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    • 3. 发明专利
    • Composite repair method and composite
    • 复合修复方法和复合材料
    • JP2014100847A
    • 2014-06-05
    • JP2012253983
    • 2012-11-20
    • Mitsubishi Aircraft Corp三菱航空機株式会社
    • SHIGETOMI TOSHIKAZUSUHARA MASAYOSHIISHIDA MORIMASAMUTO SHUHEI
    • B29C73/10B29L31/30
    • B64C3/26B29C73/06B29C73/10B29C73/26B29C2073/264B29C2073/268B32B37/1009B32B38/10B64F5/40Y10T428/20
    • PROBLEM TO BE SOLVED: To provide, in a case where a composite is damaged over the entire thickness direction thereof, a repair method based on access from one side thereof.SOLUTION: In a repair method of the present invention, a frustum-shaped range of a composite 10 is removed, and the composite 10 is adhered to a repair material 20 by performing a vacuum draw. The method of the present invention includes a removal step S2 of removing a damaged portion 11 from the front surface 10A side by punching through the thickness direction thereof in a state where a support wall 14 abutting inward along the diametrical direction from the peripheral edge of the vertex plane 32 of the frustum remains, a rear surface side sealing step S3 of sealing the rear surface 10B side by installing, on the support wall 14, a sealing plate 15 inserted, from the front surface 10A side, into a through-hole 12 formed as a result of removal, a repair material configuration step S5 of configuring, via an interposing adhesive AD, the repair material 20 on the composite 10 from which the frustum-shaped range thereof has been removed, and a vacuum draw step S6 of sealing and vacuum-drawing the front surface 10A side.
    • 要解决的问题:在复合材料在其整个厚度方向上损坏的情况下,提供一种基于从其一侧进入的修复方法。解决方案:在本发明的修补方法中,截头锥形范围 去除复合材料10,并通过进行真空拉伸将复合材料10粘附到修补材料20上。 本发明的方法包括一个去除步骤S2,该步骤S2是从沿着直径方向的内侧沿着直径方向从外侧边缘抵接的支撑壁14的状态,通过其厚度方向冲压而从前表面10A侧移除受损部分11 截头锥体的顶面32保持,后表面侧密封步骤S3通过在支撑壁14上安装从前表面10A侧插入到通孔12中的密封板15来密封后表面10B侧 作为去除的结果形成的修复材料配置步骤S5,通过中间粘合剂AD将修复材料20配置在去除其截头圆锥形范围的复合材料10上,以及密封 并真空拉伸前表面10A侧。
    • 6. 发明专利
    • Mems device and its assembly method
    • MEMS器件及其组装方法
    • JP2008068396A
    • 2008-03-27
    • JP2007236247
    • 2007-09-12
    • Asml Netherlands Bvエーエスエムエル ネザーランズ ビー.ブイ.
    • BEX JANKNAAPEN RAYMOND JACOBUSNIJSSE GERARD JOHANNES PIETERKUMS GERARD
    • B81C3/00B81B1/00
    • B81C3/001B81C2203/032Y10T428/20Y10T428/218Y10T428/219Y10T428/249953
    • PROBLEM TO BE SOLVED: To improve flatness of a MEMS device so that mating faces of the MEMS device and substrate are joined by using an adhesive. SOLUTION: A method for gluing the MEMS device to the substrate in order to form a MEMS device assembly comprises the steps of: measuring at least one of a thickness profile S100a of the MEMS device and flatness S100b of the mating face of the substrate; S110 applying the adhesive on at least one of the mating face of the MEMS device and mating face of the substrate; and S120 joining the mating faces of the MEMS device and substrate so that the adhesive makes the MEMS device and substrate glue. An amount of the adhesive applied on one of two mating faces or both mating faces is selected so as to compensate the thickness profile of the MEMS device and the locally fluctuated flatness of the mating face of the substrate. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了提高MEMS器件的平坦度,使得通过使用粘合剂将MEMS器件和衬底的配合面接合。 解决方案:用于将MEMS器件胶合到衬底以形成MEMS器件组件的方法包括以下步骤:测量MEMS器件的厚度分布S100a和配对面的平坦度S100b中的至少一个 基质; S110将粘合剂施加到MEMS装置的配合面和基板的配合面中的至少一个上; 和S120连接MEMS器件和衬底的配合面,使得粘合剂使得MEMS器件和衬底胶合。 选择施加在两个配合面中的一个或两个配合面上的粘合剂的量,以补偿MEMS装置的厚度分布和基板的配合面的局部波动的平坦度。 版权所有(C)2008,JPO&INPIT