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    • 8. 发明专利
    • Film forming method and film forming device
    • 薄膜成型方法和薄膜成型装置
    • JP2014076426A
    • 2014-05-01
    • JP2012225535
    • 2012-10-10
    • Nhk Spring Co Ltd日本発條株式会社
    • HIRANO TOMOSUKE
    • B05D1/12B05B7/14
    • B05B1/02B05B7/1422B05B7/1481B05D1/12B05D3/0466B05D3/0486C23C24/04
    • PROBLEM TO BE SOLVED: To provide a film forming method and a film forming device which can suppress oxidation of a film during film formation, can structure a device simply and inexpensively, and can replace a base material as a film formation object without taking effort and time.SOLUTION: A film forming device 100 forms a film by accelerating powder 2 as raw material together with gas, and spraying and depositing the powder 2 maintained in a solid state on a surface of a base material 1. The film forming device includes a chamber 10, a holding part 11 which is arranged in the chamber 10 and holds the base material 1, a spray nozzle 12 which jets the powder 2 together with inert gas, and a drive part 15 which moves one of the spray nozzle 12 and the holding part 11 with respect to the other. The inert gas jetted by the spray nozzle 12 provides a positive pressure in the chamber 10.
    • 要解决的问题:为了提供能够抑制膜形成期间的膜的氧化的成膜方法和成膜装置,可以简单且廉价地构造装置,并且可以在不牺牲成本的情况下代替基材作为成膜物质, 时间。解决方案:成膜装置100通过以气体作为原料加速粉末2和将保持在固体状态的粉末2喷射沉积在基材1的表面上而形成膜。成膜装置包括: 室10,设置在室10中并保持基材1的保持部11,将粉末2与惰性气体一起喷射的喷嘴12以及将喷嘴12和 保持部件11相对于另一个。 由喷嘴12喷射的惰性气体在室10中提供正压。