20) having a hexahedral shape to an attachment block, transferring separated wires(10) at high speed, lowering the ingot attached to the attachment block to the wires, and cutting the ingot with the wires into wafers. When attaching the ingot to the attachment block, the length of an attachment side(21) of the ingot is shorter than the length of an opposed side(22) opposite to the attachment block.
    • 目的:提供一种铸锭切割方法,将锭子连接到附接块上,然后切割锭块,从而使钢丝切割最小化。 构成:锭切割方法包括以下步骤:将具有六面体形状的锭(20)的一侧连接到附接块,高速传送分离的线(10),将附接到附接块的锭子下降到线 ,并将钢丝切割成晶圆。 当将锭附接到附接块时,锭的附接侧(21)的长度短于与附接块相对的相对侧(22)的长度。
    • 4. 发明公开
    • 래핑 캐리어
    • 快速携带
    • KR1020100065562A
    • 2010-06-17
    • KR1020080123943
    • 2008-12-08
    • 에스케이실트론 주식회사
    • 윤용균
    • H01L21/306
    • B24B37/28B24B37/08
    • PURPOSE: A lapping carrier is provided to reduce the generation of a scratch by smoothly discharging sludge through a sludge hole. CONSTITUTION: A wafer maintaining hole(60) is supported between the upper plate and the lower plate of a wafer lapping apparatus. A plurality of wafer maintaining holes is formed on a disc shape body to the circumference direction of the body. A wafer is inserted into the wafer maintaining holes to be maintained. One or more sludge holes(70, 90) discharge the sludge of lap slurry. The thickness of the body is thinner than that of the wafer.
    • 目的:提供研磨载体,通过平滑地将污泥排出污泥孔,减少划痕的产生。 构成:在晶片研磨装置的上板和下板之间支撑晶片维持孔(60)。 多个晶片保持孔相对于本体的圆周方向形成在盘形体上。 将晶片插入晶片保持孔中。 一个或多个污泥孔(70,90)排出搭接浆料的污泥。 身体的厚度比晶片的厚度薄。
    • 8. 发明公开
    • 단결정 제조장비의 도펀트 주입장치
    • 单晶生产设备的供货商
    • KR1020140094803A
    • 2014-07-31
    • KR1020130007291
    • 2013-01-23
    • 에스케이실트론 주식회사
    • 윤용균이상준김정열
    • C30B15/04C30B29/06
    • The present invention relates to a dopant feeder for a single crystal manufacturing apparatus that can input a low-melting-point dopant into silicon melt stably and uniformly even if the low-melting-point dopant is liquefied or gasified. The present invention provides a dopant feeder for a single crystal manufacturing apparatus, comprising: a crucible for containing silicon melt; a loader having a dopant to be doped with the silicon melt mounted thereon and including holes for guiding the liquefied dopant to flow down; a cover for accommodating the loader and guiding the dopant gasified from the loader into the silicon melt; and an elevation part for elevating the cover and the loader to approach the silicon melt at the side of the crucible.
    • 本发明涉及一种即使低熔点掺杂剂液化或气化也能够稳定均匀地将低熔点掺杂剂输入到硅熔体的单晶制造装置中。 本发明提供了一种用于单晶制造装置的掺杂剂进料器,包括:用于容纳硅熔体的坩埚; 一种装载器,其具有掺杂有安装在其上的硅熔体的掺杂剂,并且包括用于引导液化掺杂剂向下流动的孔; 用于容纳装载器并将从装载器气化的掺杂剂引导到硅熔体中的盖; 以及用于升高盖和装载机以在坩埚侧面接近硅熔体的高度部分。
    • 9. 发明公开
    • 웨이퍼 산화막 형성장치
    • 氧气预处理设备
    • KR1020090085330A
    • 2009-08-07
    • KR1020080011165
    • 2008-02-04
    • 에스케이실트론 주식회사
    • 윤용균이영래강희명
    • H01L21/205
    • C23C16/40C23C16/4587C23C16/46
    • An apparatus of oxygen precipitating for a wafer is provided to improve the quality of a wafer by forming a space between the wafer and an internal side of the slot wide and reducing a Quartz mark. In an apparatus of oxygen precipitating for a wafer, a tube(110) comprises a receiving part(112A). A boat(120) is formed in longitudinal direction of a task, and the boat comprises a plurality of slots in which wafer is inserted. A gas service pipe(130) is connected to a receiving part while supplying the gas to the receiving part. A heating element(140) is arranged in order to surround the boat. The heating element heats the wafer, and the width of the slot is more widely formed than the thickness of wafer with 200~250um.
    • 提供用于晶片的氧沉淀装置,以通过在晶片与槽宽的内侧之间形成空间并减少石英标记来提高晶片的质量。 在用于晶片的氧沉淀装置中,管(110)包括接收部(112A)。 在任务的纵向上形成船(120),并且船包括多个槽,其中插入有晶片。 气体管道(130)在将气体供应到接收部件的同时连接到接收部件。 布置加热元件(140)以围绕船。 加热元件加热晶片,槽的宽度比200〜250um的晶圆厚度形成得更宽。