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1. 发明专利

JP2013089855A Electrode structure of electronic component 有权
标题翻译：电子元件电极结构
公开(公告)号：JP2013089855A
公开(公告)日：2013-05-13
申请号：JP2011230747
申请日：2011-10-20
申请人： Rohm Co Ltd , ローム株式会社
发明人： TSUKADA TORAYUKI
IPC分类号： H01C3/00 , H01C1/01 , H01C17/14
摘要： PROBLEM TO BE SOLVED: To provide an electrode structure of an electronic component in which exfoliation is minimized by enhancing adhesion of a metal plating layer when an electrode is formed by metal plating.SOLUTION: A columnar through hole 3A is formed in a metal plate 1. A plating electrode layer 2 is formed continuously and integrally across the surface of the metal plate 1, the metal plate 1 on the inside of the through hole 3A, and the rear surface of the metal plate 1. S1 is the connection point of three surfaces of a plating electrode layer 2a laminated on the surface of the metal plate 1 and plating electrode layers 2b and 2c formed in two different directions on the inside of the through hole 3A.
摘要翻译：要解决的问题：提供一种电子部件的电极结构，其中当通过金属电镀形成电极时，通过提高金属镀层的粘附性来最小化剥离。解决方案：在金属板1中形成柱状通孔3A。在金属板1的表面，通孔3A的内部的金属板1上连续整体地形成电镀电极层2，和金属板1的后表面。S1是在金属板1的表面上层压的电镀电极层2a的三个表面的连接点和在两个不同方向上形成的镀覆电极层2b和2c 通孔3A。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP4224190B2 Manufacturing method, and a printed wiring board of the printed wiring board 有权
公开(公告)号：JP4224190B2
公开(公告)日：2009-02-12
申请号：JP2000184386
申请日：2000-06-20
申请人：パナソニック電工株式会社
发明人：晃嗣三輪 , 健二小笠原 , 清志郎山河 , 圭子柏原 , 直仁福家 , 泰輔西森 , 資幸赤松
IPC分类号： H05K1/16 , H01C7/00 , H01C17/08 , H01C17/14 , H01F17/00 , H01G2/06 , H01G4/12 , H01G4/30 , H05K3/46

3. 发明专利

JP2001118701A LOW-RESISTANCE RESISTOR FOR DETECTING CURRENT AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001118701A
公开(公告)日：2001-04-27
申请号：JP29687599
申请日：1999-10-19
申请人： KOA CORP
发明人： NAKAMURA KEIJI , TATSUKUCHI MIKIO , TAKAGI KATSUMI , KAWAGUCHI HIDEJI , KATO HIROSHI
IPC分类号： H01C1/144 , H01C3/00 , H01C7/00 , H01C17/06 , H01C17/14
摘要： PROBLEM TO BE SOLVED: To provide a low-resistance resistor for detecting current which can be reduced in manufacturing cost by simplifying its manufacturing process and reducing the number of parts and, at the same time, can be improved in heat radiating property, and a method for manufacturing the resistor. SOLUTION: A low-resistance resistor 1 for measuring current has a recessed groove 3 formed by cutting the central part of the rear surface of a rectangular flat metallic resistance body 2 having a thickness of about 1-2 mm. On the front surface of the resistance body 2, a pair of electrode pads 4 and 4 for bonding is formed by successively plating copper and nickel in the central parts of both end sections. On the rear surface of the body 2, in addition, a pair of electrodes 5 and 5 to be connected to a printed board, etc., is formed by successively plating copper, nickel, and solder in both end sections on both sides of the groove 3.

4. 发明专利

JP2000260611A BARREL PLATING METHOD FOR ELECTRONIC PART AND NET WORK RESISTOR 失效
公开(公告)号：JP2000260611A
公开(公告)日：2000-09-22
申请号：JP5821999
申请日：1999-03-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMADA HIROYUKI , TSUDA SEIJI
IPC分类号： H01C17/14 , C25D17/16 , H01C17/28
摘要： PROBLEM TO BE SOLVED: To obtain a barrel plating method in which a conductive medium can be prevented from intruding into a notch part of an original unit to be plated or from generating an improper product caused by a pinched part. SOLUTION: This device is provided with a conductive medium 17 of which the form is larger than a notch part provided at an objective material 16 for plating, immersed in a barrel 14 for plating with the original unit 16 to be plated, and barrel plating is made by rotating the barrel 14. Because the conductive medium 17 uses a larger form than the notch part provided at the element unit 16 to be plated, when barrel plating for a terminal part of the original unit 16 to be plated is made, the conductive medium 17 is prevented from intruding into the notch part of the plating element 16 to be plated. As a result, this device has an effect where improper products caused by the conductive medium 17 being intruded or pinched into the notch part of the element 16 to be plated of the conductive media 17 can be prevented.

5. 发明专利

JP2695000B2 失效
公开(公告)号：JP2695000B2
公开(公告)日：1997-12-24
申请号：JP9266389
申请日：1989-04-11
IPC分类号： H01C7/04 , H01C17/14

6. 发明专利

JP2637162B2 失效
公开(公告)号：JP2637162B2
公开(公告)日：1997-08-06
申请号：JP11418088
申请日：1988-05-11
申请人： TEII DEII KEI KK
发明人： ARAI MICHIO
IPC分类号： B41J2/335 , H01C7/00 , H01C17/14 , H01L49/00

7. 发明专利

JPH06188109A MANUFACTURE OF RESISTANCE ELEMENT NETWORK COMPOSED OF CONDUCTIVE POLYMER AND SUPPORT BODY OF SAID RESISTANCE ELEMENT NETWORK 失效
公开(公告)号：JPH06188109A
公开(公告)日：1994-07-08
申请号：JP23187493
申请日：1993-09-17
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： BERUNAARU JIEFURUWAA , KURISUCHIYAN NOU , ANDORE ROJIRIO , SHIYARURU ROJIRIO , FURANSHISU DEYUBUO
IPC分类号： H01C17/14 , H01C7/00 , H01L21/02
摘要： PURPOSE: To manufacture a straight resistance element network the dimension of which extends a large area is manufactured on a support by using technique free from corrosion requiring a low cost. CONSTITUTION: A resistance element network 6a consists of an organic polymer of electronic conductivity by being doped with anions. This resistance element network 6a is formed especially on an integrated circuit 2 with a flat metallic stud or block 4.

8. 发明专利

JPH02209701A ELECTRONIC CIRCUIT HAVING THIN FILM RESISTANCE ELEMENT AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH02209701A
公开(公告)日：1990-08-21
申请号：JP14143589
申请日：1989-06-03
申请人： FUJIKURA LTD
发明人： TOMINAGA HARUO , TAKAYAMA TERUYUKI , KUROSAKA AKITO , TOMOMATSU KAZUHIKO
IPC分类号： C01G29/00 , H01C7/00 , H01C7/06 , H01C17/14 , H05K1/16
摘要： PURPOSE:To reduce a time required for manufacture by a method wherein a resistance element is formed on a substrate by chemical vapor deposition of Bi-Sr-M-Cu-O system oxide. CONSTITUTION:A resistance element is formed by a substrate by chemical vapor deposition of Bi-Sr-M-Cu-O system oxide (wherein M denotes at least one element selected among Cd, Zn, Mg and Hg). The oxide deposited on the substrate may be La-Sr-M-Cu-O system oxide or Bi-La-Sr-M-Cu-O system oxide. The thin film formed on the substrate is patterned to form an electronic circuit which has the built-in thin film resistance element having predetermined thickness, width and length. As the resistance element is formed on the substrate as the thin film resistance element, the small size and thin electronic circuit can be obtained easily. Moreover, as the temperature coefficient of the resistance element is small over a wide temperature range, the resistance element with low current noise and high performance can be obtained.

9. 发明专利

JPS5548684B2 失效
公开(公告)号：JPS5548684B2
公开(公告)日：1980-12-08
申请号：JP208073
申请日：1972-12-29
IPC分类号： H01C10/30 , H01C17/06 , H01C17/14

10. 发明专利

JPS5543268B2 失效
公开(公告)号：JPS5543268B2
公开(公告)日：1980-11-05
申请号：JP12838872
申请日：1972-12-21
IPC分类号： H01C17/14 , H01G4/10 , H01L21/3205 , H05K3/18 , H05K3/46

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