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11. 发明公开

KR1020080012456A 바텀 솔더 레지스트가 형성된 기판 无效
标题翻译：印刷电路板形成底部焊接电阻
公开(公告)号：KR1020080012456A
公开(公告)日：2008-02-12
申请号：KR1020060073286
申请日：2006-08-03
申请人： 엘지이노텍 주식회사
发明人： 구자권 , 김철호 , 손경주 , 이규현
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H05K1/184 , H05K3/341
摘要： A board with a bottom solder resister is provided to prevent a bonding surface between the board and a chip device from being damaged by using the bottom solder resister for uniformly transmitting external pressure. At least one chip device(140) is mounted on a top surface of a board layer(110). A bottom solder resister(120) including a linear solder resister is formed on a bottom surface of the board layer, the linear solder resister being formed between the chip devices in the area which deviates from a mounting region of the chip device. The solder resister has a thickness of 10 micrometers to 20 micrometers. The solder resister is formed in a lattice shape between the chip devices.
摘要翻译：提供具有底部阻焊器的电路板，以防止通过使用底部焊料阻止板和芯片器件之间的接合表面来均匀地传输外部压力。至少一个芯片装置（140）安装在板层（110）的顶表面上。包括线性阻焊器的底部焊料（120）形成在基板层的底表面上，线性阻焊器形成在偏离芯片器件的安装区域的区域中的芯片器件之间。阻焊器的厚度为10微米至20微米。阻焊器在芯片器件之间形成为格子状。

12. 发明授权

KR100738448B1 ＩＣ태그 실장 프린트 회로 배선 기판 및 ＩＣ태그 실장 프린트 회로 배선 기판의 제조 방법 失效
标题翻译： IC标签轴承接线板及其制造方法
公开(公告)号：KR100738448B1
公开(公告)日：2007-07-12
申请号：KR1020050039756
申请日：2005-05-12
申请人： 가부시키가이샤 히타치세이사쿠쇼
发明人： 사카마이사오 , 아시자와미노르
IPC分类号： G01S13/75 , G06K19/077
CPC分类号： H05K1/16 , H01Q1/2225 , H01Q9/285 , H01Q19/24 , H05K1/0266 , H05K1/184 , H05K3/403 , H05K2201/10098 , H05K2201/10446 , H05K2201/10651
摘要： 본 발명은 IC태그 실장 프린트 회로 배선 기판 및 IC태그 실장 프린트 회로 배선 기판의 제조 방법에 관한 것으로서 프린트 회로 배선 기판(1)의 앞측면(1b)에는 절개홈(1c)이 형성되어 있다. 그리고 절개홈(1c)내에는 IC칩(4)이 프린트 회로 배선 기판(1)의 제1 주표면(1a), 제2 주표면 및 앞측면(1b)으로부터 돌출하지 않도록 수납되고 있다. 또 앞측면(1b)에는 IC칩(4)을 중심으로 하여 안테나(3)가 형성되고 IC칩(4)과 접속되고 있다. 안테나(3)는 송신하는 전파의 반파장의 길이를 가지는 다이폴 안테나를 구성하고 있으며 무선용 IC태그의 송신 거리를 저하 시키는 일 없이 전자 패턴의 실장 효율을 높게 하는 기술을 제공한다.

13. 发明公开

KR1020070009601A 무선 기판형 센서 无效
标题翻译：无线基板状传感器
公开(公告)号：KR1020070009601A
公开(公告)日：2007-01-18
申请号：KR1020067020138
申请日：2005-03-09
申请人： 싸이버옵틱스 쎄미콘덕터 인코퍼레이티드
发明人： 램시,크레이그,씨. , 가드너,델레이,에치. , 라산,제프리,케이.
IPC分类号： H01L21/68 , H01L21/67 , H01L21/66
CPC分类号： H01L21/67253 , H01L21/67259 , H05K1/183 , H05K1/184 , H05K2201/09981 , H05K2201/10151 , H05K2201/10727
摘要： In accordance with an aspect of the present invention, a wireless substrate-like sensor (112, 118) is configured to ensure it does not contaminate a semiconductor processing chamber. The sensor (112, 118) is sealed except for one or more apertures (272, 282). In one embodiment, a vent is disposed proximate the apertures. In another embodiment, the aperture is coupled to a pressure equalization member (284) that deforms in response to a differential in pressure between the sensor interior and exterior. ® KIPO & WIPO 2007
摘要翻译：根据本发明的一个方面，无线基板状传感器（112,118）被配置为确保其不会污染半导体处理室。除了一个或多个孔（272,282）之外，传感器（112,118）被密封。在一个实施例中，排气口设置在孔附近。在另一个实施例中，孔被耦合到压力平衡构件（284），压力平衡构件（284）响应于传感器内部和外部之间的压力差而变形。 ®KIPO＆WIPO 2007

14. 发明公开

KR1020060134393A 전자부품 내장 인쇄회로기판 및 그 제작방법 失效
标题翻译：具有嵌入式电子部件的印刷电路板及其制造方法
公开(公告)号：KR1020060134393A
公开(公告)日：2006-12-28
申请号：KR1020050054035
申请日：2005-06-22
申请人： 삼성전기주식회사
发明人： 조석현 , 류창섭 , 조한서 , 백상진 , 안진용
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K1/184 , H01L24/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/185 , H05K3/4046 , H05K2201/0355 , H05K2201/10643 , Y10T29/4913
摘要： A printed circuit board with an embedded electronic component and a fabrication method thereof are provided to obtain high electrical reliability by connecting the electronic component by direct coupling between a bonding layer and an electrode of the electronic component. In a printed circuit board(30) with an embedded electronic component comprising an external electrode, a base film(31) is composed of an insertion hole(33) accommodating the electronic component. A filler(35) is filled between the electronic component and the insertion hole, and fixes the electronic component. A bonding layer(37) is bonded with the electrode, by being stacked on the base film. A circuit is formed on the bonding layer.
摘要翻译：提供具有嵌入式电子部件的印刷电路板及其制造方法，以通过电子部件的接合层和电极之间的直接耦合来连接电子部件来获得高的电气可靠性。在具有包括外部电极的嵌入式电子部件的印刷电路板（30）中，基膜（31）由容纳电子部件的插入孔（33）构成。填充物（35）填充在电子部件和插入孔之间，并固定电子部件。接合层（37）通过层叠在基膜上与电极接合。在接合层上形成电路。

15. 发明公开

KR1020060047818A ＩＣ태그 실장 프린트 회로 배선 기판 및 ＩＣ태그 실장 프린트 회로 배선 기판의 제조 방법 失效
标题翻译： IC标签轴承接线板及其制造方法
公开(公告)号：KR1020060047818A
公开(公告)日：2006-05-18
申请号：KR1020050039756
申请日：2005-05-12
申请人： 가부시키가이샤 히타치세이사쿠쇼
发明人： 사카마이사오 , 아시자와미노르
IPC分类号： G01S13/75 , G06K19/077
CPC分类号： H05K1/16 , H01Q1/2225 , H01Q9/285 , H01Q19/24 , H05K1/0266 , H05K1/184 , H05K3/403 , H05K2201/10098 , H05K2201/10446 , H05K2201/10651
摘要： 본 발명은 IC태그 실장 배선판 및 IC태그 실장 배선판의 제조 방법에 관한 것으로서 프린트 배선판(1)의 앞측면(1b)에는 절개홈(1c)이 형성되어 있다. 그리고 절개홈(1c)내에는 IC칩(4)이 프린트 배선판(1)의 제1 주표면(1a), 제2 주표면 및 앞측면(1b)으로부터 돌출하지 않도록 수납되고 있다. 또 앞측면(1b)에는 IC칩(4)을 중심으로 하여 안테나(3)가 형성되고 IC칩(4)과 접속되고 있다. 안테나(3)는 송신하는 전파의 반파장의 길이를 가지는 다이폴 안테나를 구성하고 있으며 무선용 IC태그의 송신 거리를 저하 시키는 일 없이 전자 패턴의 실장 효율을 높게 하는 기술을 제공한다.

16. 发明公开

KR1020040035156A 차량용 무선 송신장치의 배터리 접점구조 失效
标题翻译：电动汽车无线发射机电池接触结构
公开(公告)号：KR1020040035156A
公开(公告)日：2004-04-29
申请号：KR1020020063907
申请日：2002-10-18
申请人： 현대모비스 주식회사
发明人： 강병준
IPC分类号： H05K1/18
CPC分类号： H05K1/184 , H02J7/0045 , H05K3/3468
摘要： PURPOSE: A battery contact structure of a wireless transmitter for vehicle is provided to reduce the number of elements and a manufacturing cost and improve the productivity by forming an anode contact part and a cathode contact part on a PCB. CONSTITUTION: A battery contact structure of a wireless transmitter for vehicle includes a projection part(60) and a cover part(70). A battery(50) is electrically connected to a PCB(40) in order to supply the electric power. The projection part(60) is formed with a convex part having the predetermined height on a battery contact part of the PCB(40). The cover part(70) is fixed on the PCB by pressing elastically a top face of the battery(50) loaded on the projection part. The cover part is formed with a conductor. The projection part is formed by performing a soldering process on the battery contact part.
摘要翻译：目的：提供一种用于车辆的无线发射机的电池接触结构，以通过在PCB上形成阳极接触部分和阴极接触部分来减少元件的数量和制造成本并提高生产率。构成：用于车辆的无线发射机的电池接触结构包括突出部分（60）和盖部分（70）。电池（50）电连接到PCB（40）以供应电力。突出部（60）在PCB（40）的电池接触部分上形成具有预定高度的凸部。通过弹性地按压装载在突出部上的电池（50）的顶面，将盖部（70）固定在PCB上。盖部分形成有导体。通过对电池接触部进行焊接处理来形成投影部。

17. 发明公开

KR1020010076477A 패키지기판의 메인기판 연결장치 无效
标题翻译：用于连接包装基板的主基板的装置
公开(公告)号：KR1020010076477A
公开(公告)日：2001-08-16
申请号：KR1020000003639
申请日：2000-01-26
申请人： 삼성전기주식회사
发明人： 정재헌
IPC分类号： H05K13/00
CPC分类号： H05K3/3436 , H01R13/04 , H05K1/184 , H05K3/3415 , H05K3/3447
摘要： PURPOSE: An apparatus for connecting a main substrate of a package substrate is provided to freely install a package substrate, prevent inconvenience that a whole substrate is changed according to packaging density, and reduce processing time and manufacturing costs. CONSTITUTION: A solder ball is attached on a package substrate. The package substrate is installed on a main substrate. A chip component(115) is connected through an electrode pattern. The chip component(115) is attached on the package substrate(125) by an adhesive(120). A mold layer is formed on an upper side of the chip component(115) to be fixed. A solder ball(130) electrically connected to the electrode pattern(120) is formed on a lower surface of the package substrate(125). A plurality of pins(150) are integrally contacted with CCL on an upper side thereof and protruded on a lower side thereof. The solder ball(130) is connected on an upper side of a connecting pin of a connector(135) which is fixedly inserted into a fixing hole(145) of the CCL(140). A lower part of the connecting pin passes through the main substrate(160) and inserted into a via-hole(170). The via-hole(170) allows electrode patterns(160A) on upper and lower sides to be communicated. An end part of the pin inserted into the via-hole(170) is fixed on a lower surface of the main substrate(160) by a welding process.
摘要翻译：目的：提供一种用于连接封装基板的主基板的装置以自由地安装封装基板，防止根据封装密度改变整个基板的不便，并且减少处理时间和制造成本。构成：焊球附着在封装衬底上。封装衬底安装在主衬底上。芯片组件（115）通过电极图案连接。芯片组件（115）通过粘合剂（120）附接在封装衬底（125）上。在芯片部件（115）的上侧形成有待固定的模层。电连接到电极图案（120）的焊球（130）形成在封装衬底（125）的下表面上。多个销（150）在其上侧与CCL一体地接触并且在其下侧突出。焊球130连接在固定插入CCL（140）的固定孔（145）的连接器（135）的连接销的上侧。连接销的下部通过主基板（160）并插入到通孔（170）中。通孔（170）允许上侧和下侧的电极图案（160A）连通。插入通孔（170）的销的端部通过焊接工艺固定在主基板（160）的下表面上。

18. 发明公开

KR1020010011829A ＬＥＤ 높이조절 장치 无效
标题翻译：调节LED高度的装置
公开(公告)号：KR1020010011829A
公开(公告)日：2001-02-15
申请号：KR1019990031390
申请日：1999-07-30
申请人： 에스케이하이닉스 주식회사
发明人： 권승찬
IPC分类号： H05K3/30
CPC分类号： H05K3/301 , H05K1/184 , H05K3/306 , H05K2201/10106
摘要： PURPOSE: A device for adjusting the height of an LED is provided to freely adjust the height of the LED after the LED is fixed to a printed circuit board. CONSTITUTION: A base portion is positioned in a printed circuit board. Two LED lead inserting holes are formed in the base portion. Two posts are vertically extended on both sides of the base portion. T-shaped wing guide recesses are formed in the posts upwardly and downwardly. Wave-shaped height adjusting recesses are formed on cut-off surfaces of the wing guide recesses. A PCB fixing hook is mounted to the lower portion of the base portion, and adheres the base portion to the printed circuit board. A body has an LED mounting recess and two LED lead guide portions. Two wings are inserted into wing guide recesses.
摘要翻译：目的：提供一种用于调节LED高度的装置，用于在将LED固定到印刷电路板之后自由调节LED的高度。构成：基座部分位于印刷电路板中。在基部形成两个LED引线插入孔。两个柱在基部的两侧垂直延伸。 T形翼导向凹槽在柱上向上和向下形成。波形高度调节凹部形成在翼导向凹槽的切割面上。 PCB固定钩安装到基部的下部，并将基部粘合到印刷电路板。主体具有LED安装凹槽和两个LED引线引导部分。两个翼插入机翼导向凹槽。

19. 发明公开

KR1020000036299A 스테레오볼륨조절용 회로기판 인쇄방법 및 그 구조 失效
标题翻译：用于立体声音量控制和打印方法的电路板
公开(公告)号：KR1020000036299A
公开(公告)日：2000-07-05
申请号：KR1019990049796
申请日：1999-11-10
申请人： 김기홍
发明人： 김기홍
IPC分类号： H05K3/30
CPC分类号： H05K1/0257 , H05K1/184
摘要： PURPOSE: A method for manufacturing a board for a stereo volume control by forming one silver terminal at a center of a PCB and shorting and printing the silver terminal to at least one carbon and a circuit board for a stereo volume control are provided. CONSTITUTION: A circuit board for a stereo volume control includes a silver terminal(200) and at least one carbon(300). The silver terminal(200) is formed at a center portion of a PCB(100). The silver terminal(200) is formed centering around a knob connecting hole(110). A volume control knob is rotatably connected to the knob connecting hole(110). A plurality of connecting terminals are formed at the volume control knob. The at least one carbon(300) is formed at an outer side of the silver terminal(200). The silver terminal(200) and one side of the at least one carbon(300) are shorted to each other.
摘要翻译：目的：提供一种通过在PCB的中心形成一个银端子并将银端子短路并将其印刷到至少一个碳和用于立体声音量控制的电路板来制造用于立体声音量控制的板的方法。构成：用于立体声音量控制的电路板包括银端子（200）和至少一个碳（300）。银端子（200）形成在PCB（100）的中心部分。银端子（200）围绕旋钮连接孔（110）形成。音量控制旋钮可旋转地连接到旋钮连接孔（110）。多个连接端子形成在音量控制旋钮上。所述至少一个碳（300）形成在所述银端子（200）的外侧。银端子（200）和至少一个碳（300）的一侧彼此短路。

20. 发明公开

KR1020000019704A 멀티칩모듈기판및그제조방법 失效
标题翻译：多芯片模块基板及其制造方法
公开(公告)号：KR1020000019704A
公开(公告)日：2000-04-15
申请号：KR1019980037942
申请日：1998-09-15
申请人： 한국전자통신연구원
发明人： 주철원 , 이상복 , 이영민 , 박성수
IPC分类号： H05K3/00
CPC分类号： H05K1/184 , H05K1/115 , H05K3/0023 , H05K3/048
摘要： PURPOSE: A method for fabricating a multi chip module substrate is provided to realize a miniaturization of a multi chip module(MCM) by embedding a resistor. CONSTITUTION: A method for fabricating a multi chip module substrate comprises the steps of: forming an oxide film on a base substrate(10); sequentially forming a ground layer(20), a first insulating layer(72), and a power layer(30); wherein the ground layer is configured by piling a first seed metal layer and a first main metal layer, the first insulation film has a first via hole, and the power layer is configured by piling a second seed metal layer and a second main metal layer; forming a second insulation film(74) having a second via hole on the power layer to then form a resistor(100) at a selected portion of the second insulation film; forming on the second insulation film a first signal layer(40) which is connected to both ends of the resistor and is configured by piling a third seed metal layer and a third main metal layer; forming a third insulation film having a third via hole on an entire structure comprising the first signal layer to then form on the third insulating layer a second signal layer(50) which is configured by piling a fourth seed metal layer and a fourth main metal layer; and forming a fourth insulation film having a fourth via hole on an entire structure comprising the second signal layer to then form on the fourth insulating layer a pad layer which is configured by piling a fifth seed metal layer and a fifth main metal layer;
摘要翻译：目的：提供一种制造多芯片模块基板的方法，通过嵌入电阻实现多芯片模块（MCM）的小型化。构成：制造多芯片模块衬底的方法包括以下步骤：在基底衬底（10）上形成氧化膜; 依次形成接地层（20），第一绝缘层（72）和功率层（30）; 其中，所述接地层通过堆叠第一种子金属层和第一主金属层构成，所述第一绝缘膜具有第一通孔，所述功率层通过堆叠第二种子金属层和第二主金属层构成; 在功率层上形成具有第二通孔的第二绝缘膜（74），然后在第二绝缘膜的选定部分形成电阻（100）; 在所述第二绝缘膜上形成连接到所述电阻器的两端的第一信号层（40），并且通过堆叠第三种子金属层和第三主金属层构成; 在包括第一信号层的整个结构上形成具有第三通孔的第三绝缘膜，然后在第三绝缘层上形成第二信号层（50），该第二信号层通过堆叠第四种子金属层和第四主金属层 ; 以及在包括所述第二信号层的整个结构上形成具有第四通孔的第四绝缘膜，然后在所述第四绝缘层上形成通过堆叠第五种子金属层和第五主金属层构成的焊盘层;

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