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    • 1. 发明公开
    • 비휘발성 메모리 소자 및 이의 제조 방법
    • 非易失性存储器件及其制造方法
    • KR1020080034685A
    • 2008-04-22
    • KR1020060100947
    • 2006-10-17
    • 삼성전자주식회사재단법인서울대학교산학협력재단
    • 채수두김정우박찬진한정희박병국박일한
    • H01L27/115H01L21/8247
    • H01L29/792H01L29/66833H01L29/7926H01L21/28282H01L21/31144
    • An NVM(non-volatile memory) device is provided to improve electron injection efficiency by making the injection direction of electrons passing through the bottom surface of a charge trap layer have the transfer direction of electrons. A semiconductor substrate(104) includes a bottom part(104c) and a vertical part vertically protruding from the bottom part. The vertical part includes first and second vertical parts(104a,104b). A first vertical part is positioned in the upper part of the semiconductor substrate with respect to a boundary step. The second vertical part is positioned under the first vertical part, greater in width than the first vertical part and protruding to the outside of the first vertical part. A charge trap layer(134) is positioned outside the first vertical part and on the boundary step. A control gate electrode(150) is positioned on the bottom part and outside the second vertical part and the charge trap layer. A first insulation layer(124) can be interposed between the semiconductor substrate and the charge trap layer. A second insulation layer(144) can be interposed between the semiconductor substrate and the control gate electrode.
    • 提供NVM(非易失性存储器)器件以通过使通过电荷陷阱层的底表面的电子的注入方向具有电子的传输方向来提高电子注入效率。 半导体衬底(104)包括底部(104c)和从底部垂直突出的垂直部分。 垂直部分包括第一和第二垂直部分(104a,104b)。 相对于边界步骤,第一垂直部分位于半导体衬底的上部。 第二垂直部分位于第一垂直部分下方,宽度大于第一垂直部分并且突出到第一垂直部分的外侧。 电荷捕获层(134)位于第一垂直部分的外侧和边界台阶上。 控制栅电极(150)位于第二垂直部分和电荷陷阱层的底部和外部。 第一绝缘层(124)可以插入在半导体衬底和电荷陷阱层之间。 可以在半导体衬底和控制栅电极之间插入第二绝缘层(144)。
    • 4. 发明公开
    • 낸드형 플래시 메모리 어레이 및 그 동작 방법
    • NAND型闪存阵列及其工作方法
    • KR1020060128567A
    • 2006-12-14
    • KR1020050050108
    • 2005-06-11
    • 재단법인서울대학교산학협력재단삼성전자주식회사
    • 박병국박일한김태훈
    • H01L27/115
    • G11C16/0483H01L27/115G11C16/0408
    • A NAND-type flash memory array and an operating method thereof are provided to reduce program disturbance by using a body biasing contact region connected to an active region on a lower portion of a side of a second select gate line. At least one bit line(B/L0,B/L1) is formed on an SOI substrate. A first select transistor, plural memory cells, and a second select transistor are serially connected to each bit line by their geared sources and drains. The source of the second select transistor is electrically connected to a common source line(CSL) vertically arranged to the bit line. A gate of the first select transistor and a gate of the second select transistor are respectively connected to a first select gate line(SSL) and a second select gate line(GSL) arranged to be crossed with the bit line. Gates of the memory cells are respectively connected to plural word lines(W/L0,W/L1) arranged to be crossed with the bit line. A body biasing contact region(BBC) is connected to an active region on a lower portion of a side of the second select gate line.
    • 提供NAND型闪速存储器阵列及其操作方法以通过使用与第二选择栅极线的一侧的下部的有源区连接的主体偏置接触区域来减少编程干扰。 在SOI衬底上形成至少一个位线(B / L0,B / L1)。 第一选择晶体管,多个存储单元和第二选择晶体管通过其齿轮源和排水管串联连接到每个位线。 第二选择晶体管的源极电连接到垂直地布置到位线的公共源极线(CSL)。 第一选择晶体管的栅极和第二选择晶体管的栅极分别连接到布置成与位线交叉的第一选择栅极线(SSL)和第二选择栅极线(GSL)。 存储单元的门分别连接到布置成与位线交叉的多个字线(W / L0,W / L1)。 主体偏置接触区域(BBC)连接到第二选择栅线的一侧的下部的有源区域。
    • 6. 发明公开
    • 수직 적층구조를 갖는 앤드형 플래시 메모리 어레이와 그제작방법 및 동작방법
    • 和具有垂直堆叠结构和制造方法的类型的闪存存储阵列及其操作方法
    • KR1020090118299A
    • 2009-11-18
    • KR1020080044005
    • 2008-05-13
    • 재단법인서울대학교산학협력재단
    • 박병국박일한심원보
    • H01L21/8247H01L27/115
    • H01L27/2463H01L21/28273H01L27/11521H01L27/11551H01L27/2436
    • PURPOSE: An AND type flash memory array of a vertical laminate structure, a manufacturing method thereof, and an operating method are provided to perform high integration by forming a local bit line and a local source line in a silicon pin of each layer. CONSTITUTION: An AND type flash memory array of a vertical laminate structure includes one or more bit lines, a local bit line, a memory cell, a local source line, a common source line, a drain selecting line, a source selecting line, and word lines. The local bit line is connected to each bit line(98a,98b,98c) by a first selecting transistor. A plurality of memory cells are parallel connected by using the local bit line as a common drain line. The local source line is commonly connected to a source of each memory cell. The common source line is vertically arranged with each bit line in which the local source line is connected by a second selecting transistor. The drain selecting line and the source selecting line are connected to a gate of the first selecting transistor and a gate of the second selecting transistor. The word lines are connected to a gate of each memory cell.
    • 目的:提供垂直层压结构的AND型闪速存储器阵列,其制造方法和操作方法,以通过在每层的硅引脚中形成局部位线和局部源极线来执行高集成度。 构成:垂直层叠结构的AND型闪速存储阵列包括一个或多个位线,局部位线,存储单元,局部源极线,公共源极线,漏极选择线,源选择线和 字线。 局部位线由第一选择晶体管连接到每个位线(98a,98b,98c)。 多个存储单元通过使用本地位线作为公共漏极线并联连接。 本地源线通常连接到每个存储单元的源。 公共源极线垂直地布置有每个位线,其中本地源极线通过第二选择晶体管连接。 漏极选择线和源选择线连接到第一选择晶体管的栅极和第二选择晶体管的栅极。 字线连接到每个存储单元的门。
    • 7. 发明授权
    • 함몰된 채널에 분리 게이트를 갖는 플래시 메모리 소자와이를 이용한 플래시 메모리 어레이 및 그 제조방법
    • 带有分离栅的闪存存储器件,使用相同器件的闪存存储器阵列及其制造方法
    • KR100866261B1
    • 2008-10-31
    • KR1020070064262
    • 2007-06-28
    • 재단법인서울대학교산학협력재단
    • 박병국박세환박일한
    • H01L27/115
    • H01L27/11568H01L21/28273H01L21/28282H01L21/823493H01L27/11521
    • A flash memory array using the same device and a method of fabricating the same are provided to solve the interference of stored bit and improve the degree of integration by using a vertical structure to fabricate a charge storage region and a region having a gate insulating layer in self-alignment. A flash memory device with a split gate over a recessed channel comprises a source/drain region(12a) on a semiconductor substrate; a recessed channel region between the source and the drain; a separation gate(50a) between the channel region and a first insulating layer; a second isolating layer formed on the separation gate; a third insulating layer formed on the both channel region, not contacted with the separation gate; a charge storage region(70a) formed on the third insulating layer; a forth insulating layer formed on the source and drain region; a program gate formed on the fourth and second insulating layer, between the charge storage region and the fifth insulating layer.
    • 提供使用相同装置的闪存阵列及其制造方法,以解决存储的位的干扰并通过使用垂直结构来提高积分的程度来制造电荷存储区域和具有栅极绝缘层的区域 自对准。 在凹陷通道上具有分割栅极的闪速存储器件包括半导体衬底上的源极/漏极区域(12a); 在源极和漏极之间的凹陷沟道区域; 在所述沟道区域和第一绝缘层之间的分离栅极(50a); 形成在分离门上的第二隔离层; 形成在所述两通道区域上的不与所述分离栅接触的第三绝缘层; 形成在所述第三绝缘层上的电荷存储区域(70a) 形成在源区和漏区上的第四绝缘层; 形成在第四绝缘层和第二绝缘层之间的程序栅极,在电荷存储区域和第五绝缘层之间。
    • 8. 发明授权
    • 수직채널 이중 게이트 구조를 갖는 메모리 셀
    • 具有垂直通道和双门结构的存储单元设备
    • KR100784930B1
    • 2007-12-11
    • KR1020060093138
    • 2006-09-25
    • 재단법인서울대학교산학협력재단
    • 박병국박일한
    • H01L27/115H01L21/8247
    • H01L27/115H01L27/11568G11C16/0483H01L21/28282H01L27/2463
    • A memory cell device having a vertical channel and a double gate structure are provided to enhance a degree of integration by forming an active region of a pillar shape with a first to third semiconductor layers. An active region(20) of a pillar shape includes a first semiconductor layer(22) for forming a first source/drain region, a second semiconductor layer(24) for forming a second source/drain region, and a third semiconductor layer(26) for forming body and channel regions between the first and second semiconductor layers. A field region(40) is formed to separate the active region of the pillar shape. A first insulating layer(50) is formed with two or more dielectric layers including an electric charge trap layer formed on a sidewall of the active region of the pillar shape. A second insulating layer is formed with one or more dielectric layers which are formed at an upper end of the first semiconductor layer and an upper end of the field region. A control gate(70) is formed on the first and the second insulating layers.
    • 提供具有垂直沟道和双栅极结构的存储单元器件,以通过形成具有第一至第三半导体层的柱状的有源区域来增强集成度。 柱状的有源区域(20)包括用于形成第一源极/漏极区域的第一半导体层(22),用于形成第二源极/漏极区域的第二半导体层(24)和第三半导体层(26) ),用于在第一和第二半导体层之间形成体和沟道区。 形成场区域(40)以分离柱状活性区域。 第一绝缘层(50)形成有两个或更多个介电层,包括形成在柱状活性区域的侧壁上的电荷陷阱层。 第二绝缘层形成有形成在第一半导体层的上端和场区的上端的一个或多个电介质层。 在第一和第二绝缘层上形成控制栅极(70)。
    • 10. 发明公开
    • 불휘발성 메모리 장치 및 그것의 동작 방법
    • 非易失性存储器件及其操作方法
    • KR1020160012300A
    • 2016-02-03
    • KR1020140093320
    • 2014-07-23
    • 삼성전자주식회사
    • 김지석박일한송중호
    • G11C16/34G11C16/06
    • G11C16/3459G11C11/5628G11C16/107G11C16/26
    • 본발명의실시예에따른불휘발성메모리장치의프로그램방법은: 선택된메모리셀들로프로그램전압을인가하는단계; 상기프로그램전압이인가된메모리셀들에연결된비트라인들로선택된검증전압을인가하는단계; 상기검증전압이인가된메모리셀들에대해센싱동작을수행하는단계; 상기센싱결과및 타깃상태데이터를참조하여타깃상태로프로그램되는메모리셀들을선택하는단계; 그리고상기선택된메모리셀들이프로그램패스또는페일되었는지여부를판단하는단계를포함할수 있다. 본발명의실시예에따르면, 프로그램검증속도를향상시켜, 프로그램시간을단축할수 있다.
    • 根据本发明的实施例,一种用于非易失性存储器件编程的方法包括以下步骤:将程序电压施加到选择的存储器单元; 将选择的验证电压施加到连接到应用了编程电压的存储单元的位线; 感测应用了验证电压的存储单元; 通过参考感测结果和目标状态数据选择被编程到目标状态的存储器单元; 以及确定所选择的存储器单元的编程是否通过或失败。 根据本发明的实施例,增加了程序验证速度以缩短编程时间。