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    • 5. 发明公开
    • 불휘발성 메모리 장치의 제조 방법
    • 制造非易失性存储器件的方法
    • KR1020080011498A
    • 2008-02-05
    • KR1020060071903
    • 2006-07-31
    • 삼성전자주식회사
    • 부경호김홍석최시영
    • H01L21/8247
    • A method for fabricating an NVM(non-volatile memory) device is provided to transform a silicon-hydrogen bonding existing in a dielectric layer into a silicon-fluorine bonding with relatively strong bonding force and reduce a trap density in the dielectric layer by performing a fluoridation treatment using fluorine gas. A tunnel oxide layer(110), a floating gate layer(112) and a preliminary dielectric layer(114) are sequentially formed on a semiconductor substrate(100). The preliminary dielectric layer is fluoridated to form a dielectric layer by a plasma process performed in an atmosphere of fluorine-including gas. A control gate layer is formed on the dielectric layer. A first oxide layer(114a), a nitride layer(114b) and a second oxide layer(114c) can be sequentially stacked in the preliminary dielectric layer.
    • 提供一种用于制造NVM(非易失性存储器)器件的方法,用相对较强的结合力将存在于电介质层中的硅 - 氢键转化成硅 - 氟键,并通过执行 使用氟气进行氟化处理。 隧道氧化物层(110),浮栅层(112)和预备电介质层(114)依次形成在半导体衬底(100)上。 通过在含氟气体的气氛中进行的等离子体处理将预备介电层氟化以形成介电层。 在电介质层上形成控制栅极层。 第一氧化物层(114a),氮化物层(114b)和第二氧化物层(114c)可以顺序堆叠在预备电介质层中。
    • 7. 发明公开
    • 반도체 소자의 형성 방법
    • 形成半导体器件的方法
    • KR1020070012069A
    • 2007-01-25
    • KR1020050066891
    • 2005-07-22
    • 삼성전자주식회사
    • 부경호류창우신유균박태서이진욱
    • H01L29/78H01L21/336
    • H01L29/7851H01L29/42392H01L29/66795H01L29/66803H01L29/1037
    • A method for forming a semiconductor device is provided to uniformly distribute impurity elements in a three-dimensional structure like a channel region or a source drain region by isotropically doping the three-dimensional structure by a plasma doping process using first source gas including n-type or p-type impurity element and second source gas including dilution elements unrelated to an electrical characteristic of a doping region. A three-dimensional structure of a semiconductor is formed on a semiconductor substrate. A plasma doping process is performed to isotropically dope the three-dimensional structure, using first source gas including n-type or p-type impurity element and second source gas including dilution elements unrelated to an electrical characteristic of a doping region(S170). The process for forming the three-dimensional structure includes a process for forming a pin protruding upward from the semiconductor substrate wherein the pin includes a channel region and is the three-dimensional structure.
    • 提供一种用于形成半导体器件的方法,通过使用包括n型的第一源气体通过等离子体掺杂工艺通过各向同性地掺杂三维结构来均匀地分布诸如沟道区或源漏区的三维结构中的杂质元素 或p型杂质元素和包括与掺杂区域的电特性无关的稀释元素的第二源气体。 在半导体衬底上形成半导体的三维结构。 使用包括n型或p型杂质元素的第一源气体和包括与掺杂区域的电特性无关的稀释元件的第二源气体,进行等离子体掺杂工艺以各向同性地掺杂三维结构(S170)。 形成三维结构的方法包括形成从半导体衬底向上突出的销的工艺,其中该销包括沟道区并且是三维结构。