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    • 6. 发明授权
    • 불휘발성반도체메모리및그제조방법
    • KR100362125B1
    • 2003-07-16
    • KR1019980035169
    • 1998-08-28
    • 닛본 덴끼 가부시끼가이샤
    • 가와따마사또
    • H01L29/788H01L27/115
    • G11C16/0475G11C11/5621G11C16/0458G11C2211/5612H01L29/66825H01L29/7887H01L29/7889
    • A nonvolatile semiconductor memory device includes a vertical memory cell. The memory cell is constituted by at least a channel portion, a drain and a source, first and second floating gates, and a control gate. The channel portion is vertically formed on a semiconductor substrate. The drain and the source are formed at upper and lower positions of the channel portion to form a channel in the channel portion. The first floating gate is formed on part of a side portion of the channel portion via a gate insulating film. The second floating gate is formed on the side portion of the channel portion in a region without the first floating gate. The control gate is formed outside the first and second floating gates via an insulating isolation film. A method of manufacturing the nonvolatile semiconductor memory device is also disclosed.
    • 非易失性半导体存储器件包括垂直存储器单元。 存储器单元至少由沟道部分,漏极和源极,第一和第二浮置栅极以及控制栅极构成。 沟道部分垂直形成在半导体衬底上。 漏极和源极形成在沟道部分的上部和下部位置处,以在沟道部分中形成沟道。 第一浮置栅极经由栅极绝缘膜形成在沟道部分的侧部的一部分上。 第二浮栅在没有第一浮栅的区域中形成在沟道部分的侧部上。 控制栅极经由绝缘隔离膜形成在第一和第二浮栅的外部。 还公开了一种制造非易失性半导体存储器件的方法。
    • 8. 发明公开
    • 멀티 비트 플래쉬 메모리 셀 및 이를 이용한 프로그램 방법
    • 多位闪存存储单元和使用该程序的程序方法
    • KR1020010060559A
    • 2001-07-07
    • KR1019990062956
    • 1999-12-27
    • 에스케이하이닉스 주식회사
    • 신진장상환최승욱심근수
    • H01L27/115
    • G11C16/0475G11C11/5621G11C11/5628G11C11/5671G11C16/0458G11C2211/5612H01L29/7887
    • PURPOSE: A multi-bit flash memory cell is provided to store information of at least 2 states in a flash memory cell, by forming a floating gate doped with an N-type region and a P-type region so that two kinds of cells having different threshold voltages are connected in series. CONSTITUTION: A floating gate(12) is electrically separated from a semiconductor substrate(11) by a gate oxide layer wherein one side of the floating gate has the first doping region and the other side of the floating gate has the second doping region. A control gate(13) is electrically separated from the floating gate by a dielectric layer, overlapping the floating gate by a self-aligned method. The first junction region(14) is formed in the semiconductor substrate outside the first doping region of the floating gate. The second junction region(15) is formed in the semiconductor substrate outside the second doping region of the floating gate.
    • 目的:提供一种多位闪存单元,通过形成掺杂有N型区域和P型区域的浮置栅极来存储闪存单元中至少2个状态的信息,使得两种单元格具有 不同的阈值电压串联。 构成:浮栅(12)通过栅极氧化层与半导体衬底(11)电隔离,其中浮置栅极的一侧具有第一掺杂区域,而浮置栅极的另一侧具有第二掺杂区域。 控制栅极(13)通过介电层与浮置栅极电隔离,通过自对准方法与浮置栅极重叠。 第一结区域(14)形成在浮置栅极的第一掺杂区域外部的半导体衬底中。 第二结区域(15)形成在浮置栅极的第二掺杂区域的外侧的半导体衬底中。
    • 9. 发明公开
    • 비휘발성 메모리 소자 및 그 형성방법
    • 非易失性存储器件及其形成方法
    • KR1020080111963A
    • 2008-12-24
    • KR1020070060573
    • 2007-06-20
    • 삼성전자주식회사
    • 박성철한정욱김재황김주리
    • H01L27/115H01L21/8247
    • G11C16/0458G11C8/08H01L21/28273H01L27/115H01L27/11521H01L29/42332H01L27/10885
    • A non-volatile memory device and a method of formation thereof are provided to prevent program disturbance with an isolation gate line. A non-volatile memory device comprises a semiconductor substrate and a memory cell unit. A memory cell unit is arranged on the semiconductor substrate with a matrix type of a matrix direction. The memory cell unit comprises a turner insulating layer(110), a first memory gate and second memory gates(102a,120b), an isolation gate(130), and a word line(140). The turner insulating layer is located on the surface of the semiconductor substrate. The first memory gate and the second memory gate are arranged on the turner insulating layer with being separated from each other. The isolation gate is arranged between the first memory gate and the second memory gate. The word line covers the first memory gate, the second memory gate and the isolation gate.
    • 提供了非易失性存储器件及其形成方法,以通过隔离栅极线来防止程序干扰。 非易失性存储器件包括半导体衬底和存储单元单元。 存储单元单元以矩阵型的矩阵方向布置在半导体衬底上。 存储单元单元包括转栅绝缘层(110),第一存储栅极和第二存储栅极(102a,120b),隔离栅极(130)和字线(140)。 转栅绝缘层位于半导体衬底的表面上。 第一存储栅极和第二存储栅极被布置在彼此分离的转子绝缘层上。 隔离栅极被布置在第一存储器栅极和第二存储器栅极之间。 字线覆盖第一个存储器栅极,第二个存储器栅极和隔离栅极。