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    • 2. 发明公开
    • 반도체 소자
    • 半导体器件
    • KR1020120015180A
    • 2012-02-21
    • KR1020100077474
    • 2010-08-11
    • 삼성전자주식회사
    • 김용돈이응규배성렬김수방장동은
    • H01L29/78H01L21/336
    • H01L29/7816H01L29/0653H01L29/0696H01L29/0865H01L29/1095H01L29/42368H01L29/4238H01L29/66681H01L29/66674H01L29/7801
    • PURPOSE: A semiconductor device is provided to offer a semiconductor device with high reliability by forming a length of a second channel under a bending part to be longer than that of a first channel under a line part. CONSTITUTION: A body region is doped with a first conductive dopant. Line parts(LP1,LP2) of a gate pattern are extended to a first direction and have an uniform width. Bending parts(BP1,BP2) of the gate pattern are extended in one end of the line parts. A channel region under the line part has a first channel length to a second direction which is vertical to the first direction. The channel region under the bending part has the second channel length which is longer than the first channel length in different direction from the second direction.
    • 目的:提供一种半导体器件,通过在弯曲部分下方形成比第一通道下方的第二通道更长的长度,提供具有高可靠性的半导体器件。 构成:体区掺杂有第一导电掺杂剂。 栅极图案的线部分(LP1,LP2)延伸到第一方向并且具有均匀的宽度。 栅极图案的弯曲部分(BP1,BP2)在线部分的一端延伸。 线部分下方的通道区域具有与第一方向垂直的第二方向的第一通道长度。 弯曲部下方的通道区域具有比从第二方向不同的方向长于第一通道长度的第二通道长度。
    • 4. 发明公开
    • 반도체 장치의 스택 소자 분리 구조 및 그 제조 방법
    • 堆叠隔离结构及其制造方法
    • KR1020050030460A
    • 2005-03-30
    • KR1020030066953
    • 2003-09-26
    • 삼성전자주식회사
    • 김수방김용환
    • H01L21/76
    • An isolation structure of a semiconductor device and a manufacturing method thereof are provided to improve the degree of integration and to define securely an active region by forming a field oxide like a fine pattern with sufficient height. An isolation structure includes a semiconductor substrate(101), a plurality of isolation layers(102) selectively formed on the substrate, and a semiconductor layer. The semiconductor layer(104) is protruded from the substrate between the isolation layers. The isolation layer is an oxide layer, wherein the oxide layer is formed by using a thermal oxidation.
    • 提供了一种半导体器件的隔离结构及其制造方法,以提高集成度,并通过形成具有足够高度的精细图案的场氧化物,可靠地确定有源区。 隔离结构包括半导体衬底(101),选择性地形成在衬底上的多个隔离层(102)和半导体层。 半导体层(104)从隔离层之间的衬底突出。 隔离层是氧化物层,其中通过使用热氧化形成氧化物层。