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1. 发明专利

KR102231368B1 KR102231368B1 - Display module and liquid crystal display screen 有权
公开(公告)号：KR102231368B1
公开(公告)日：2021-03-23
申请号：KR1020197013673A
申请日：2016-11-15
申请人： 우한 차이나 스타 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드
发明人： 창웬 마 , 천-헝 후앙 , 차우 창 , 유쳉 타이 , 판 츄
IPC分类号： G09G3/36 , G02F1/1333 , G02F1/1345 , G06F3/041 , H05K1/14
CPC分类号： G09G3/3666 , G06F3/0412 , G06F3/04184 , H05K1/147 , G02F1/13338 , G02F1/13452 , G09G2300/0408 , G09G2310/0205 , G09G2310/067 , G09G2320/0223 , G09G2320/043 , G09G3/3696 , H05K2201/052 , H05K2201/056 , H05K2201/058
摘要： 본 출원은 디스플레이 모듈에 대해 공개하였다. 이는 연성 회로기판, 제1 드라이브 칩, 제2 드라이브 칩 및 디스플레이 패널을 포함하고, 상기 디스플레이 패널을 심리스(seamless)하게 연결한 제1 디스플레이 영역과 제2 디스플레이 영역을 포함하고, 상기 제1 드라이브 칩 및 상기 제2 드라이브 칩은 상기 디스플레이 패널 상에 장착되고, 상기 연성 회로기판은 시스템 메인 보드와 상기 제1 드라이브 칩 및 제2 드라이브 칩을 전기적으로 연결하고, 상기 제1 동기화 신호 및 상기 제2 동기화 신호는 상기 제1 디스플레이 영역 및 상기 제2 디스플레이 영역을 제어하여 디스플레이 이미지를 동기화한다. 본 출원은 액정 디스플레이 스크린에 대해 더 공개하였다. 제1 드라이브 칩 및 제2 드라이브 칩은 각각 제1 디스플레이 영역 및 제2 디스플레이 영역을 각각 구동하여 출력 이미지를 동기화하고, 픽셀 충전 시간을 반으로 줄이고, 제1 드라이브 칩 및 제2 드라이브 칩의 동시 구동 작업은 하나의 드라이브 칩의 부하를 절감하여 충전 신호 감쇠가 비교적 빠르게 진행된다는 문제를 해결하였고, 큰 사이즈의 디스플레이 장치의 디스플레이 효과를 제고하였다.

2. 发明专利

JP2016525794A 軟性印刷回路基板の構造体有权
公开(公告)号：JP2016525794A
公开(公告)日：2016-08-25
申请号：JP2016525300
申请日：2014-07-24
申请人：エルジー・ケム・リミテッド
发明人：ドゥクス・オー , スン・スー・パク , ミンスー・カン
IPC分类号： H05K1/14 , H01L51/50 , H05B33/02 , H05B33/06
CPC分类号： H05K1/028 , H01L27/3276 , H05K1/111 , H05K1/117 , H05K1/118 , H05K1/14 , H05K1/141 , H05K1/142 , H05K1/145 , H05K1/147 , H05K1/189 , H05K3/323 , H05K3/361 , H05K3/363 , H05K2201/0397 , H05K2201/046 , H05K2201/05 , H05K2201/058 , H05K2201/09418 , H05K2201/10128 , H05K2201/10681 , H05K2203/049
摘要：本願は、ディスプレイ素子において、基板上に設けられた軟性印刷回路基板の構造に関するものである。

3. 发明专利

JP5811306B1 信号伝送部品および電子機器有权
标题翻译：信号传输部件和电子设备
公开(公告)号：JP5811306B1
公开(公告)日：2015-11-11
申请号：JP2015515326
申请日：2014-12-10
申请人：株式会社村田製作所
发明人：用水邦明
IPC分类号： H01P3/08 , H01P1/04 , H01P1/02 , H01P5/08
CPC分类号： H01P3/08 , H01L23/12 , H01L23/66 , H01P5/028 , H05K1/118 , H05K1/147 , H01L2924/0002 , H05K1/0251 , H05K1/0253 , H05K2201/0191 , H05K2201/058 , H05K2201/0919 , H05K2201/09445 , H05K2201/09727 , H05K2201/09845 , H05K2201/10189
摘要：信号伝送部品である信号伝送ケーブル(10)は、積層体(100)を備える。積層体(100)は、第1方向の一方端(EL11)に薄厚部(191)を備え、第1方向の他方端(EL12)に薄厚部(192)を備える。積層体(100における薄厚部(191,192)の間の部分は主線路部(190)となる。薄厚部(191,192)の厚みは、主線路部(190)の厚みよりも薄い。主線路部(190)と薄厚部(191,192)とから構成される積層体(100)の厚さ方向の一方端の面は、連続する平坦面となっている。薄厚部(191,192)における主線路部(190)との間で段差を有する側の面には、外部接続用コネクタ(71,72)が設置されている。
摘要翻译：信号传输部分，一个信号传输电缆（10）包括层压板（100）。层压体（100）包括在所述第一方向上的一个端部薄的部分（EL 11）包括（191）包括所述薄部（192）于第一方向（EL12）的另一端。层压体（100（191，192），并且包括一个主干线部分（190）。所述薄部（191的厚度，192）的薄壁部之间的部分比主线部（190）的厚度薄。主线部分（190 ），并且因为构成的层压体（100薄壁部（191，192）的厚度方向的端部）中的一个表面是平坦表面连续。薄壁部（191的主线部，192）和（190）在具有用于外部连接的连接器之间的水平差的一侧的表面（71，72）安装。

4. 发明专利

JP2014111352A Surface-treated copper foil, and laminate, printed wiring board, and copper-clad laminate made therefrom 审中-公开
公开(公告)号：JP2014111352A
公开(公告)日：2014-06-19
申请号：JP2013135592
申请日：2013-06-27
申请人： Jx Nippon Mining & Metals Corp , Jx日鉱日石金属株式会社
发明人： ARAI EITA , MIKI ATSUSHI , ARAI YASUNORI , NAKAMURO KAICHIRO
IPC分类号： B32B15/088 , B32B15/08 , C25D7/06 , H05K1/09
CPC分类号： H05K3/022 , C25D1/04 , C25D7/0614 , H05K1/028 , H05K1/0346 , H05K1/09 , H05K1/14 , H05K3/361 , H05K3/384 , H05K2201/0154 , H05K2201/0317 , H05K2201/0355 , H05K2201/05 , H05K2201/058 , Y10T29/49126 , Y10T428/12431 , Y10T428/24917 , Y10T428/31681
摘要： PROBLEM TO BE SOLVED: To provide surface-treated copper foil having good adhesion with a resin, which achieves excellent visibility when observed through the resin; and a laminate made therefrom.SOLUTION: The surface-treated copper foil is laminated to a polyimide having a ΔB(PI) of 50 or more and 65 or less before lamination to the copper foil so as to constitute a copper-clad laminate having a color difference ΔE*ab of 50 or more based on JIS Z8730 at the surface through the polyimide. The copper foil is photographed with a CCD camera through the polyimide laminated on a surface treated side. The brightness of the photographed image is measured for each observation spot along the direction perpendicular to the extending direction of the observed copper foil, so that an observation spot vs brightness graph is made. From the brightness curve extending from the end of the copper foil to a part having no copper foil in the graph, a top average Bt and a bottom average Bb are obtained. The surface-treated copper foil has a difference ΔB(ΔB=Bt-Bb) of 40 or more.

5. 发明专利

JP5274944B2 Conductor modules and electromagnetic welding method 有权
公开(公告)号：JP5274944B2
公开(公告)日：2013-08-28
申请号：JP2008229738
申请日：2008-09-08
申请人：矢崎総業株式会社
发明人：善崇杉山 , 健一花崎 , 友勝相沢
IPC分类号： H01R12/61 , B23K20/06 , H01R4/02 , H01R43/02 , H05B6/10
CPC分类号： H01R12/61 , B23K13/01 , B23K20/06 , B23K2201/38 , H01R43/02 , H05K3/28 , H05K3/328 , H05K3/3494 , H05K3/361 , H05K3/4084 , H05K2201/0382 , H05K2201/058 , H05K2203/101
摘要： The present invention is intended to provide an enhanced conductor module capable of reducing a joint area between conductors, and a method for preparing the same. The conductor module has a pair of flattened circuits each of which comprises a rectangular shaped conductors, a pair of sheeted coverings disposed on both sides of the conductor, and at least one hole having a diameter smaller than a width of the conductor, and formed in the coverings so as to expose one surface of the conductor to outside the flattened circuit. The conductor of one flattened circuit is joined to the conductor of the other flattened circuit via the hole by application of electromagnetic welding.

6. 发明专利

JPWO2008059571A1 回路基板の接続構造および回路基板审中-公开
公开(公告)号：JPWO2008059571A1
公开(公告)日：2010-02-25
申请号：JP2008544034
申请日：2006-11-15
申请人：パナソニック株式会社
发明人：鈴木　啓之 , 啓之鈴木
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K3/361 , H05K1/117 , H05K3/323 , H05K2201/058 , H05K2201/09381 , H05K2201/0949 , H05K2201/09709
摘要：対向配置された接続部間の異方性導電性接着剤における余剰分のみを円滑、かつ、的確に排出できる回路基板の接続構造および回路基板を提供する。回路基板の接続構造10は、異方性導電性接着剤16を介して第1接続部13Aと、第2接続部14Aとを対向配置させ、接続される。この回路基板の接続構造10は、第1基材の第1配線パターンの第1端部19Aと、第1基材の第2配線パターンの第1端部39Aとを結ぶ線26が、第1基材の第1配線パターン19の幅方向と、第1基材の第2配線パターン39の幅方向とに沿う配列方向に対して所定の角度で交差するように構成されている。

7. 发明专利

JP2008310285A Flexible printed board, and imaging device equipped therewith 审中-公开
标题翻译：柔性印刷板及其成像装置
公开(公告)号：JP2008310285A
公开(公告)日：2008-12-25
申请号：JP2008026828
申请日：2008-02-06
申请人： Panasonic Corp , パナソニック株式会社
发明人： HASEGAWA ATSUSHI , SHINANO FUMIO , KUWABARA TAKUMI , KOBAYASHI MANABU
IPC分类号： G03B17/02 , G02B7/02 , H05K1/02
CPC分类号： H05K1/0256 , G02B7/102 , H05K1/189 , H05K3/363 , H05K2201/055 , H05K2201/058
摘要： PROBLEM TO BE SOLVED: To surely attain an insulated state by holding a cover part in a casing side, in constitution of covering a connection part by one part of an FPC.
SOLUTION: This flexible printed board fixed onto a holding body arranged in an inside of electronic equipment is provided with a main body part 70 built in with electrical wires, the first connection part 71 arranged in the main body part 70 and connected with an electric component or another flexible printed board, and the first cover part 72 formed integrally with the main body part 70 and arranged to cover the first connection part 71, and one part of the first cover part 72 is held by a lens holder 6.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过将壳体侧的盖部分保持在FPC的一部分来覆盖连接部的结构，可以确实获得绝缘状态。解决方案：固定在设置在电子设备内部的保持体上的该柔性印刷电路板设置有由电线内置的主体部分70，第一连接部分71布置在主体部分70中并与电气部件或其他柔性印刷电路板，以及与主体部70一体形成并被配置为覆盖第一连接部71的第一盖部72，第一盖部72的一部分被透镜保持件6保持。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2008078520A Solder joint structure of wiring board 审中-公开
标题翻译：接线板的焊接接头结构
公开(公告)号：JP2008078520A
公开(公告)日：2008-04-03
申请号：JP2006258315
申请日：2006-09-25
申请人： Casio Comput Co Ltd , カシオ計算機株式会社
发明人： OHASHI TAKAFUMI
IPC分类号： H05K1/14
CPC分类号： H05K3/363 , H05K2201/058 , H05K2201/10136
摘要： PROBLEM TO BE SOLVED: To provide the solder joint structure of a wiring board for thinning an application product by limiting the thickness of a joint below the thickness of one wiring board. SOLUTION: Under a state where the board end faces 111 and 211 provided with the connection terminals 121 and 221 of a main flexible wiring board 1 and a light driving flexible wiring board 2 to be conduction bonded are abutting, the connection terminals 121 and 221 of four pairs of corresponding interconnections 12 and 22 extending on a substantially straight line are conduction connected, respectively, by solder 3. Since the thickness at a conduction joint becomes substantially equal to the thickness of a thicker one of the flexible wiring boards 1 ad 2, thinning of a liquid crystal module is promoted. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过将接头的厚度限制在一个布线板的厚度以下，来提供用于使应用产品变薄的布线板的焊接结构。解决方案：在设置有主柔性布线板1的连接端子121和221以及导电接合的光驱动柔性布线板2的板端面111和211抵接的状态下，连接端子121 并且在基本上直线上延伸的四对相应的互连12和22的221分别由焊料3导电连接。由于导电接头处的厚度变得基本上等于较柔性布线板1的厚度 ad 2，促进了液晶模块的变薄。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP6205053B2 軟性印刷回路基板の構造体有权
公开(公告)号：JP6205053B2
公开(公告)日：2017-09-27
申请号：JP2016525303
申请日：2014-07-24
申请人：エルジーディスプレイカンパニーリミテッド
发明人：ドゥクス・オー , スン・スー・パク , ミンスー・カン
IPC分类号： H01L51/50 , H05K1/14
CPC分类号： H05K1/14 , H01L51/5246 , H05K1/028 , H05K1/111 , H05K3/361 , H01L51/0097 , H05K1/115 , H05K1/147 , H05K1/189 , H05K2201/058 , H05K2201/09563 , H05K2201/10128 , H05K2201/10901 , H05K3/323

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