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5. 发明专利

JP2011187534A Method of manufacturing electronic device 审中-公开
标题翻译：制造电子器件的方法
公开(公告)号：JP2011187534A
公开(公告)日：2011-09-22
申请号：JP2010048853
申请日：2010-03-05
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KAMAKURA TOMOYUKI , MOMOSE KAORU
IPC分类号： H01L21/60 , H01L23/52
CPC分类号： H01L24/82 , H01L24/76 , H01L2224/24 , H01L2224/24226 , H01L2224/24998 , H01L2224/25 , H01L2224/32225 , H01L2224/73267 , H01L2224/82007 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To reduce connection resistance when connection wiring is formed on a connection pad made of Al by a droplet discharging method.
SOLUTION: A method of manufacturing an electronic device performs, in order: a first process of arranging an electronic element 10, having the connection pad 20 made of a conductive material formed on a first surface 11 so that at least a part of the surface is exposed, on a wiring board 30 having a wiring pattern 32 on at least one surface so that a second surface 12 as the surface on the opposite side from the first surface 11 faces the one surface; a second process of arranging an oxide removing liquid 48 with which an oxide of the conductive material can be etched on a surface of the connection pad 20; a third process of arranging, after the oxide removing liquid 48 is dried, a liquid body 47 including metal particulates on the surface of the connection pad 20 and the wiring pattern 32, and between the connection pad 20 and wiring pattern 32; and a fourth process of forming connection wiring 35 connecting the connection pad 20 and wiring pattern 32 to each other by heating the liquid body 47 to bake the metal particulates.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了减少当通过液滴喷射方法在由Al制成的连接垫上形成连接布线时的连接电阻。解决方案：电子设备的制造方法按顺序执行：布置电子元件10的第一工序，其具有形成在第一表面11上的由导电材料制成的连接焊盘20，使得至少部分表面在至少一个表面上具有布线图案32的布线板30上露出，使得作为与第一表面11相反一侧的表面的第二表面12面向该表面; 布置氧化物去除液体48的第二工序，可以在连接焊盘20的表面上蚀刻导电材料的氧化物; 在氧化物去除液48干燥之后，在连接焊盘20的表面和布线图案32之间以及连接焊盘20和布线图案32之间布置包括金属微粒的液体47的第三工序; 以及通过加热液体47以形成金属微粒而形成将连接焊盘20和布线图案32相互连接的连接布线35的第四工序。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2011523068A System support and a method of manufacturing the same electronic components 审中-公开
公开(公告)号：JP2011523068A
公开(公告)日：2011-08-04
申请号：JP2011512936
申请日：2009-06-03
申请人：エプコスアクチエンゲゼルシャフトEpcos Ag
发明人：カールウェイトナー， , ウォルフガングパール，
IPC分类号： G01P15/08 , B81B7/02
CPC分类号： H01L23/4985 , B81B7/0048 , B81B2207/07 , H01L23/498 , H01L23/5387 , H01L24/24 , H01L24/80 , H01L24/82 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/76155 , H01L2224/82007 , H01L2224/82102 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/00
摘要： The system support has a flexible support (1) with an upper side, on which a micro-electro-mechanical system component (2) and an application-specific integrated circuit component (3) are mounted. An air gap or a primary layer (7) is provided for mechanically decoupling the components from the flexible support. Conductor paths (8) are arranged for electrically connecting the components at the upper side of the flexible support. The conductor paths are guided to connecting contacts (9) on an upper side of the components, which is turned away from the flexible support. An independent claim is also included for a method for producing a system support for an electronic component.

7. 发明专利

JP2010232375A Electronic device and method of manufacturing the same 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：JP2010232375A
公开(公告)日：2010-10-14
申请号：JP2009077503
申请日：2009-03-26
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： DENDA ATSUSHI
IPC分类号： H01L21/60
CPC分类号： H01L24/82 , H01L2224/24 , H01L2224/24226 , H01L2224/24998 , H01L2224/25 , H01L2224/82007 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/09701 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an electronic device improving the reliability of wiring connecting respective electrode pads, and also to provide a method of manufacturing the electronic device.
SOLUTION: The electronic device 10 is provided with: an inclined part provided with an inclined surface which connects a mounting surface and a pad forming surface and mitigates the level difference of the mounting surface and the pad forming surface; and a metal wiring film 19 laminated on the inclined surface and connected to a first electrode pad 13 and a second electrode pad 15. The inclined part has: an insulating part 16 provided along the peripheral edge of an electronic component; and a conductive part 17 provided on the insulating part 16 and not connecting the first electrode pad 13 and the second electrode pad 15.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种提高连接各个电极焊盘的布线的可靠性的电子器件，并且还提供一种制造电子器件的方法。解决方案：电子设备10设置有：倾斜部分，其具有连接安装表面和焊盘形成表面的倾斜表面，并且减轻安装表面和焊盘形成表面的水平差; 以及层叠在倾斜面上并与第一电极焊盘13和第二电极焊盘15连接的金属布线膜19.倾斜部具有：沿着电子部件的周缘设置的绝缘部16; 以及设置在绝缘部16上并且不连接第一电极焊盘13和第二电极焊盘15的导电部17.版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2010129752A Wiring structure between steps and wiring method thereof 审中-公开
标题翻译：步骤之间的接线结构及其接线方法
公开(公告)号：JP2010129752A
公开(公告)日：2010-06-10
申请号：JP2008302459
申请日：2008-11-27
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： UEHARA NOBORU
IPC分类号： H01L21/60 , H01L23/12 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/05554 , H01L2224/24051 , H01L2224/24145 , H01L2224/24998 , H01L2224/25175 , H01L2224/32145 , H01L2224/32225 , H01L2224/76155 , H01L2224/82007 , H01L2224/82102 , H01L2225/06524 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/19041 , H01L2924/19043
摘要： PROBLEM TO BE SOLVED: To provide a wiring structure between steps and a wiring method between steps which can stably form an insulating slope that should relax a steps portion of a wiring between steps by an inkjet method.
SOLUTION: A steps portion is covered by a first and a second slopes 15, 16 formed of a liquid drop of an insulating ink, and a first and a second metal wiring 18, 19 are respectively prepared on the slope top surfaces by a liquid drop of a conductive ink. At this time, a surface in which the first and the second slopes 15, 16 also including the steps portion are formed is covered with a liquid repellent layer 14 which liquid repels a dispersion medium of the insulating ink, two or more dots 20D by a liquid drop of a resin ink are formed inside a region in which these slopes 15, 16 are formed on the surface of this liquid repellent layer 14. In addition, each of the slopes 15, 16 is formed by a solid layer 21D formed from a liquid drop arranged in an aspect which connects dot rows consists of these dots 20D.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供步骤之间的布线结构和可以稳定地形成绝缘斜面的步骤之间的布线方法，该绝缘斜面应该通过喷墨方法来松弛台阶之间的布线的台阶部分。解决方案：步骤部分由由绝缘油墨的液滴形成的第一和第二斜面15,16覆盖，并且第一和第二金属布线18,19分别在斜面顶表面上由导电油墨的液滴。此时，形成有也包括台阶部的第一斜面15和第二斜面16的表面被液体驱除层14覆盖，液体排斥绝缘油墨的分散介质，两个或更多个点20D由在该防液层14的表面上形成有这些斜面15,16的区域内形成树脂油墨的液滴。此外，每个斜面15,16由固体层21D形成，连接点排的方面的液滴由这些点20D构成。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2008235926A Mounting board and electronic equipment 审中-公开
标题翻译：安装板和电子设备
公开(公告)号：JP2008235926A
公开(公告)日：2008-10-02
申请号：JP2008114977
申请日：2008-04-25
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO WATARU
IPC分类号： H05K1/18 , H01L21/60 , H05K3/28
CPC分类号： H01L24/76 , H01L24/82 , H01L2224/16225 , H01L2224/24 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73204 , H01L2224/73267 , H01L2224/76155 , H01L2224/82007 , H01L2224/82101 , H01L2224/82102 , H01L2224/83192 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01093 , H01L2924/14 , H01L2924/00 , H05K3/4664 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a mounting board, on which electronic equipment and electronic devices to be mounted onto electronic components are mounted, which can be thinned, having flexibility, and being resistant to bending. SOLUTION: A circuit board 10FD is a mounting board on which a semiconductor chip 2, whose one face side is made to be a terminal forming face 2a provided with a pad 7, is mounted on a flexible substrate 1. The pad 7 is electrically connected with a metal wiring 4 formed on the flexible substrate 1. The terminal forming face 2a of the semiconductor chip 2 is arranged in such a way to almost correspond to a neutral plane np in the thickness direction of the concerned mounting board 10FD. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种安装板，其上安装有电子装置的电子装置和电子装置可以被薄化，具有柔性并且抗弯曲。解决方案：电路板10FD是安装在其上的半导体芯片2，其一侧面被设置为具有焊盘7的端子形成面2a，安装在柔性基板1上。焊盘7 与形成在柔性基板1上的金属布线4电连接。半导体芯片2的端子形成面2a以与相关的安装基板10FD的厚度方向几乎对应于中性平面np的方式配置。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2008118075A Electronic component mounting method, electronic substrate, and electronic apparatus 有权
标题翻译：电子元件安装方法，电子基板和电子设备
公开(公告)号：JP2008118075A
公开(公告)日：2008-05-22
申请号：JP2006302483
申请日：2006-11-08
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： NIIDATE TAKESHI , YAJIMA MASARU
IPC分类号： H01L21/60 , H05K1/18 , H05K3/10 , H05K3/32
CPC分类号： H01L24/82 , H01L2224/05554 , H01L2224/24 , H01L2224/24226 , H01L2224/24997 , H01L2224/24998 , H01L2224/25 , H01L2224/25175 , H01L2224/32225 , H01L2224/73267 , H01L2224/82007 , H01L2224/82051 , H01L2224/82102 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting method that can efficiently form a mounting structure excellent in reliability. SOLUTION: This mounting method comprises: a process to mount an IC chip 10 on a circuit substrate 20 (a); a process to arrange an insulating material using a drop discharge method on the circuit substrate 20 that lies between a connecting lug 14 and a terminal 22 on the side of the substrate, and form an insulating layer 30a by hardening at least part of the insulating material (b); a process to arrange the insulating material on the plane region narrower than the insulating layer 30a located on the insulating layer 30a and form an insulating layer 30b by hardening at least part of the insulating material (c); a process to form a slope material 30 which is a laminated layer film composed of insulating layers 30a to 30d by repeating the formation of the insulating layer by applying the insulating material (d); and a process to form connecting wiring 34 using the drop discharge method on the slope surface of the slope material 30 (e). COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以有效地形成可靠性优异的安装结构的电子部件安装方法。解决方案：该安装方法包括：将IC芯片10安装在电路基板20（a）上的工艺; 在基板20的位于连接凸片14和端子22之间的电路基板20上使用液滴喷射法排列绝缘材料的工序，通过硬化绝缘材料的至少一部分而形成绝缘层30a （b）; 将绝缘材料布置在比位于绝缘层30a上的绝缘层30a更窄的平面区域上并通过硬化绝缘材料（c）的至少一部分而形成绝缘层30b的工艺。通过施加绝缘材料（d）重复形成绝缘层，形成由绝缘层30a至30d构成的叠层膜的斜面材料30的工艺; 以及在倾斜材料30（e）的斜面上使用液滴喷射法形成连接配线34的工序。版权所有（C）2008，JPO＆INPIT

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