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    • 2. 发明公开
    • 땜납 비축 전달 장치 및 방법
    • 焊接存储和传输设备及方法,用于绑定PCB边缘接触
    • KR1020040049813A
    • 2004-06-12
    • KR1020030087915
    • 2003-12-05
    • 오토스플리스 시스템스, 인코포레이티드
    • 케네디,크레이그엠.이센버그,도날드에스.
    • B23K3/06
    • H01R43/0235H01R4/028H01R12/52H05K3/3405H05K3/3447H05K3/366H05K2201/10303H05K2203/042
    • PURPOSE: A solder storage and transfer device and a method are provided to form a strong solder joining part between contact surfaces by accelerating an SMT(Surface Mount Technology) attachment method of a memory card for a first PCB(Printed Circuit Board) without adding the solder during a second reflow. CONSTITUTION: A solder storage and transfer device is composed of a connecting unit for coupling the solder storage and transfer device to a connector(10) and a second spot separated from a first spot at a constant gap on the solder storage and transfer device and formed with the storage reserve of solidified and reflowed solder(42) enough to form a strong solder joining part between a first surface region and the other electrical contact if the solder is melted again and transferred to the first spot. If the solder storage and transfer device and the connector are heated up to a solder reflow temperature during a following step, the strong solder joining part is formed between a first contact surface region and the other electrical contact in cooling by re-melting and permeating the solidified and reflowed solder reverses from the second spot to the first spot.
    • 目的:通过加速用于第一PCB(印刷电路板)的存储卡的SMT(表面贴装技术)附接方法,提供焊料储存和转移装置和方法以在接触表面之间形成强焊料接合部分,而不添加 在第二回流焊接。 构成:焊料储存和转移装置由用于将焊料储存和转移装置连接到连接器(10)的连接单元和在焊料储存和转移装置上以恒定间隙从第一点分离的第二点形成 如果焊料再次熔化并转移到第一点,则固化和回流焊料(42)的储存储备足以在第一表面区域和另一个电触点之间形成强焊料接合部分。 如果在随后的步骤中将焊料储存和转移装置和连接器加热到焊料回流温度,则在第一接触表面区域和另一个电接触件之间形成强焊料接合部分,通过再熔化和渗透 固化和回流焊料从第二个位置反转到第一个点。