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    • 1. 发明公开
    • 반도체 소자
    • 半导体器件
    • KR1020120015180A
    • 2012-02-21
    • KR1020100077474
    • 2010-08-11
    • 삼성전자주식회사
    • 김용돈이응규배성렬김수방장동은
    • H01L29/78H01L21/336
    • H01L29/7816H01L29/0653H01L29/0696H01L29/0865H01L29/1095H01L29/42368H01L29/4238H01L29/66681H01L29/66674H01L29/7801
    • PURPOSE: A semiconductor device is provided to offer a semiconductor device with high reliability by forming a length of a second channel under a bending part to be longer than that of a first channel under a line part. CONSTITUTION: A body region is doped with a first conductive dopant. Line parts(LP1,LP2) of a gate pattern are extended to a first direction and have an uniform width. Bending parts(BP1,BP2) of the gate pattern are extended in one end of the line parts. A channel region under the line part has a first channel length to a second direction which is vertical to the first direction. The channel region under the bending part has the second channel length which is longer than the first channel length in different direction from the second direction.
    • 目的:提供一种半导体器件,通过在弯曲部分下方形成比第一通道下方的第二通道更长的长度,提供具有高可靠性的半导体器件。 构成:体区掺杂有第一导电掺杂剂。 栅极图案的线部分(LP1,LP2)延伸到第一方向并且具有均匀的宽度。 栅极图案的弯曲部分(BP1,BP2)在线部分的一端延伸。 线部分下方的通道区域具有与第一方向垂直的第二方向的第一通道长度。 弯曲部下方的通道区域具有比从第二方向不同的方向长于第一通道长度的第二通道长度。
    • 2. 发明公开
    • 신뢰성이 향상된 반도체 집적 회로 장치
    • 具有改善可靠性的半导体集成电路设备
    • KR1020090100881A
    • 2009-09-24
    • KR1020080026386
    • 2008-03-21
    • 삼성전자주식회사
    • 김용돈김용찬김정호이맹열이응규임종욱
    • H01L27/06
    • H01L27/092H01L21/823857H01L21/823878H01L21/823892
    • PURPOSE: A semiconductor integrated circuit device is provided to isolate the high voltage devices and low voltage devices and to improve reliability. CONSTITUTION: The semiconductor integrated circuit device includes the substrate(110), the first buried impurity layer(132) and the second buried impurity layer(134). The high voltage device part and low voltage device part are defined in the substrate. The first buried impurity layers are formed in a part of the high voltage device part. The first buried impurity layers are coupled with the first voltage. The second buried impurity layers are formed in a part of the low voltage device part. The second buried impurity layers are coupled with the second voltages smaller than the first voltage. The wall is formed on the second buried impurity layers within the low voltage device part. The wall is coupled with the third voltage smaller than the second voltages.
    • 目的:提供半导体集成电路器件来隔离高压器件和低压器件,提高可靠性。 构成:半导体集成电路器件包括衬底(110),第一掩埋杂质层(132)和第二掩埋杂质层(134)。 高压器件部分和低电压器件部分定义在衬底中。 第一掩埋杂质层形成在高压器件部分的一部分中。 第一掩埋杂质层与第一电压耦合。 第二掩埋杂质层形成在低压器件部分的一部分中。 第二掩埋杂质层与小于第一电压的第二电压耦合。 该壁形成在低压器件部分内的第二掩埋杂质层上。 该壁与第二电压小于第三电压耦合。
    • 5. 发明公开
    • 반도체 소자 및 그 제조 방법
    • 半导体及其制造方法
    • KR1020120015181A
    • 2012-02-21
    • KR1020100077476
    • 2010-08-11
    • 삼성전자주식회사
    • 김용돈김대식
    • H01L29/78H01L21/336
    • H01L29/0847H01L29/41758H01L29/665H01L29/66575H01L29/7833H01L21/76
    • PURPOSE: A semiconductor device and a manufacturing method thereof are provided to block a leakage current from a first and second edge part by separating a first source/drain region from a first and second side wall through a first and second barrier region. CONSTITUTION: A gate pattern(GP) is extended to a second direction and crosses an active part. A first source/drain region(114) and a first barrier region(122) are arranged in the active part. The first barrier region is touched with a first side wall. The first barrier region is doped with a first conductive dopant. The first source/drain region is doped to a second conductive dopant.
    • 目的:提供一种半导体器件及其制造方法,通过将第一和第二侧壁通过第一和第二屏障区域分离第一源极/漏极区域来阻止来自第一和第二边缘部分的漏电流。 构成:栅极图案(GP)延伸到第二个方向并穿过有效部分。 第一源极/漏极区域(114)和第一势垒区域(122)布置在有源部分中。 用第一侧壁接触第一屏障区域。 第一阻挡区域掺杂有第一导电掺杂剂。 第一源/漏区被掺杂到第二导电掺杂剂。
    • 10. 发明公开
    • 고전력 어드레스 드라이버 및 이를 채택하는 디스플레이장치
    • 高功率地址驱动器和使用它的显示设备
    • KR1020090003771A
    • 2009-01-12
    • KR1020070066705
    • 2007-07-03
    • 삼성전자주식회사
    • 김용돈김정호이맹열김용찬이순학
    • G09G3/20G09G3/296H03K3/356H01L21/336
    • G09G3/2965G09G3/293G09G3/296G09G2330/021G09G2330/028
    • A high power address driver and display device employing the same is provided to reduce power consumption by supplying the reverse bias between the source terminal and bulk terminal of the pull-up MOS transistor. In a high power address driver and display device includes, the first address driver(AD1) includes the energy recovery circuit(ERC) and output stage(OST). The energy recovery circuit comprises the first resonance circuit(RC1) generating the charging signal and the second resonance circuit(RC2) generating the discharge signal. A first resonance circuit includes the first capacitor(C1), the first switching device(S1), the first diode(D1) and the first inductor(L1) which are connected in series. A second resonance circuit includes the second capacitor(C2), second switching element(S2), the second diode(D2), and the second inductor(L2) which are connected in series. An energy recovery circuit includes the third switching device(S3) and the fourth switching element(S4) which are parallel-connected with the second Node(N2).
    • 通过在上拉MOS晶体管的源极端子和体积端子之间提供反向偏压来提供使用其的高功率地址驱动器和显示装置以降低功耗。 在大功率地址驱动器和显示装置中,第一地址驱动器(AD1)包括能量恢复电路(ERC)和输出级(OST)。 能量恢复电路包括产生充电信号的第一谐振电路(RC1)和产生放电信号的第二谐振电路(RC2)。 第一谐振电路包括串联连接的第一电容器(C1),第一开关装置(S1),第一二极管(D1)和第一电感器(L1)。 第二谐振电路包括串联连接的第二电容器(C2),第二开关元件(S2),第二二极管(D2)和第二电感器(L2)。 能量恢复电路包括与第二节点(N2)并联的第三开关装置(S3)和第四开关元件(S4)。