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    • 2. 发明授权
    • 측벽 영역과 이등방성 습식 식각을 이용한 증가형 반도체탐침의 제조 방법 및 이를 이용한 정보저장장치
    • 使用异相湿蚀刻和侧壁制造增强模式半导体探针的方法,以及使用其的信息存储装置
    • KR100842923B1
    • 2008-07-03
    • KR1020070022550
    • 2007-03-07
    • 삼성전자주식회사재단법인서울대학교산학협력재단
    • 고형수박병국홍승범박철민최우영김종필송재영김상완
    • G11B9/14G11B9/02
    • H01L29/7834B82Y10/00G11B9/1409H01L21/28123H01L29/66636
    • A method of manufacturing an enhancement semiconductor probe and an information storage device using the same are provided to reduce a process variable in device performance and to increase reliability of mass production by anisotropic-wet-etching a silicon substrate using side-walls. A method of manufacturing an enhancement semiconductor probe comprises the steps of: forming a first etching mask pattern(110a) on a silicon substrate(100c) to form a tip part of the probe in a first direction and forming side-wall areas at two sides of the first etching mask pattern; anisotropic-etching the silicon substrate to form two inclined surfaces of the probe; forming source and drain areas(160,170,180,190) on the silicon substrate by injecting dopants, using the side-wall area as masks, and removing the side-wall areas; removing the first etching mask pattern; forming a second etching mask pattern to form a tip part of the probe in a second direction; forming space layers at two sides of the second etching mask pattern; and etching the silicon substrate by photographing and etching processes and removing the space layers.
    • 提供一种制造增强半导体探针的方法和使用其的信息存储装置,以减少器件性能中的工艺变量,并且通过使用侧壁对硅衬底进行各向异性湿蚀刻来提高批量生产的可靠性。 一种制造增强型半导体探针的方法包括以下步骤:在硅衬底(100c)上形成第一蚀刻掩模图案(110a),以在第一方向上形成探针的尖端部分,并在两侧形成侧壁区域 的第一蚀刻掩模图案; 各向异性蚀刻硅衬底以形成探针的两个倾斜表面; 通过注入掺杂剂在硅衬底上形成源极和漏极区域(160,170,180,190),使用侧壁区域作为掩模,并去除侧壁区域; 去除第一蚀刻掩模图案; 形成第二蚀刻掩模图案以在第二方向上形成探针的末端部分; 在第二蚀刻掩模图案的两侧形成空间层; 并通过拍摄和蚀刻工艺蚀刻硅衬底并去除空间层。
    • 7. 发明公开
    • 비휘발성 메모리 소자 및 이의 제조 방법
    • 非易失性存储器件及其制造方法
    • KR1020080034685A
    • 2008-04-22
    • KR1020060100947
    • 2006-10-17
    • 삼성전자주식회사재단법인서울대학교산학협력재단
    • 채수두김정우박찬진한정희박병국박일한
    • H01L27/115H01L21/8247
    • H01L29/792H01L29/66833H01L29/7926H01L21/28282H01L21/31144
    • An NVM(non-volatile memory) device is provided to improve electron injection efficiency by making the injection direction of electrons passing through the bottom surface of a charge trap layer have the transfer direction of electrons. A semiconductor substrate(104) includes a bottom part(104c) and a vertical part vertically protruding from the bottom part. The vertical part includes first and second vertical parts(104a,104b). A first vertical part is positioned in the upper part of the semiconductor substrate with respect to a boundary step. The second vertical part is positioned under the first vertical part, greater in width than the first vertical part and protruding to the outside of the first vertical part. A charge trap layer(134) is positioned outside the first vertical part and on the boundary step. A control gate electrode(150) is positioned on the bottom part and outside the second vertical part and the charge trap layer. A first insulation layer(124) can be interposed between the semiconductor substrate and the charge trap layer. A second insulation layer(144) can be interposed between the semiconductor substrate and the control gate electrode.
    • 提供NVM(非易失性存储器)器件以通过使通过电荷陷阱层的底表面的电子的注入方向具有电子的传输方向来提高电子注入效率。 半导体衬底(104)包括底部(104c)和从底部垂直突出的垂直部分。 垂直部分包括第一和第二垂直部分(104a,104b)。 相对于边界步骤,第一垂直部分位于半导体衬底的上部。 第二垂直部分位于第一垂直部分下方,宽度大于第一垂直部分并且突出到第一垂直部分的外侧。 电荷捕获层(134)位于第一垂直部分的外侧和边界台阶上。 控制栅电极(150)位于第二垂直部分和电荷陷阱层的底部和外部。 第一绝缘层(124)可以插入在半导体衬底和电荷陷阱层之间。 可以在半导体衬底和控制栅电极之间插入第二绝缘层(144)。
    • 10. 发明公开
    • 곡면 구조를 갖는 소노스 메모리 소자 및 그 제조방법
    • 具有弯曲表面的SONOS器件及其制造方法
    • KR1020060132418A
    • 2006-12-21
    • KR1020050052757
    • 2005-06-18
    • 재단법인서울대학교산학협력재단삼성전자주식회사
    • 박병국이정훈
    • H01L27/115
    • H01L29/792H01L21/28282H01L29/1033H01L29/4232H01L29/66833H01L29/7854H01L21/823437
    • An SONOS(Silicon Oxide Nitride Oxide Silicon) memory device and its manufacturing method are provided to restrain electrons from penetrating through a blocking oxide layer in an erase operation and to improve an erase rate of memory by obtaining a cylinder type curved structure from a multi-dielectric film using a curved upper portion of an active region. A semiconductor substrate(100) includes an active region(120a) with a curved upper portion and a field region(200). Source/drain regions are spaced apart from each other on the active region. A multi-dielectric film(300) is formed along an upper surface of the active region. The multi-dielectric film is composed of a first oxide layer(320), a nitride layer(340) and a second oxide layer(360). A gate(400) is formed on the multi-dielectric film to enclose the second oxide layer.
    • 提供了一种SONOS(氧化硅氮化物硅)存储器件及其制造方法,以在擦除操作中抑制电子穿过阻塞氧化物层,并通过从多层结构获得圆柱型弯曲结构,提高存储器的擦除率, 使用活性区域的弯曲上部的介电膜。 半导体衬底(100)包括具有弯曲上部和场区(200)的有源区(120a)。 源极/漏极区域在有源区域上彼此间隔开。 沿着有源区的上表面形成多介质膜(300)。 多介质膜由第一氧化物层(320),氮化物层(340)和第二氧化物层(360)组成。 在多电介质膜上形成栅极(400)以包围第二氧化物层。