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    • 22. 发明公开
    • 전기적 연결부 및 그 제조 방법
    • 电气连接器及其制造方法
    • KR1020100023835A
    • 2010-03-04
    • KR1020097024857
    • 2008-03-18
    • 티이 커넥티비티 네덜란드 비.브이.
    • 반후프,랜디쉬팔스,프레드베렌스,루크반더브루그겐,톤
    • H01R43/24H01R13/04
    • H01R43/24Y10T29/4922
    • A method for manufacturing an electrical contact module is provided, comprising forming a lead-frame of electrical conductors, wherein at least one supporting strip is formed in the lead-frame of electrical conductors in such a way as to maintain the electrical conductors in a predetermined position with respect to each other, over-molding the lead-frame of electrical conductors with a first dielectric material, thereby obtaining a first over-molded lead-frame, wherein at least one aperture is formed in the first over-molded lead-frame so that the at least one supporting strip is accessible for being removed, removing the at least one supporting strip in the first over-molded lead-frame after completion of the over-molding step, and over-molding the first over-molded lead-frame with a second dielectric material in such manner as to fill the at least one aperture and a space left between the electrical conductors after removal of the at least one supporting strip.
    • 提供了一种用于制造电接触模块的方法,包括形成电导体的引线框架,其中至少一个支撑条形成在电导体的引线框架中,以便将电导体保持在预定的 相对于彼此的位置,用第一介电材料对导电体的引线框架进行过模制,从而获得第一过模制引线框架,其中在第一覆盖模制引线框架中形成至少一个孔口 使得所述至少一个支撑条可接近以被移除,在完成所述超模制步骤之后移除所述第一覆盖模制引线框架中的所述至少一个支撑条,以及对所述第一超模制引线框架进行过模制, 框架具有第二电介质材料,以便在移除所述至少一个支撑带之后填充所述至少一个孔和留在所述电导体之间的空间。
    • 27. 发明公开
    • 반도체 장치 시험용 콘택터의 제조 방법
    • 用于测试半导体器件的接触器及其测试半导体器件的制造方法和载体
    • KR1020000047418A
    • 2000-07-25
    • KR1019990023100
    • 1999-06-19
    • 후지쯔 가부시끼가이샤
    • 하세야마마꼬또마루야마시게유끼
    • H01L21/66
    • G01R1/0433Y10T29/49147Y10T29/49149Y10T29/49208Y10T29/4922
    • PURPOSE: A contactor for testing a semiconductor device and a method for manufacturing the contactor, and a carrier for testing the device are provided to enhance reliability, to simplify a manufacturing process, and to economize components. CONSTITUTION: A contactor(10A) is electrically coupled to electrodes(2) of semiconductor devices(1) such as a bare chip, a wafer, or various packages, to perform a desired test of the device(1). The contactor(10A) includes a wiring substrate(11A) and a stiffener(12A) fixedly adhered to a rear surface of the substrate(11A). The wiring substrate(11A) has a base film(13A) such as polyimide and a number of conductive patterns(14) formed on the base film(13A). In addition, each conductive pattern(14) is connected to a contact pad(15) corresponding to the electrode(2) at the inner end, and to a terminal pad(16) at the outer end. Furthermore, the contactor(10A) is used for a test carrier together with a pressing tool. When the semiconductor device(1) is placed on the wiring substrate(11A) of the contactor(10A), the pressing tool presses downward the device(1) so that the electrodes(2) are electrically coupled to the contact pads(15) on the substrate(11A).
    • 目的:提供用于测试半导体器件的接触器和用于制造接触器的方法,以及用于测试该器件的载体,以提高可靠性,简化制造过程和节约部件。 构成:接触器(10A)电耦合到诸如裸芯片,晶片或各种封装的半导体器件(1)的电极(2),以执行器件(1)的期望测试。 接触器(10A)包括固定在基板(11A)的后表面上的布线基板(11A)和加强件(12A)。 布线基板(11A)具有聚酰亚胺等基膜(13A)和形成在基膜(13A)上的多个导电图案(14)。 此外,每个导电图案(14)在内端连接到对应于电极(2)的接触焊盘(15),并在外端连接到端子焊盘(16)。 此外,接触器(10A)与压制工具一起用于测试载体。 当将半导体器件(1)放置在接触器(10A)的布线基板(11A)上时,按压工具向下按压器件(1),使得电极(2)电耦合到接触焊盘(15) 在基板(11A)上。