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1. 发明专利

JP2011045821A Adhesive application apparatus and method 审中-公开
标题翻译：胶粘剂应用装置及方法
公开(公告)号：JP2011045821A
公开(公告)日：2011-03-10
申请号：JP2009195496
申请日：2009-08-26
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FUNANO SHO
IPC分类号： B05C5/00 , B05B7/04 , B05C11/10 , B05D7/24 , C09J5/08
摘要： PROBLEM TO BE SOLVED: To provide an adhesive application apparatus and method capable of reducing the consumption of an adhesive and shortening setting time of the adhesive to bond in a short time. SOLUTION: The adhesive application apparatus 10 which applies the adhesive to an adhesion face is provided with: a pressurizing cylinder 13 that extrudes the adhesive 30 from a cartridge 11, to which the adhesive 30 is filled, to the outside through an application nozzle 14; a pump 15 with a heater that supplies heated gas to the application nozzle 14; and a controller 17 that controls the operation of the pump 15 with the heater so that the heated gas G is supplied to the application nozzle 14 interlocking with the operation of the pressurizing cylinder 13. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在短时间内降低粘合剂的消耗并缩短粘合剂凝固时间的粘合剂施加装置和方法。解决方案：将粘合剂施加到粘合面上的粘合剂施加装置10设置有：加压缸13，其通过应用从粘合剂30填充到的盒11挤出粘合剂30 喷嘴14; 具有加热器的泵15，其将加热的气体供应到施加喷嘴14; 以及控制器17，其通过加热器控制泵15的操作，使得加热气体G被提供给与加压缸13的操作互锁的施加喷嘴14。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2009071051A Bonding wire inspecting device and bonding wire inspecting method 有权
标题翻译：接线检查装置和接线检查方法
公开(公告)号：JP2009071051A
公开(公告)日：2009-04-02
申请号：JP2007238160
申请日：2007-09-13
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FUNANO SHO
IPC分类号： H01L21/60
CPC分类号： H01L2224/48472 , H01L2224/78 , H01L2224/859 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a bonding wire inspecting device and bonding wire inspecting method, in which both higher speed and stability in inspection are achieved. SOLUTION: In a bonding wire inspecting device 100, when acquiring the height of a bonding wire 12, a slit light source 4 positioned obliquely above an inspection work 1 emits linear slit beam L to the inspection work 1, which state is imaged with a CCD camera 7. Here, the bonding wire inspecting device 100 images the inspection work 1 while an XY stage 2 is shifted in the line direction (Y direction). The inspection work 1 is continuously imaged for a specified time period by extending exposure time at imaging to intentionally cause blur in the imaging data. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够实现高速度和稳定性的接合线检查装置和接合线检查方法。解决方案：在接合线检测装置100中，当获取接合线12的高度时，位于检查工件1上方的狭缝光源4向检查工件1发射线性狭缝光束L，该状态被成像这里，接合线检查装置100在XY台架2沿线方向（Y方向）移动的同时对检查工件1成像。检查工作1通过在成像时延长曝光时间而有意地引起成像数据的模糊，连续成像一段指定的时间段。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008155240A Method for discriminating quality of ultrasonic joining 有权
标题翻译：分辨超声波接合质量的方法
公开(公告)号：JP2008155240A
公开(公告)日：2008-07-10
申请号：JP2006345915
申请日：2006-12-22
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FUNANO SHO , INAGAKI NOBUAKI
IPC分类号： B23K20/10 , G01M99/00
摘要： PROBLEM TO BE SOLVED: To provide a method for discriminating the quality of the ultrasonic joining capable of correctly discriminating the joining quality of a workpiece based on a locus of the displacement of a joining horn.
SOLUTION: In the method for discriminating the quality of the ultrasonic joining, workpieces 5, 6 are subjected to the ultrasonic joining by giving the ultrasonic vibration while pressing superposed workpieces 5, 6 by a joining horn 2. Whether the joining quality is good or bad is correctly discriminated by whether or not the locus of the displacement L of the joining horn 2 passes through a predetermined control range A.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于区分能够根据接合喇叭的位移的轨迹正确地区分工件的接合质量的超声波接合质量的方法。解决方案：在用于区分超声波接合质量的方法中，通过在通过接合喇叭2挤压叠加的工件5,6时提供超声波振动来对工件5,6进行超声波接合。接合质量是否为通过接合喇叭2的位移L的轨迹是否经过预定的控制范围A来正确地区分好或坏。（C）2008，JPO和INPIT

4. 发明专利

JP2010062324A Inspection device and method 有权
标题翻译：检查装置和方法
公开(公告)号：JP2010062324A
公开(公告)日：2010-03-18
申请号：JP2008226329
申请日：2008-09-03
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FUNANO SHO
IPC分类号： H01L21/60
CPC分类号： H01L2224/48 , H01L2224/48091 , H01L2224/48139 , H01L2224/4846 , H01L2224/48472 , H01L2224/49 , H01L2224/49175 , H01L2224/78 , H01L2224/85 , H01L2224/85205 , H01L2224/859 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/10161 , H01L2924/00014 , H01L2924/00 , H01L2224/49111 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an inspection device and an inspection method which can achieve a sufficient measurement precision and the shortening of an inspection time compatibly, and can inspect the height of a bonding ribbon in addition to a bonding wire. SOLUTION: The device 1 for inspection which measures the two-dimensional shape and height of a measurement workpiece 2 to inspect the measurement workpiece 2 includes a CCD camera 23 for two-dimensional shape measurement, coaxial lighting 21 installed coaxially with the CCD camera 23, a laser displacement gauge 31 for height measurement, and an XY stage 11 and a Z stage 12 for moving the CCD camera 23, laser displacement gauge 31, and measurement workpiece 2 relatively in a plane direction and a vertical direction. A predetermined threshold Th is set for measurement data obtained by the laser displacement gauge 31, and measurement data which is larger than the threshold Th and on a high side in a height direction (Z direction) is employed as the height (h) of the measurement workpiece. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够实现足够的测量精度和缩短检查时间的检查装置和检查方法，并且除了接合线之外还可以检查粘合带的高度。
解决方案：测量测量工件2检查测量工件2的二维形状和高度的用于检查的装置1包括用于二维形状测量的CCD照相机23，与CCD同轴安装的同轴照明21 相机23，用于高度测量的激光位移计31，以及用于相对于平面方向和垂直方向移动CCD相机23，激光位移计31和测量工件2的XY台11和Z台12。对于由激光位移计31获得的测量数据，设定规定的阈值Th，将高于阈值Th的测量数据和高度方向（Z方向）的高侧用作高度（h）测量工件版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2019021811A 半導体装置の製造方法审中-公开
公开(公告)号：JP2019021811A
公开(公告)日：2019-02-07
申请号：JP2017140186
申请日：2017-07-19
申请人： TOYOTA MOTOR CORP
发明人： KADOGUCHI TAKUYA , HANAKI YUJI , YAMANAKA ATSUKO , FUNANO SHO , TAKAHAGI SATOSHI , IWASAKI SHINGO
IPC分类号： H01L21/56 , H01L23/50
摘要：【課題】樹脂パッケージの両面に金属板が露出している半導体装置の製造方法に関し、パッケージ内に気泡が残り難い製造方法を提供する。【解決手段】本明細書が開示する製造方法は、準備工程、セット工程、成形工程、除去工程を備えている。準備工程では、半導体素子と金属板のアセンブリ10を準備する。セット工程では樹脂パッケージを成形するための金型50のキャビティ60に、アセンブリ10をセットする。一方の金属板12、22をキャビティの底面61に接触させ他方の金属板15、25の上方に空間を設けてアセンブリ10をセットする。成形工程では、金属板15、25を覆うようにキャビティに溶融樹脂を注入し、キャビティ60の上部に空間の一部65a、66aを残して溶融樹脂の注入を止め、樹脂を硬化させる。除去工程では、金属板15、25を覆っている樹脂部分91、92を除去する。【選択図】図7

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