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    • 3. 发明公开
    • 비휘발성 메모리 소자 및 그 형성방법
    • 非易失性存储器件及其形成方法
    • KR1020080111963A
    • 2008-12-24
    • KR1020070060573
    • 2007-06-20
    • 삼성전자주식회사
    • 박성철한정욱김재황김주리
    • H01L27/115H01L21/8247
    • G11C16/0458G11C8/08H01L21/28273H01L27/115H01L27/11521H01L29/42332H01L27/10885
    • A non-volatile memory device and a method of formation thereof are provided to prevent program disturbance with an isolation gate line. A non-volatile memory device comprises a semiconductor substrate and a memory cell unit. A memory cell unit is arranged on the semiconductor substrate with a matrix type of a matrix direction. The memory cell unit comprises a turner insulating layer(110), a first memory gate and second memory gates(102a,120b), an isolation gate(130), and a word line(140). The turner insulating layer is located on the surface of the semiconductor substrate. The first memory gate and the second memory gate are arranged on the turner insulating layer with being separated from each other. The isolation gate is arranged between the first memory gate and the second memory gate. The word line covers the first memory gate, the second memory gate and the isolation gate.
    • 提供了非易失性存储器件及其形成方法,以通过隔离栅极线来防止程序干扰。 非易失性存储器件包括半导体衬底和存储单元单元。 存储单元单元以矩阵型的矩阵方向布置在半导体衬底上。 存储单元单元包括转栅绝缘层(110),第一存储栅极和第二存储栅极(102a,120b),隔离栅极(130)和字线(140)。 转栅绝缘层位于半导体衬底的表面上。 第一存储栅极和第二存储栅极被布置在彼此分离的转子绝缘层上。 隔离栅极被布置在第一存储器栅极和第二存储器栅极之间。 字线覆盖第一个存储器栅极,第二个存储器栅极和隔离栅极。
    • 7. 发明公开
    • 비휘발성 기억 장치 및 그 제조 방법
    • 非易失性存储器件及其制造方法
    • KR1020080113966A
    • 2008-12-31
    • KR1020070063057
    • 2007-06-26
    • 삼성전자주식회사
    • 김주리김재황박성철
    • H01L27/115
    • H01L21/28282H01L21/28273H01L29/42328H01L29/42332H01L29/42344H01L29/42348H01L29/7887H01L29/7923H01L21/28141
    • The nonvolatile memory and manufacturing method thereof are provided to decrease the difference of the threshold voltage shift and to improve the reliability of the nonvolatile memory. The nonvolatile memory comprises the lower part of the semiconductor substrate(200), the top semiconductor pattern(204a), the element isolation pattern,(206), the bottom charge storage layer, the gate conductive structure(224), the first top charge storage layer(217a) and the second top charge storage layer(218a), and the source / drain region(226). The top semiconductor pattern is located on the lower part of the semiconductor substrate. The element isolation pattern defines the active area in the lower part of the semiconductor substrate and top semiconductor pattern. The lower part charge storage layer is interposed between the top semiconductor pattern and lower part of the semiconductor board. The gate conductive structure crosses the top semiconductor pattern. The first top charge storage layer and the second top charge storage layer are separated from each other between the gate conductive structure and top semiconductor pattern. The source / drain region is formed in the top semiconductor pattern of the gate conductive structure.
    • 提供非易失性存储器及其制造方法以减小阈值电压偏移的差异并提高非易失性存储器的可靠性。 非易失性存储器包括半导体衬底(200)的下部,顶部半导体图案(204a),元件隔离图案(206),底部电荷存储层,栅极导电结构(224),第一顶部充电 存储层(217a)和第二顶部电荷存储层(218a)以及源极/漏极区域(226)。 顶部半导体图案位于半导体衬底的下部。 元件隔离图案限定半导体衬底的下部的有源区域和顶部半导体图案。 下部电荷存储层介于顶部半导体图形和半导体板的下部之间。 栅极导电结构与顶部半导体图案交叉。 第一顶部电荷存储层和第二顶部电荷存储层在栅极导电结构和顶部半导体图案之间彼此分离。 源极/漏极区域形成在栅极导电结构的顶部半导体图案中。
    • 8. 发明公开
    • 소자 분리막이 구비된 반도체 소자 및 그 제조 방법
    • 具有器件隔离层的半导体器件及其制造方法
    • KR1020080000239A
    • 2008-01-02
    • KR1020060057872
    • 2006-06-27
    • 삼성전자주식회사
    • 김주리장공삼김경환
    • H01L21/76
    • A semiconductor device having a device isolation layer and a manufacturing method thereof are provided to prevent a dent portion of a liner from being directly contacted with a gate conductive film by forming an insulation spacer at an interface between activation and field regions. A semiconductor device includes a trench, a sidewall oxide film(130), a liner(140), an insulation film(150), and an insulation spacer(162). The trench is formed on a semiconductor substrate. The sidewall oxide film is formed along an inner wall of the trench. The liner is formed on the sidewall oxide film. The trench is filled with an insulation film. The insulation film has a step portion, which is higher than the semiconductor substrate surface. The insulation spacer is formed at both sides of the insulation film. A device isolation film is formed on the insulation film.
    • 提供具有器件隔离层的半导体器件及其制造方法,以通过在激活区域和场区域之间的界面处形成绝缘间隔物来防止衬垫的凹陷部分与栅极导电膜直接接触。 半导体器件包括沟槽,侧壁氧化膜(130),衬垫(140),绝缘膜(150)和绝缘间隔物(162)。 沟槽形成在半导体衬底上。 侧壁氧化物膜沿着沟槽的内壁形成。 衬里形成在侧壁氧化膜上。 沟槽填充有绝缘膜。 绝缘膜具有高于半导体衬底表面的台阶部分。 绝缘垫片形成在绝缘膜的两侧。 在绝缘膜上形成器件隔离膜。
    • 9. 发明公开
    • 비휘발성 기억 장치, 그 형성 방법 및 동작 방법
    • 非易失性存储器件及其形成和操作的方法
    • KR1020070014709A
    • 2007-02-01
    • KR1020050069564
    • 2005-07-29
    • 삼성전자주식회사
    • 양승진한정욱고광욱김재황김주리박성철
    • H01L27/115
    • H01L29/42328G11C16/0425H01L27/115H01L27/11521H01L29/7883H01L21/28273
    • An NVM(non-volatile memory) device is provided to avoid writing/reading error while improving integration of a cell by making one memory transistor include sidewall select gates covering both sidewalls of a floating gate while the floating gate and a control gate are stacked. A first gate insulation layer(5) is formed on a semiconductor substrate(1). A floating gate(7a) is formed on the first gate insulation layer. The upper surface and both lateral surfaces of the floating gate are covered with a second gate insulation layer. The second gate insulation layer(9) formed on one sidewall of the floating gate is covered with a first sidewall select gate(11a). The second gate insulation layer formed on the other sidewall of the floating gate is covered with a second sidewall select gate(11b). An intergate dielectric(16) is formed on the first sidewall select gate, the second gate insulation layer and the second sidewall select gate. A control gate exposes the intergate dielectric formed on the first and the second sidewall select gates, overlapping the floating gate on the intergate dielectric. A source region(23a) is formed in the semiconductor substrate that is adjacent to the first sidewall select gate and is separated from the floating gate. A drain region(23b) is formed in the semiconductor substrate that is adjacent to the second sidewall select gate and is separated from the floating gate. The first gate insulation layer under the first and the second sidewall select gates is thicker than the first gate insulation layer under the floating gate.
    • 提供NVM(非易失性存储器)器件以避免写入/读取错误,同时通过使一个存储器晶体管包括覆盖浮置栅极的侧壁的侧壁选择栅极,同时浮置栅极和控制栅极堆叠来改善单元的集成。 在半导体衬底(1)上形成第一栅极绝缘层(5)。 在第一栅绝缘层上形成浮栅(7a)。 浮置栅极的上表面和两个侧表面被第二栅极绝缘层覆盖。 形成在浮置栅极的一个侧壁上的第二栅极绝缘层(9)被第一侧壁选择栅极(11a)覆盖。 形成在浮动栅极的另一个侧壁上的第二栅极绝缘层被第二侧壁选择栅极(11b)覆盖。 在第一侧壁选择栅极,第二栅极绝缘层和第二侧壁选择栅极上形成隔间电介质(16)。 控制栅极暴露形成在第一和第二侧壁选择栅极上的隔间电介质,与栅极间电介质上的浮置栅极重叠。 源极区域(23a)形成在与第一侧壁选择栅极相邻并与浮动栅极分离的半导体衬底中。 漏极区域(23b)形成在与第二侧壁选择栅极相邻并且与浮动栅极分离的半导体衬底中。 在第一和第二侧壁选择栅极下方的第一栅极绝缘层比浮动栅极之下的第一栅极绝缘层厚。