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    • 81. 发明公开
    • 타깃 장치
    • 真空涂装装置
    • KR1020030028401A
    • 2003-04-08
    • KR1020020058363
    • 2002-09-26
    • 폰 아르데네 게엠베하
    • 에르프캄,볼프강헤흐트,한스-크리스티안호프만,미하엘밀데,팔크
    • C23C14/34
    • C23C14/564C23C14/562C23C14/568
    • PURPOSE: A vacuum coating apparatus is provided to reduce maintenance cost for cleaning magnetron chamber walls, and to separate a gas in magnetron chambers from a process chamber. CONSTITUTION: The apparatus comprises a process chamber(1); a cooling roller(3) for transporting the band of material within the process chamber, the cooling roller having an axis for rotation and a peripheral surface; at least two magnetron chambers(7) arranged adjacent the peripheral surface within the process chamber, the magnetron chambers each including a magnetron sputter source(4) and surrounding walls(5) having flow resistance seals acting with the peripheral surface and forming a closed magnetron chamber with the peripheral surface; and vacuum vents for drawing a vacuum in each of the magnetron chambers and the process chamber such that a pressure difference between each magnetron chamber and the process chamber is adjustable.
    • 目的:提供真空镀膜装置,以减少清洗磁控管腔壁的维护成本,并将磁控管腔中的气体与处理室分开。 构成:该装置包括处理室(1); 用于在处理室内传送材料带的冷却辊(3),所述冷却辊具有用于旋转的轴线和周边表面; 至少两个磁控管室(7)邻近处理室内的周边表面设置,每个磁控管腔室均包括磁控溅射源(4)和围绕壁(5),其具有与周边表面作用的流动阻力密封并形成闭合磁控管 室与外围表面; 以及用于在每个磁控管室和处理室中抽真空的真空通风口,使得每个磁控管室和处理室之间的压力差是可调节的。
    • 82. 发明公开
    • 유기 전계발광 표시장치를 제조하는 장치 및 방법
    • 成膜装置和成膜方法
    • KR1020020095081A
    • 2002-12-20
    • KR1020020029287
    • 2002-05-27
    • 소니 주식회사
    • 모리다카오야마구찌마사루가미야마이사오
    • H05B33/10
    • H01L51/56C23C14/022C23C14/042C23C14/12C23C14/568H01L27/12H01L27/3211H01L27/3244H01L27/3295H01L51/0008
    • PURPOSE: To provide a film-forming device and a film-forming method with which a tact time of an organic layer forming process for an organic EL display equipment can be shortened and useless consumption of organic materials for formation of an organic layer can be curbed. CONSTITUTION: The device is composed of an alignment room 53 where masks for film-forming with openings corresponding to a specified pattern are aligned with a substrate on which is formed an anode electrode layer and equipped with an alignment mechanism coupling the masks for film-forming with the substrate in free detachment, of vacuum processing rooms 62, 63, 64 where a plurality of organic material layers are sequentially formed on the substrate coupled with the masks for film-forming, and of a conveyance robot 45 which conveys the masks for film-forming and the substrate in a coupled state by the alignment mechanism to one of the vacuum processing rooms 62, 63, 64 and conveys them sequentially among the vacuum processing rooms 62, 63, 64.
    • 目的:提供可以缩短有机EL显示设备的有机层形成工艺的触控时间并且可以抑制用于形成有机层的有机材料的无用消耗的成膜装置和成膜方法 。 构成:该装置由对准室53构成,其中用于成膜的用于形成与具体图案对应的开口的掩模与其上形成阳极电极层的基板对齐,并配备有将成膜用掩模 其中基板处于自由分离的真空处理室62,63,64中,其中多个有机材料层顺序地形成在与用于成膜的掩模耦合的基板上,以及传送机器人45,其传送用于膜的掩模 以及通过对准机构处于耦合状态的基板到真空处理室62,63,64中的一个,并且在真空处理室62,63,64之间依次传送它们。
    • 83. 发明公开
    • 웨이퍼 가공을 위한 클러스터 툴
    • 加工工具加工工具
    • KR1020020084853A
    • 2002-11-13
    • KR1020010023668
    • 2001-05-02
    • 주성엔지니어링(주)배준호코스텍시스템(주)
    • 배준호변홍식
    • H01L21/00
    • H01L21/67196C23C14/566C23C14/568H01L21/67201H01L21/67742
    • PURPOSE: A cluster tool for processing a wafer is provided to transfer wafers to corresponding modules by reducing an installation area of the cluster tool and simplifying operations of the cluster tool. CONSTITUTION: The first and the second load port(100,102) are used for loading wafers. A front-end system(200) is used for transferring and aligning the loaded wafers and transferring the aligned wafers to the first and the second load lock chamber(300,302). The front-end system(200) has an ATM(ATMosphere) robot(202) for transferring the loaded wafers and an ATM aligner(204) for aligning the transferred wafers. The first and the second load lock chamber(300,302) have the first and the second vacuum transfer device(304,306), respectively. The first and the second vacuum transfer device(304,306) are used for transferring the wafers to the first and the second process module(500,502). The first and the second slot valve(400,402) are located between the first and the second load lock chamber(300,302) and the first and the second process module(500,502).
    • 目的:提供用于处理晶片的集群工具,通过减少集群工具的安装面积并简化集群工具的操作,将晶片转移到相应的模块。 构成:第一个和第二个装载端口(100,102)用于装载晶片。 前端系统(200)用于传送和对准加载的晶片并将对准的晶片传送到第一和第二加载锁定室(300,302)。 前端系统(200)具有用于传送加载的晶片的ATM(空气环境)机器人(202)和用于对准所转移的晶片的ATM对准器(204)。 第一和第二装载锁定室(300,302)分别具有第一和第二真空传送装置(304,306)。 第一和第二真空传送装置(304,306)用于将晶片传送到第一和第二处理模块(500,502)。 第一和第二狭槽阀(400,402)位于第一和第二负载锁定室(300,302)和第一和第二处理模块(500,502)之间。
    • 85. 发明公开
    • 연속 증착 시스템
    • 基板加工系统
    • KR1020010051426A
    • 2001-06-25
    • KR1020000065134
    • 2000-11-03
    • 어플라이드 머티어리얼스, 인코포레이티드
    • 테프만,아비
    • H01L21/20
    • H01L21/67161C23C14/568H01L21/67167H01L21/67173H01L21/67184H01L21/67236H01L21/67706H01L21/6776
    • PURPOSE: A substrate processing system is provided to process a substrate, in particular a relatively flat glass substrate. CONSTITUTION: The substrate processing system has a carrier(122) which is mainly arranged generally at least in one processing chamber(96); and at least one of shuttles(118, 120) for conveying substrates(114, 115, 116) between the processing chamber(96) and load lock chambers(92, 94). A plurality of processing chambers, load lock chambers, and other chambers are joined to each other, so that a series modular chamber for processing the substrate can be formed. Preferably, the carrier is only exposed to a processing environment, namely the carrier does not reciprocate within a non-processing chamber. Thus, during a consecutive sequential processing of the substrate, a thermal circulation of the carrier is decreased. The carrier is reversibly moved within the processing chamber along track(123, 125). A plurality of processing states can be generated within the same processing chamber by a plurality of processing areas isolated by a bulkhead.
    • 目的:提供基板处理系统来处理基板,特别是相对平坦的玻璃基板。 构成:基板处理系统具有主要布置在至少一个处理室(96)中的载体(122); 以及用于在处理室(96)和加载锁定室(92,94)之间输送基板(114,115,116)的至少一个梭(118,120)。 多个处理室,负载锁定室和其他室彼此接合,从而可以形成用于处理基板的串联模块室。 优选地,载体仅暴露于处理环境,即载体不在非处理室内往复运动。 因此,在衬底的连续顺序处理期间,载体的热循环减少。 载体沿着轨道(123,125)在处理室内可逆地移动。 可以通过由隔板隔离的多个处理区域在同一处理室内产生多个处理状态。
    • 87. 发明公开
    • 롤 플레이트 롤 및 롤 투 플레이트 진공증착 시스템
    • 辊板辊和辊板真空沉积系统
    • KR1020000000499A
    • 2000-01-15
    • KR1019990047609
    • 1999-10-29
    • 주식회사 컴텍스오형석이만호주식회사 계림통상
    • 오형석이만호
    • C23C14/56
    • C23C14/568C23C14/021C23C14/24
    • PURPOSE: A vacuum deposition system is provided to make easy to control the process pressure by separating an unnecessary film roll part from a deposition part, reduce the loss of gas, and apply to various processors easily. CONSTITUTION: The system comprises a roll drum chamber(1) for supplying the whole base material such as film and fiber by winding, a tension control unit(8) for smoothing the winding and loosening of base material, a vacuum surface treatment chamber(9) for removing foreign material formed on the surface of base material and increasing adhesion by enhancing the activation energy of base material surface, and a vacuum deposition chamber(7). In the system Ar, O2, N2, CF4, H2, CO2, C2H5OH and other gas are leaded in the vacuum surface treatment chamber(9) to remove foreign material. The vacuum deposition chamber is composed of each unit such as a vacuum pump(4), a gas lead-in solenoid valve(10), and a deposition source(3) and designed to be able to addition and deletion.
    • 目的:提供真空沉积系统,通过将不必要的膜卷部分与沉积部分分离,减少气体损失,容易地应用于各种处理器,从而容易控制工艺压力。 构成:该系统包括用于通过卷绕提供诸如薄膜和纤维的整个基材的卷筒室(1),用于平滑基材的卷绕和松动的张力控制单元(8),真空表面处理室(9 ),用于去除形成在基材表面上的异物,并通过提高基材表面的活化能增加粘合力,以及真空沉积室(7)。 在系统中,在真空表面处理室(9)中引入了Ar,O 2,N 2,CF 4,H 2,CO 2,C 2 H 5 OH和其它气体以除去异物。 真空沉积室由诸如真空泵(4),气体引入电磁阀(10)和沉积源(3)的每个单元组成,并被设计成能够添加和删除。