基本信息:
- 专利标题： 선형 안테나를 구비한 플라즈마 처리 장치
- 专利标题（英）：Plasma treatment apparatus having linear antenna
- 专利标题（中）：具有线性天线的等离子体处理装置
- 申请号：KR1020080005854 申请日：2008-01-18
- 公开(公告)号：KR1020090079696A 公开(公告)日：2009-07-22
- 发明人： 박경배 , 김홍범 , 염근영 , 이형철 , 이상윤 , 류명관 , 김태상 , 권장연 , 손경석 , 정지심
- 申请人： 삼성전자주식회사 , 성균관대학교산학협력단
- 申请人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 专利权人： 삼성전자주식회사,성균관대학교산학협력단
- 当前专利权人： 삼성전자주식회사,성균관대학교산학협력단
- 当前专利权人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 代理人： 리앤목특허법인
- 主分类号： H05H1/26
- IPC分类号： H05H1/26 ; H01L21/205
摘要：
A plasma processing apparatus having linear antennas is provided to improve density uniformity of plasma by changing a thickness of a dielectric for surrounding the linear antenna. A plasma processing apparatus having linear antennas includes a reaction chamber(110), a substrate supporting plate(120), linear antennas(132), an RF power source(138), and a dielectric(142). The substrate supporting plate is installed in a lower side of the inside of the reaction chamber in order to support a substrate to be processed. The linear antennas are used for inducing electric field to generate electric field. The linear antennas are installed in parallel to each other at an upper side of the inside of the reaction chamber. The RF power source is connected to the linear antennas in order to supply RF power to the linear antennas. The dielectric is formed to surround each of the linear antennas. The thickness of the dielectric is gradually reduced from a RF power input terminal of each linear antenna to a grounding terminal(132b).
摘要（中）：
提供具有线性天线的等离子体处理装置，通过改变用于包围线状天线的电介质的厚度来改善等离子体的密度均匀性。 具有线性天线的等离子体处理装置包括反应室（110），基板支撑板（120），线性天线（132），RF电源（138）和电介质（142）。 基板支撑板安装在反应室内侧的下侧，以便支撑待处理的基板。 线性天线用于感应电场以产生电场。 线性天线在反应室内部的上侧彼此平行地安装。 RF电源连接到线性天线，以便向线性天线提供RF功率。 电介质形成为围绕每个线性天线。 电介质的厚度从每个线性天线的RF功率输入端逐渐减小到接地端子（132b）。