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    • 6. 发明专利
    • Bonding material and its production process
    • 粘接材料及其生产工艺
    • JP2006245576A
    • 2006-09-14
    • JP2006051278
    • 2006-02-27
    • Mitac Technology Corp神基科技股▲ふん▼有限公司
    • HWANG MING-HANGCHENG YU-CHIANGCHEN CHAO-YIKUO HSIN-LUNGLEE BIN-WEIHSIAO WEI-CHUNG
    • H01L23/373H01L23/36H05K7/20
    • H01L21/4882B23K35/22B23K35/327C09J1/00H01L23/3732H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a bonding material being employed in a member of a cooler for a semiconductor device and exhibiting excellent thermal conductivity, and to provide its production process.
      SOLUTION: The bonding material for bonding a cooling piece being bonded to a semiconductor device and receiving heat generated therefrom, and a cooling means such as fins at a mutual bonding part such as a conduit for conducting heat and enhancing thermal conductivity, comprises a metal of good thermal conductivity such as aluminium or copper and fine carbon powder of diamond-like structure. The metal is melted and dispersed and mixed uniformly with fine carbon powder of diamond-like structure, and a rodlike bonding material is produced from the molten by flocculation pulling method. Since diamond exhibits excellent thermal conductivity and wideband optical transparency, cooling performance of the cooler by heat conduction is enhanced.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种用于半导体器件的冷却器的构件中并且显示出优异的导热性的接合材料,并提供其制造工艺。 解决方案:用于接合粘合到半导体器件并接收由其产生的热的冷却片的接合材料以及诸如用于传导热量并增强导热性的导管等相互接合部分的翅片的冷却装置包括 具有良好导热性的金属如铝或铜以及类金刚石结构的细碳粉末。 金属与金刚石结构的细碳粉末熔融分散和均匀混合,并通过絮凝拉制法从熔融生产棒状粘合材料。 由于金刚石具有优异的导热性和宽带光学透明性,所以通过热传导提高了冷却器的冷却性能。 版权所有(C)2006,JPO&NCIPI