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1. 发明公开

KR1020130056629A 기판 및 이의 제조방법 审中-实审
标题翻译：基板及其制备方法
公开(公告)号：KR1020130056629A
公开(公告)日：2013-05-30
申请号：KR1020110122342
申请日：2011-11-22
申请人： 삼성전기주식회사
发明人： 테루야키시모지 , 조성민 , 이은혜 , 방정윤 , 전동주 , 김정석 , 이동준 , 김치성
IPC分类号： H05K3/18 , H05K1/02
摘要： PURPOSE: A substrate and a manufacturing method thereof are provided to improve stability of electroless palladium by including a surface plating layer which is plated with reduced electroless gold on wirings of the substrate. CONSTITUTION: A substrate includes a circuit pattern(10), a nickel layer(20), a gold layer(30), a palladium layer(40), and a surface gold plating layer(50). The circuit pattern is formed with copper or silver. The substrate includes a connection terminal to the outside. The connection terminal is formed by solder bonding or wire bonding.
摘要翻译：目的：提供一种基板及其制造方法，以通过包括在基板的布线上镀有还原的无电金的表面镀层来提高化学镀钯的稳定性。构成：基板包括电路图案（10），镍层（20），金层（30），钯层（40）和表面镀金层（50）。电路图案由铜或银形成。基板包括到外部的连接端子。连接端子通过焊接或引线键合形成。

2. 发明公开

KR1020120078181A 무전해 Ｎｉ/Ｐｄ/Ａｕ 도금 구조체 无效
标题翻译：电镀NI / PD / AU镀层结构
公开(公告)号：KR1020120078181A
公开(公告)日：2012-07-10
申请号：KR1020100140398
申请日：2010-12-31
申请人： 삼성전기주식회사
发明人： 이동준 , 시모지테루아키 , 김치성 , 전동주 , 조성민 , 방정윤 , 김정석
IPC分类号： C23C18/31 , C23C18/16
摘要： PURPOSE: An electroless Ni/Pd/Au plated structure is provided to improve soldering reliability by controlling the content of P in electroless Ni-plated and Pd-plated films. CONSTITUTION: An electroless Ni/Pd/Au plated structure comprises an electroless Ni-plated film, an electroless Pd-plated film, and an electroless Au-plated film. The thickness of the electroless Ni, Pd, and Au-plated films is 0.01-0.1 micrometers. Less than 5 weight% of phosphorus is contained in the electroless Ni and Pd plated films.
摘要翻译：目的：提供无电Ni / Pd / Au镀层结构，通过控制无电解镀镍和镀Pd膜中的P含量来提高焊接的可靠性。构成：无电Ni / Pd / Au镀层结构包括无电解镀镍膜，无电解Pd镀膜和无电镀金膜。化学镀Ni，Pd和镀Au膜的厚度为0.01-0.1微米。化学镀镍和Pd镀膜中含有少于5重量％的磷。

3. 发明公开

KR1020140032244A 인쇄회로기판 제조방법 无效
标题翻译： PCB制造方法
公开(公告)号：KR1020140032244A
公开(公告)日：2014-03-14
申请号：KR1020120098910
申请日：2012-09-06
申请人： 삼성전기주식회사
发明人： 김치성 , 남효승 , 이은혜 , 방정윤 , 시모지테루아키 , 조성민
IPC分类号： H05K3/28 , H05K3/18 , B32B15/088
CPC分类号： H05K3/284 , B32B15/088 , H05K3/181 , H05K2201/0154 , H05K2203/1383
摘要： According to the present invention, provided is a method for manufacturing a PCB, which includes the steps of: providing a substrate which includes pads on both sides thereof and solder resists to expose each pad on both sides thereof; forming a first protection film with chemical resistance and heat resistance on one side of the substrate to cover the pad; firstly treating the surface of the pad formed on the other side of the substrate; forming a second protection film with chemical resistance and heat resistance on the other side of the substrate to cover the pad; separating the first protection film; and secondly treating the surface of the pad formed on one side of the substrate.
摘要翻译：根据本发明，提供了一种用于制造PCB的方法，其包括以下步骤：提供包括其两侧的焊盘和阻焊剂的衬底，以暴露其两侧的每个焊盘; 在所述基板的一侧上形成具有耐化学性和耐热性的第一保护膜以覆盖所述垫; 首先处理形成在基板的另一侧上的焊盘的表面; 在所述基板的另一侧上形成具有耐化学性和耐热性的第二保护膜以覆盖所述垫; 分离第一保护膜; 并且其次处理形成在衬底的一侧上的衬垫的表面。

4. 发明公开

KR1020140019174A 인쇄회로기판의 제조방법 无效
标题翻译：制造印刷电路板的方法
公开(公告)号：KR1020140019174A
公开(公告)日：2014-02-14
申请号：KR1020120085824
申请日：2012-08-06
申请人： 삼성전기주식회사
发明人： 시모지,테루아키 , 이은혜 , 김치성 , 방정윤 , 남효승 , 조성민
IPC分类号： H05K3/00 , H05K3/18 , H05K3/46 , H05K3/06 , H05K3/10
CPC分类号： H05K3/0085 , H05K3/06 , H05K3/108 , H05K3/181 , H05K3/4608
摘要： The present invention provides a method for manufacturing a printed circuit board by using catalyst solutions for electroless copper plating including copper salt and iodide compounds. According to the present invention, costs are reduced and stability is improved in comparison with the existing palladium catalyst if electroless plating is performed by using the catalyst solutions made of copper salt and iodide compounds. Also, the yield of a product is improved by preventing an insulation defect or a bridge defect of an electroless Ni/Au process in the final process by removing the residues after an etching process if a printed wiring board is manufactured by using the catalyst solutions.
摘要翻译：本发明提供一种通过使用包含铜盐和碘化物的化学镀铜的催化剂溶液来制造印刷电路板的方法。根据本发明，通过使用由铜盐和碘化物形成的催化剂溶液进行化学镀，与现有的钯催化剂相比，降低了成本并提高了稳定性。此外，如果通过使用催化剂溶液制造印刷线路板，则通过在蚀刻工艺之后除去残留物来防止最终工艺中的无电解Ni / Au工艺的绝缘缺陷或桥接缺陷，从而提高产品的产率。

5. 发明公开

KR1020130048103A 인쇄회로기판의 제조방법 无效
标题翻译：印刷电路板的制备方法
公开(公告)号：KR1020130048103A
公开(公告)日：2013-05-09
申请号：KR1020110113049
申请日：2011-11-01
申请人： 삼성전기주식회사
发明人： 김치성 , 조성민 , 전동주 , 방정윤 , 이동준
IPC分类号： H05K3/46 , H05K3/10 , C23C18/42 , C23C18/16
CPC分类号： C23C18/42 , C23C18/16 , H05K3/46
摘要： PURPOSE: A manufacturing method of a printed circuit board is provided to reduce process cost by preventing spread of a fine pattern in a surface treatment process. CONSTITUTION: A copper plated copper seed(140) is removed. The removed substrate is processed with an iodine compound. The processed substrate is processed with organic sulfur compound. The substrate is pickled. An electroless plating layer(120) is formed on the pickled substrate.
摘要翻译：目的：提供印刷电路板的制造方法，以防止在表面处理过程中细微图案的扩散。构成：去除铜镀铜种子（140）。用碘化合物处理去除的衬底。经处理的基板用有机硫化合物处理。底物酸洗。在酸洗基板上形成化学镀层（120）。

6. 发明授权

KR101167815B1 반도체 패키지 구조 및 이의 제조 방법 有权
标题翻译：半导体封装的制造方法和结构
公开(公告)号：KR101167815B1
公开(公告)日：2012-07-25
申请号：KR1020110062442
申请日：2011-06-27
申请人： 삼성전기주식회사
发明人： 테루야키시모지 , 조성민 , 이동준 , 김치성 , 방정윤 , 김정석 , 전동주
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/03 , H01L24/05 , H01L2224/0401 , H01L2224/14 , H01L2224/1411 , H01L2924/00012
摘要： PURPOSE: A semiconductor package structure and a manufacturing method thereof are provided to increase heat resisting reliability while obtaining connection reliability by successively forming an aluminum pad, a bump, a nickel film layer, a palladium thin film layer, and a gold plating layer on the upper surface of a substrate. CONSTITUTION: An aluminum pad(40) is formed on the upper surface of a silicon substrate(20). A plurality of bumps(50) is formed on the aluminum pad. A nickel film layer(60) is formed on the aluminum pad including a part of a bump. A palladium thin film layer(70) is formed on the nickel film layer. The thickness of the palladium thin film layer is maximum 0.3micrimeters. A gold plating layer(80) is formed on the palladium thin film layer. A solder ball is connected to the upper side of the gold plating layer. The thickness of the gold plating layer is maximum 0.5micrimeters.
摘要翻译：目的：提供半导体封装结构及其制造方法，以通过在其上连续形成铝焊盘，凸块，镍膜层，钯薄膜层和镀金层来获得连接可靠性，从而提高耐热可靠性衬底的上表面。构成：在硅衬底（20）的上表面上形成铝焊盘（40）。在铝垫上形成多个凸块（50）。在包括凸块的一部分的铝垫上形成镍膜层（60）。在镍膜层上形成钯薄膜层（70）。钯薄膜层的厚度最大为0.3微米。在钯薄膜层上形成镀金层（80）。焊锡球连接到镀金层的上侧。镀金层的厚度最大为0.5微米。

7. 发明公开

KR1020150057389A 인쇄회로기판 및 그 제조방법 审中-实审
标题翻译：印刷电路板及其制造方法
公开(公告)号：KR1020150057389A
公开(公告)日：2015-05-28
申请号：KR1020130140716
申请日：2013-11-19
申请人： 삼성전기주식회사
发明人： 방정윤
IPC分类号： H05K3/34 , H05K1/18
CPC分类号： G03F7/30 , H05K3/0032 , H05K3/3452 , H05K2201/09154 , H05K2201/09827 , H05K2203/041
摘要： 본발명은인쇄회로기판및 그제조방법에관한것이다. 본발명의일 실시예에따른인쇄회로기판은접속패드를갖는절연층및 상기절연층상에형성되며, 상기접속패드가노출되도록오픈부가형성된레지스트층을포함하며, 상기레지스트층의오픈부벽면은하나이상의돌출부를갖는다.
摘要翻译：印刷电路板及其制造方法技术领域本发明涉及印刷电路板及其制造方法。根据本发明实施例的印刷电路板包括具有接触焊盘和抗蚀剂层的绝缘层，该绝缘层形成在绝缘层上并具有露出接触焊盘的开口部分。抗蚀剂层的开口部的壁面具有至少一个突出部。

8. 发明公开

KR1020130055956A 무전해 팔라듐 도금액 无效
标题翻译：导电网的传输方法
公开(公告)号：KR1020130055956A
公开(公告)日：2013-05-29
申请号：KR1020110121656
申请日：2011-11-21
申请人： 삼성전기주식회사
发明人： 시모지테루아키 , 이은혜 , 이동준 , 전동주 , 김치성 , 방정윤 , 김정석 , 조성민
IPC分类号： C23C18/44 , C23C18/48
CPC分类号： C23C18/44 , C23C18/1879
摘要： PURPOSE: A non-electrolytic palladium plating solution is provided to improve the contact reliability of a solder or wire bonding by improving the adhesion between metal and palladium by gold-plating on the metal a single time. CONSTITUTION: A non-electrolytic palladium plating solution contains a water-soluble palladium salt, the complexing agent, and the reducing agent. The complexing agent ignites palladium. The water-soluble palladium salt contains one or more among palladium chloride, palladium bromide, palladium sulfate, palladium nitrate, and palladium acetate.
摘要翻译：目的：提供一种非电解镀钯溶液，通过单次金属镀金，改善金属和钯之间的粘合力，提高焊料或引线接合的接触可靠性。构成：非电解镀钯溶液含有水溶性钯盐，络合剂和还原剂。络合剂点燃钯。水溶性钯盐含有氯化钯，溴化钯，硫酸钯，硝酸钯和乙酸钯中的一种或多种。

9. 发明公开

KR1020130007022A 인쇄회로기판 및 이의 제조방법 无效
标题翻译：印刷电路板及其制备方法
公开(公告)号：KR1020130007022A
公开(公告)日：2013-01-18
申请号：KR1020110062944
申请日：2011-06-28
申请人： 삼성전기주식회사
发明人： 이동준 , 전동주 , 방정윤 , 조성민 , 김치성
IPC分类号： H05K3/32 , H01L21/60 , H05K3/18 , C23C18/50
CPC分类号： C23C18/1651 , C23C18/1806 , C23C18/1827 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45144 , H01L2224/48644 , H01L2224/85444 , H01L2924/00014 , H05K3/244 , H05K2203/072 , H01L2924/00 , H01L2924/207
摘要： PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve workability of a wire bonding work process connected with an external device. CONSTITUTION: A polymer resin layer(120) is formed in a part except for a copper pad(110). A plating layer(130) for protecting the copper pad includes Ni(131)/Pd(132)/Au(133). The inter connection between metals is formed. A surface of the copper pad is processed in a pitch period of 0.1-1.0 micrometer in order to increase roughness. The non-electrolytic surface process plating layer of the Ni/Pd/Au is formed on the copper pad.
摘要翻译：目的：提供一种印刷电路板及其制造方法，以提高与外部装置连接的引线接合工作过程的可加工性。构成：除了铜垫（110）以外的部分中形成聚合物树脂层（120）。用于保护铜焊盘的镀层（130）包括Ni（131）/ Pd（132）/ Au（133）。形成金属间的相互连接。为了增加粗糙度，铜衬垫的表面以0.1-1.0微米的间距加工。 Ni / Pd / Au的非电解表面处理镀层形成在铜垫上。

10. 发明公开

KR1020110022886A 범프의 전단 강도 평가 장치 有权
标题翻译：评估剪切强度的设备
公开(公告)号：KR1020110022886A
公开(公告)日：2011-03-08
申请号：KR1020090080380
申请日：2009-08-28
申请人： 삼성전기주식회사
发明人： 이영관 , 민병승 , 황수형 , 방정윤 , 김치성 , 이동준
IPC分类号： G01N3/24 , G01N3/02
CPC分类号： G01N3/24 , G01N3/02 , G01N2203/0025 , G01N2203/0039
摘要： PURPOSE: A device for evaluating the shear strength of a bump is provided to measure the coupling reliability of a bump constituting C4 of a semiconductor, a CPU, and a chip set. CONSTITUTION: A device for evaluating the shear strength of a bump comprises a plate(101), an elastic member(105), a transmission member(111), and a stopper(110). The plate fixes a substrate(106) and a test member(108) coupled with a bump(107). The plate comprises an insertion groove(109) opened to one side. The elastic member generates the movement of a hammer with external force. The transmission member is placed in the insertion groove to be movable. The transmission member transfers the elastic force to the test member.
摘要翻译：目的：提供一种用于评估凸块的剪切强度的装置，以测量构成半导体，CPU和芯片组C4的凸块的耦合可靠性。构成：用于评估凸块的剪切强度的装置包括板（101），弹性构件（105），传动构件（111）和止挡件（110）。板固定基板（106）和与凸块（107）连接的测试构件（108）。板包括向一侧开口的插入槽（109）。弹性构件产生具有外力的锤的运动。传动构件放置在插入槽中以便可移动。传动部件将弹性力传递给测试部件。

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