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1. 发明专利

JP2017087607A インクジェット記録方法、インクジェット記録装置および記録媒体の製造方法审中-公开
公开(公告)号：JP2017087607A
公开(公告)日：2017-05-25
申请号：JP2015221953
申请日：2015-11-12
申请人：セイコーエプソン株式会社 , Seiko Epson Corp
发明人： ITO WATARU
IPC分类号： B41M5/00 , B41M5/50 , B41M5/52 , C09D11/30
CPC分类号： B41M5/0064 , B41J2/01 , B41J2202/03 , B41M5/0023 , B41M5/0047 , C09D11/106 , C09D11/107 , C09D11/36 , C09D127/06 , C09D133/10
摘要：【課題】高濃度印刷が可能であり、得られた記録物が高寸法安定性を有し、なおかつ得られた画像が堅牢性を備えるインクジェット記録方法を提供する。【解決手段】インクジェットヘッドから溶剤系インクを吐出し、塩化ビニル系樹脂からなる記録媒体に記録するインクジェット記録方法であって、前記記録媒体は可塑剤を含まず、かつ(1):FT−IRピーク波数が2924cm−1未満、および(2):60℃で3時間放置前後の収縮率が1.8%未満、を満たすことを特徴とする。【選択図】図2

2. 发明专利

JP2012040794A Inkjet recording medium 审中-公开
标题翻译：喷墨记录介质
公开(公告)号：JP2012040794A
公开(公告)日：2012-03-01
申请号：JP2010184756
申请日：2010-08-20
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO WATARU
IPC分类号： B41M5/00 , B41M5/50 , B41M5/52
摘要： PROBLEM TO BE SOLVED: To provide an inkjet recording medium that does not generate cracks or does not exfoliation on a metal film and has beautiful gloss even if an external force such as excessive deformation or repeated bending is applied to the medium.SOLUTION: The recording medium is composed of at least a base material, the metal film and an ink absorbing layer where the metal film is disposed between an intermediate surface of the inkjet recording medium.
摘要翻译：要解决的问题：为了提供一种喷墨记录介质，即使在诸如过度变形或反复弯曲等外力对介质施加时，也不会在金属膜上产生裂纹或不会剥落，并具有美丽的光泽。解决方案：记录介质至少由基材，金属膜和墨水吸收层组成，金属膜设置在喷墨记录介质的中间表面之间。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011150112A Electrophoretic display device 审中-公开
标题翻译：电子显示装置
公开(公告)号：JP2011150112A
公开(公告)日：2011-08-04
申请号：JP2010010727
申请日：2010-01-21
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： YUZAWA HIKARU , ITO WATARU
IPC分类号： G02F1/167
摘要： PROBLEM TO BE SOLVED: To reduce working time and widen a range of a usable moisture preventing resin, concerning a sealing structure of an electrophoretic display device.
SOLUTION: The electrophoretic display device 1 includes: a TFT substrate 10 having moisture preventing properties; a counter substrate 20 disposed opposite to the TFT substrate 10; an electrophoretic layer 23 provided between the TFT substrate 10 and the counter substrate 20; a moisture preventing substrate 50 provided so as to be opposed to a surface different from a surface opposed to the TFT substrate 10 of the counter substrate 20; a moisture preventing resin 500 disposed between the TFT substrate 10 and the moisture preventing substrate 50 and sealing the electrophoretic layer 23 together with the TFT substrate 10 and the moisture preventing substrate 50; and a spacer 300 provided on a surface opposed to the counter substrate 20 of the TFT substrate 10 and provided so as to be opposed to the electrophoretic layer 23 via the moisture preventing resin 500.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：关于电泳显示装置的密封结构，为了减少工作时间和扩大可用的防水树脂的范围。电泳显示装置1包括：具有防潮性的TFT基板10; 与TFT基板10相对设置的对置基板20; 设置在TFT基板10和对置基板20之间的电泳层23; 防水基板50，被设置为与与相对基板20的TFT基板10相对的表面不同的表面相对; 设置在TFT基板10和防潮基板50之间并与TFT基板10和防潮基板50一起密封电泳层23的防潮树脂500; 以及设置在与TFT基板10的对置基板20相对的表面上并且经由防潮树脂500与电泳层23相对设置的间隔件300.版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2009229691A Method for manufacturing element substrate for flat display device, and method for manufacturing flat display device 审中-公开
标题翻译：用于制造用于平板显示装置的元件基板的方法，以及用于制造平板显示装置的方法
公开(公告)号：JP2009229691A
公开(公告)日：2009-10-08
申请号：JP2008073585
申请日：2008-03-21
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO WATARU , ABE MUTSUMI
IPC分类号： G09F9/00 , G02F1/1333 , G02F1/1368 , G02F1/167
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an element substrate for a flat display device superior in mechanical strength.
SOLUTION: The method of manufacturing the element substrate 2 for the flat display device includes: a dicing step of dicing, from one surface 20a side, an unprocessed element substrate having display circuits 21 and 22 at the one surface 20a to make a side-end surface of the unprocessed element into an inclined surface; a sealant-filling step of forming a concave portion between a part of a protective sheet 57 protruded from the one surface 20a and the inclined surface by pasting the protective sheet 57 to the one surface 20a and of filling the concave portion with a sealant; and a polishing step of chemically polishing the other side 20'b of the unprocessed element substrate to form the element substrate 2. The problem to be solved can be solved by using the method.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种制造机械强度优异的平板显示装置的元件基板的方法。解决方案：制造用于平板显示装置的元件基板2的方法包括：切割步骤，从一个表面20a侧将具有显示电路21和22的未处理元件基板在一个表面20a处切割成未加工元件的侧端面成倾斜面; 密封剂填充步骤，通过将保护片57粘贴到一个表面20a并用密封剂填充凹部，在从一个表面20a突出的保护片57的一部分和倾斜表面之间形成凹部; 以及对未加工的元件基板的另一面20'b进行化学研磨以形成元件基板2的抛光步骤。通过使用该方法可以解决待解决的问题。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2008233774A Electrophoretic display device and electronic equipment 审中-公开
标题翻译：电子显示装置和电子设备
公开(公告)号：JP2008233774A
公开(公告)日：2008-10-02
申请号：JP2007076832
申请日：2007-03-23
申请人： Hitachi Chem Co Ltd , Seiko Epson Corp , セイコーエプソン株式会社 , 日立化成工業株式会社
发明人： ITO WATARU , YOSHIDA JUNPEI , YAMADA MASAHIRO , UEHARA TOSHISHIGE , TAKAHASHI TORU , ISHIDA YUKIHISA
IPC分类号： G02F1/167
摘要： PROBLEM TO BE SOLVED: To provide an electrophoretic display device and electronic equipment which have various characteristics according to uses such as thinness, lightness and shock resistance.
SOLUTION: The electrophoretic display device 1 is constituted by layering a substrate 2, an electrophoretic layer 3, an elastomer layer 4 and an acrylic layer 5 in order, wherein an optical resin composition is used as a material of the elastomer layer 4, so that sufficient printing durability, weatherability, and shock resistance can be secured. When this material is used and a thickness of the elastomer layer 4 is set to the range of 120 to 250 μm and that of the acrylic layer 5 is set to the range of 250 to 500 μm, sufficient thinness and lightness are provided. Thus, the electrophoretic display device 1 provided with various characteristics according to uses such as thinness, lightness and shock resistance can be obtained.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供根据诸如薄度，亮度和抗冲击性的用途具有各种特性的电泳显示装置和电子设备。解决方案：电泳显示装置1依次层叠基板2，电泳层3，弹性体层4和丙烯酸层5，其中使用光学树脂组合物作为弹性体层4的材料，从而可以确保足够的印刷耐久性，耐候性和耐冲击性。当使用这种材料并且将弹性体层4的厚度设定在120至250μm的范围内并且将丙烯酸层5的厚度设置在250至500μm的范围时，提供足够的薄度和亮度。因此，可以获得根据诸如薄度，亮度和抗冲击性的用途提供各种特性的电泳显示装置1。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2008216622A Manufacturing method of display device 审中-公开
标题翻译：显示装置的制造方法
公开(公告)号：JP2008216622A
公开(公告)日：2008-09-18
申请号：JP2007053786
申请日：2007-03-05
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO WATARU
IPC分类号： G02F1/167
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a display device which is easily installed on a curved surface having a constant radius of curvature.
SOLUTION: Thicknesses, elastic moduli, and coefficients of thermal expansion of a glass substrate 17 and a back substrate 15 and a heating temperature at which the glass substrate 17 and back substrate 15 are heated to be joined together are set according to a desired radius of curvature on the basis of the relation among the respective thicknesses, elastic moduli, and coefficients of thermal expansion of the glass substrate 17 and back substrate 15, and the heating temperature.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种易于安装在曲率半径不变的曲面上的显示装置的制造方法。解决方案：玻璃基板17和背面基板15的厚度，弹性模量和热膨胀系数以及玻璃基板17和背面基板15被加热接合在一起的加热温度根据基于玻璃基板17和背面基板15的各自的厚度，弹性模量和热膨胀系数之间的关系以及加热温度来实现期望的曲率半径。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2008209483A Fabrication method of electrooptical device and manufacturing method of glass substrate 审中-公开
标题翻译：电子装置的制造方法和玻璃基板的制造方法
公开(公告)号：JP2008209483A
公开(公告)日：2008-09-11
申请号：JP2007043904
申请日：2007-02-23
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO WATARU
IPC分类号： G02F1/1333 , G02F1/13 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a glass substrate which has an improved impact resistance upon dropping by separating a corner part of a glass substrate without giving impact to the corner part of the glass substrate, and to provide a fabrication method of an electrooptical device provided with the glass substrate.
SOLUTION: The fabrication method of the electrooptical device provided with the glass substrate 1, a counter substrate opposite to the glass substrate 1 and an electrooptical material held by the glass substrate 1 and the counter substrate comprises: a process of forming a groove linearly extended in a direction intersecting two ridge lines of the glass substrate 1 extended from a corner on the vicinity of a corner part 2 including the corner of a first main surface of the glass substrate 1; a process of sticking a support to the first main surface of the glass substrate 1; and a process of etching a second main surface of the glass substrate 1 to thin the glass substrate 1 and, thereby, causing the groove to pass through the glass substrate 1 to separate the corner part 2 of the glass substrate 1 on a position where the groove is formed.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种玻璃基板的制造方法，其通过分离玻璃基板的角部而不会对玻璃基板的角部产生冲击而具有提高的耐冲击性的玻璃基板的制造方法，配有玻璃基板的电光装置的制造方法。解决方案：设置有玻璃基板1的电光装置的制造方法，与玻璃基板1相对的对置基板和由玻璃基板1和对置基板保持的电光材料包括：形成槽在与包括玻璃基板1的第一主面的角部的角部2附近的角部延伸的玻璃基板1的两条棱线交叉的方向上线性地延伸; 将支撑体粘附到玻璃基板1的第一主表面的工序; 以及蚀刻玻璃基板1的第二主面以使玻璃基板1变薄的工序，从而使槽通过玻璃基板1，将玻璃基板1的角部2分离到玻璃基板1的位置，形成槽。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007248720A Method for manufacturing substrate for display device 审中-公开
标题翻译：用于制造用于显示装置的基板的方法
公开(公告)号：JP2007248720A
公开(公告)日：2007-09-27
申请号：JP2006070905
申请日：2006-03-15
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO WATARU
IPC分类号： G02F1/1333 , C03C15/00 , G02F1/13 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate for a display device, which has no defect on its side face and on its bottom face, and which is highly reliable and has a thin film shape, at a low cost. SOLUTION: In forming respective substrates for display devices by separating a mother substrate which has a plurality of display elements partitioned and formed on its surface into respective sections, groove portions are formed on positions of the mother substrate surface for separation, and subsequently the rear face of the mother substrate is wet-etched until reaching the groove portions so as to turn the substrate for the display device into the thin film shape and to separate them from one another. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种制造用于显示装置的基板的方法，其在其侧面和底面上没有缺陷，并且是高度可靠的并且具有薄膜形状，低成本。解决方案：在通过将具有在其表面上分隔并形成的多个显示元件的母基板分离成相应部分来形成用于显示装置的各个基板时，在母基板表面用于分离的位置上形成槽部分，随后母体基板的背面被湿式蚀刻直至到达凹槽部分，以将显示装置的基板转变成薄膜形状并将它们彼此分开。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006165506A Mounting board and electronic equipment 有权
标题翻译：安装板和电子设备
公开(公告)号：JP2006165506A
公开(公告)日：2006-06-22
申请号：JP2005204230
申请日：2005-07-13
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO WATARU
IPC分类号： H05K1/18 , H05K3/28 , H05K3/32
CPC分类号： H05K1/189 , H01L21/563 , H01L23/4985 , H01L23/49883 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/76 , H01L24/82 , H01L24/83 , H01L2224/05001 , H01L2224/05124 , H01L2224/05155 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/0558 , H01L2224/05644 , H01L2224/16225 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73267 , H01L2224/76155 , H01L2224/82007 , H01L2224/82102 , H01L2224/83192 , H01L2224/838 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01093 , H01L2924/0665 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H05K1/0393 , H05K1/095 , H05K3/1241 , H05K3/28 , H05K3/284 , H05K3/32 , H05K2201/10674 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provided a mounting board for mounting an electronic device to be installed in electronic equipment or an electronic component, the mounting board having a small thickness and flexibility enabling high resistance against bending.
SOLUTION: A circuit board 10FD is a mounting board where a semiconductor chip 2 is mounted on a flexible substrate 1. One surface of the semiconductor chip 2 acts as a terminal forming surface 2a having a pad 7 thereon. The pad 7 is electrically connected to a metal wire 4 formed on the flexible substrate 1, and the terminal forming surface 2a of the semiconductor chip 2 is almost aligned with a neutral surface np in the thickness direction of the mounting board 10FD.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种用于安装安装在电子设备或电子部件中的电子设备的安装板，该安装板具有小的厚度和柔性，能够实现高抗弯曲性。电路板10FD是将半导体芯片2安装在柔性基板1上的安装基板。半导体芯片2的一个表面作为其上具有焊盘7的端子形成表面2a。焊盘7电连接到形成在柔性基板1上的金属丝4，并且半导体芯片2的端子形成表面2a在安装板10FD的厚度方向上几乎与中性表面np对准。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006114645A Mounting method and mounting structure of semiconductor device 审中-公开
标题翻译：半导体器件的安装方法和安装结构
公开(公告)号：JP2006114645A
公开(公告)日：2006-04-27
申请号：JP2004299636
申请日：2004-10-14
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ITO WATARU , KUROSAWA HIROFUMI , YAMADA MASAHIRO
IPC分类号： H01L21/60
CPC分类号： H01L2224/16 , H01L2224/83192 , H01L2924/01046 , H01L2924/01079
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor device which will become an electronic apparatus or an electronic component, that can be made thin or thick, and has a high resistance to bending due to its flexibility; and to provide a mounting method of a semiconductor device for realizing the mounting structure.
SOLUTION: This is a mounting method of a semiconductor device wherein a semiconductor chip 2 is mounted face down on a flexible substrate 1. This mounting method of a semiconductor device comprises processes of forming a buffer layer 3 made of an insulating resin on the flexible substrate 1; forming an interconnection 4 on the buffer layer 3; arranging a liquid material made by dispersing metal fine particles into a dispersion solution, by a drop discharge method either at a connection 4a of the interconnection 4 or at a terminal 7 of the semiconductor chip 2; joining the connection 4a of the interconnection 4 and the terminal 7 of the semiconductor chip 2 via the liquid material; and sintering the metal fine particles by baking the liquid material to connect the connection 4a of the interconnection 4 and the terminal 7 of the semiconductor chip 2, as well as to establish an electric conductivity path between them.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供将成为可以制成薄或厚的电子设备或电子部件的半导体器件的安装结构，并且由于其柔性而具有高抗弯曲性; 并提供用于实现安装结构的半导体器件的安装方法。解决方案：这是半导体器件的安装方法，其中半导体芯片2正面朝下地安装在柔性基板1上。半导体器件的安装方法包括在绝缘树脂上形成缓冲层3的工艺柔性基板1; 在缓冲层3上形成互连4; 通过在互连4的连接4a处或在半导体芯片2的端子7处的液滴放电方法将通过将金属微粒分散在分散溶液中而制成的液体材料布置; 通过液体材料连接互连4的连接4a和半导体芯片2的端子7; 并通过烘焙液体材料烧结金属微粒，以连接互连4的连接4a和半导体芯片2的端子7，并且在它们之间建立导电路径。版权所有（C）2006，JPO＆NCIPI

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