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    • 61. 发明公开
    • 산화물 반도체 박막 트랜지스터의 제조방법
    • 氧化物半导体薄膜晶体管的制造方法
    • KR1020090126813A
    • 2009-12-09
    • KR1020080053128
    • 2008-06-05
    • 삼성전자주식회사
    • 정지심박영수이상윤김창정김태상권장연손경석
    • G02F1/136H01L29/786
    • H01L29/7869H01L29/66969H01L29/66742H01L21/324
    • PURPOSE: A manufacturing method of an oxide semiconductor TFT(Thin Film Transistor) which an oxide semiconductor is used for a channel is provided to improve the characteristic of a device by using an oxide semiconductor as a channel material. CONSTITUTION: A gate insulation film(110) is formed on a substrate in order to cover the gate after the gate is formed on the substrate. A channel layer(116) consisting of the transparent oxide semiconductor is formed on the gate insulating layer. Source and drain electrodes are respectively formed on both sides of the channel layer. A protective film(120) is formed in order to cover source, drain electrode, and the channel layer. The substrate in which the protective film is formed is heat-treated at a temperature of 100 degrees.
    • 目的:提供氧化物半导体用于沟道的氧化物半导体TFT(薄膜晶体管)的制造方法,以通过使用氧化物半导体作为沟道材料来提高器件的特性。 构成:在衬底上形成栅极之后,在衬底上形成栅极绝缘膜(110)以覆盖栅极。 由栅极绝缘层形成由透明氧化物半导体构成的沟道层(116)。 源极和漏极分别形成在沟道层的两侧。 为了覆盖源极,漏电极和沟道层,形成保护膜(120)。 形成有保护膜的基板在100度的温度下进行热处理。
    • 62. 发明公开
    • 산화물 반도체 박막 트랜지스터의 소스 및 드레인 전극용에칭액 및 이를 이용한 산화물 반도체 박막 트랜지스터의제조방법
    • 用于氧化物半导体薄膜晶体管的源极和漏极电极的蚀刻解决方案,以及使用该氧化物半导体薄膜晶体管的氧化物半导体薄膜晶体管的制造方法
    • KR1020090095315A
    • 2009-09-09
    • KR1020080020585
    • 2008-03-05
    • 삼성전자주식회사
    • 박경배김태상이상윤류명관권장연유병욱손경석정지심
    • C09K13/04H01L21/306H01L29/786
    • C09K13/04C23F1/16H01L21/306H01L29/41733H01L29/7869
    • An etchant for the source of an oxide semiconductor thin film transistor and a drain electrode, and a method for preparing an oxide semiconductor thin film transistor by using the etchant are provided to prevent the back etching of an oxide semiconductor and the dissolution of an oxide semiconductor and to improve etching rate. An etchant for the source of an oxide semiconductor thin film transistor and a drain electrode comprises hydrogen peroxide, ammonium hydroxide, and water. A manufacturing method of an oxide semiconductor thin film transistor comprises the steps of forming a gate on a substrate(110), and forming a gate insulating layer(114) on the substrate so as to cover the gate; forming a channel layer(116) comprising an oxide semiconductor on the gate insulating layer; and forming a metal layer for the formation of a source and a drain electrode at on both surfaces of the channel layer, and pattering it by using the etchant to form a source and drain electrodes(118a,118b).
    • 提供了用于氧化物半导体薄膜晶体管和漏极的源的蚀刻剂,以及通过使用蚀刻剂制备氧化物半导体薄膜晶体管的方法,以防止氧化物半导体的反向蚀刻和氧化物半导体的溶解 并提高蚀刻速率。 用于氧化物半导体薄膜晶体管和漏电极源的蚀刻剂包括过氧化氢,氢氧化铵和水。 氧化物半导体薄膜晶体管的制造方法包括以下步骤:在衬底(110)上形成栅极,并在衬底上形成栅极绝缘层(114)以覆盖栅极; 在所述栅极绝缘层上形成包含氧化物半导体的沟道层(116); 以及在沟道层的两个表面上形成用于形成源极和漏极的金属层,并且通过使用蚀刻剂来形成源极和漏极以形成源极和漏极(118a,118b)。
    • 63. 发明公开
    • 선형 안테나를 구비한 플라즈마 처리 장치
    • 具有线性天线的等离子体处理装置
    • KR1020090079696A
    • 2009-07-22
    • KR1020080005854
    • 2008-01-18
    • 삼성전자주식회사성균관대학교산학협력단
    • 박경배김홍범염근영이형철이상윤류명관김태상권장연손경석정지심
    • H05H1/26H01L21/205
    • H01J37/3211H01J37/32183H01J37/32431H01J37/32715H01Q1/366H05H1/46H05H2001/2412H05H2001/4667H05H2001/4682
    • A plasma processing apparatus having linear antennas is provided to improve density uniformity of plasma by changing a thickness of a dielectric for surrounding the linear antenna. A plasma processing apparatus having linear antennas includes a reaction chamber(110), a substrate supporting plate(120), linear antennas(132), an RF power source(138), and a dielectric(142). The substrate supporting plate is installed in a lower side of the inside of the reaction chamber in order to support a substrate to be processed. The linear antennas are used for inducing electric field to generate electric field. The linear antennas are installed in parallel to each other at an upper side of the inside of the reaction chamber. The RF power source is connected to the linear antennas in order to supply RF power to the linear antennas. The dielectric is formed to surround each of the linear antennas. The thickness of the dielectric is gradually reduced from a RF power input terminal of each linear antenna to a grounding terminal(132b).
    • 提供具有线性天线的等离子体处理装置,通过改变用于包围线状天线的电介质的厚度来改善等离子体的密度均匀性。 具有线性天线的等离子体处理装置包括反应室(110),基板支撑板(120),线性天线(132),RF电源(138)和电介质(142)。 基板支撑板安装在反应室内侧的下侧,以便支撑待处理的基板。 线性天线用于感应电场以产生电场。 线性天线在反应室内部的上侧彼此平行地安装。 RF电源连接到线性天线,以便向线性天线提供RF功率。 电介质形成为围绕每个线性天线。 电介质的厚度从每个线性天线的RF功率输入端逐渐减小到接地端子(132b)。
    • 64. 发明公开
    • 산화물 반도체 박막 트랜지스터의 제조방법
    • 氧化物半导体薄膜晶体管的制造方法
    • KR1020090057690A
    • 2009-06-08
    • KR1020070124383
    • 2007-12-03
    • 삼성전자주식회사
    • 손경석이상윤류명관김태상권장연박경배정지심
    • H01L29/786
    • H01L29/7869H01L29/66969H01L21/265
    • A method for manufacturing an oxide semiconductor thin film transistor is provided to improve stability and reliability of the semiconductor thin film transistor by using an oxide semiconductor made of a channel material. A gate insulating layer(114) is formed on a substrate with a gate(112). A channel layer(116) made of the oxide semiconductor is formed on a gate insulating layer. A source electrode(118a) and a drain electrode(118b) are formed in both sides of the channel layer. The plasma process is performed to supply the oxygen to the channel layer. The protection layer covering the source and drain electrodes, and the channel layer is formed. After forming the protection layer, the thermal process is performed.
    • 提供一种用于制造氧化物半导体薄膜晶体管的方法,以通过使用由沟道材料制成的氧化物半导体来改善半导体薄膜晶体管的稳定性和可靠性。 在具有栅极(112)的基板上形成栅极绝缘层(114)。 在栅极绝缘层上形成由氧化物半导体构成的沟道层(116)。 源极电极(118a)和漏电极(118b)形成在沟道层的两侧。 执行等离子体处理以将氧气供应至沟道层。 形成覆盖源电极和漏电极的保护层以及沟道层。 形成保护层后,进行热处理。
    • 65. 发明公开
    • 공기조화기
    • 冷气机
    • KR1020040046624A
    • 2004-06-05
    • KR1020020074605
    • 2002-11-28
    • 삼성전자주식회사
    • 손경석
    • F24F1/00
    • PURPOSE: An air conditioner is provided to easily mount plural circuit boards to a narrow space and easily mount or separate an additional circuit board. CONSTITUTION: An air conditioner has an electric component box(30). The electric component box has a circuit board-housing part(40) one side of which is opened. The circuit board-housing part includes a first circuit board(41) installed to the innermost part of the circuit board-housing part and a second circuit board(42) installed in the circuit board-housing part. The second circuit board is spaced apart from the first circuit board and is connected to the first circuit board through electric connection.
    • 目的:提供一种空调,以便将多个电路板容易地安装到狭窄的空间,并容易地安装或分离附加的电路板。 构成:空调具有电气部件箱(30)。 电气部件箱具有一侧打开的电路板壳体部(40)。 电路板外壳部分包括安装在电路板壳体部分的最内部的第一电路板(41)和安装在电路板外壳部分中的第二电路板(42)。 第二电路板与第一电路板间隔开并且通过电连接连接到第一电路板。