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1. 发明专利

JP2015057804A 回路モジュール有权
标题翻译：电路模块
公开(公告)号：JP2015057804A
公开(公告)日：2015-03-26
申请号：JP2013169428
申请日：2013-08-19
申请人：太陽誘電株式会社 , Taiyo Yuden Co Ltd
发明人： SHIMAMURA MASAYA , KITAZAKI KENZO , MUGITANI HIDEJI , SARUWATARI TATSURO , SAJI TETSUO , NAKAMURA HIROSHI
IPC分类号： H05K3/28 , H01L23/28 , H05K9/00
CPC分类号： H05K1/0216 , H01L21/561 , H01L23/3135 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/0218 , H05K3/107 , H05K3/284 , H05K2201/0715 , H05K2201/09036 , H05K2201/09827 , H05K2201/09972 , H01L2924/00
摘要：【課題】シールド効果に優れると共に、小型化に適した回路モジュールを提供すること。【解決手段】本発明に係る回路モジュールは、回路基板と、実装部品と、封止体と、シールドとを具備する。回路基板は、実装面を有する。実装部品は、実装面に実装されている。封止体は、実装面上に形成され、実装部品を被覆する封止体であって、封止体の主面から実装面に向かって形成されたトレンチを有し、トレンチは実装面側の第1の側壁部と主面側の第2の側壁部から構成された側壁を有し、第1の側壁部は第1の傾きを有し、第1の側壁部と第2の側壁部の接続点を第1の点とし、第2の側壁部と主面の接続点を第2の点としたときに、第1の点と第2の点を結ぶ直線は、第1の傾きより小さい第2の傾きを有する。シールドは、封止体を被覆するシールドであって、トレンチ内に形成された内部シールド部と、主面及び内部シールド部上に配設された外部シールド部とを有する。【選択図】図6
摘要翻译：要解决的问题：提供一种具有优异的屏蔽效果并适合于小型化的电路模块。解决方案：根据本实施例的电路模块包括电路板，安装部件，封装体和屏蔽件。电路板具有安装面。安装部件安装在安装表面上。封装体形成在安装面上; 并覆盖安装部件; 具有从封装体的主表面朝向安装表面形成的沟槽。沟槽具有由安装面侧的第一侧壁部和主面侧的第二侧壁部构成的侧壁。侧壁部分具有第一倾斜度，并且当假定第一侧壁部分和第二侧壁部分的连接点是第一点并且第二侧壁部分和主表面的连接点是第二点时，连接第一点和第二点的直线具有小于第一倾斜度的第二倾斜度。屏蔽罩覆盖封装体，并具有形成在沟槽中的内屏蔽部分和布置在主表面和内屏蔽部分上的外屏蔽。

2. 发明专利

JP2015057803A 回路モジュールの製造方法有权
标题翻译：电路模块制造方法
公开(公告)号：JP2015057803A
公开(公告)日：2015-03-26
申请号：JP2013169426
申请日：2013-08-19
申请人：太陽誘電株式会社 , Taiyo Yuden Co Ltd
发明人： MUGITANI HIDEJI , KITAZAKI KENZO , SHIMAMURA MASAYA , SAJI TETSUO , NAKAMURA HIROSHI
IPC分类号： H05K9/00 , H05K3/28 , H05K3/46
CPC分类号： H05K1/0218 , H01L2224/16225 , H01L2924/16152 , H01L2924/16153 , H01L2924/181 , H01L2924/19105 , H05K1/0215 , H05K1/0216 , H05K3/284 , H05K3/303 , H05K9/0024 , H05K9/0045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09145 , H05K2201/0919 , H05K2201/09972 , H05K2201/1056 , H05K2203/108 , Y10T29/4913 , H01L2924/00012
摘要：【課題】レーザー照射による回路基板の層内配線へのダメージが防止され、かつシールドと回路基板の表層導体の電気的接続が確保されている回路モジュール及びその製造方法を提供すること。【解決手段】本発明に係る回路モジュールは、回路基板と、実装部品と、封止体と、シールドとを具備する。回路基板は、層内配線が形成された多層基板であって、実装面を有し、実装面に表層導体が配設されている。実装部品は、実装面に実装されている。封止体は、実装面上に形成され、実装部品を被覆する封止体であって、封止体の主面から実装面に向けて形成された、表層導体に到達する第1のトレンチ部分と、表層導体に到達しない第2のトレンチ部分とを有するトレンチを備える。シールドは、封止体を被覆する外部シールド部と、トレンチの内部に形成された内部シールド部とを有する。【選択図】図13
摘要翻译：要解决的问题：提供一种电路模块，其防止由于激光照射而导致电路板的内层布线的损坏，并且确保电路板的屏蔽和表面层导体之间的电连接; 并提供电路模块的制造方法。解决方案：根据本实施例的电路模块包括电路板，安装部件，封装体和屏蔽件。电路板是形成内层布线的多层基板; 并且具有安装表面，并且表面层导体布置在安装表面上。安装部件安装在安装表面上。封装体形成在安装面上; 并覆盖安装部件; 并且包括具有到达表面层导体的第一沟槽部分和不到达表面层导体的第二沟槽部分的沟槽。该屏蔽件具有覆盖封装体的外部屏蔽部分和形成在沟槽内部的内部屏蔽部分。

3. 发明专利

JP2014116574A Multilayer circuit board and high frequency circuit module 有权
标题翻译：多层电路板和高频电路模块
公开(公告)号：JP2014116574A
公开(公告)日：2014-06-26
申请号：JP2013023448
申请日：2013-02-08
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： SAJI TETSUO , NAKAMURA HIROSHI
IPC分类号： H05K3/46
CPC分类号： H05K1/0253 , H01P3/088 , H05K1/0227 , H05K1/185 , H05K3/4602 , H05K2201/09245 , H05K2201/09336 , H05K2201/09727
摘要： PROBLEM TO BE SOLVED: To provide a multilayer circuit board which can be easily reduced in thickness and increased in density, and is suitable for a high frequency circuit.SOLUTION: A multilayer circuit board includes: a first conductor layer 151 in which first transmission lines 211-213 and a second transmission line 215 are formed; a second conductor layer 152 facing the first conductor layer 151 through an insulator layer 132; and a third conductor layer 153 which faces the second conductor layer 152 through an insulator layer 133 and in which a detour line 230 electrically connected to the second transmission line 215 of the first conductor layer 151 through via conductors 171, 172 so as to make the second transmission line 215 intersect with the first transmission lines 211-213 is formed. In the second conductor layer 152, a ground conductor 320 is formed at least on a position facing the detour line 230. In the first transmission lines 211-213, the line widths at the parts intersecting with the second transmission line 215 are formed to be narrower than the widths of other parts.
摘要翻译：要解决的问题：提供一种可以容易地减小厚度并增加密度并且适合于高频电路的多层电路板。解决方案：多层电路板包括：第一导体层151，其中第一传输线 211-213和第二传输线215; 通过绝缘体层132面对第一导体层151的第二导体层152; 以及第三导体层153，其通过绝缘体层133面向第二导体层152，并且其中迂回线230通过通孔导体171,172与第一导体层151的第二传输线215电连接，以使得形成与第一传输线211-213相交的第二传输线215。在第二导体层152中，至少在面向迂回线230的位置上形成接地导体320.在第一传输线211-213中，与第二传输线215交叉的部分的线宽形成为比其他部分的宽度窄。

4. 发明专利

JP2014112645A High-frequency circuit module 审中-公开
标题翻译：高频电路模块
公开(公告)号：JP2014112645A
公开(公告)日：2014-06-19
申请号：JP2013168547
申请日：2013-08-14
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： SAJI TETSUO , NAKAMURA HIROSHI
IPC分类号： H01L23/12 , H05K3/46
CPC分类号： H05K1/0243 , H01L24/19 , H01L24/24 , H01L2223/6677 , H01L2224/04105 , H01L2224/16225 , H01L2224/73267 , H01L2924/19105 , H05K1/0233 , H05K1/0253 , H05K1/185
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency circuit module that has good high-frequency characteristics and that can be easily miniaturized.SOLUTION: A high-frequency switch 120 is buried in a multilayer circuit board 200. In the multilayer circuit board 200, circuit patterns 311-318 connected with an input/output terminal via a via conductor are formed to a first conductor layer 241 opposed to a principal surface of the high-frequency switch 120 while interposing an insulator layer, and a missing pattern part 319 where no ground conductor 310 exists in a region other than the circuit patterns and that is a region opposed to the principal surface of the high-frequency switch 120 is formed to the first conductor layer 241, and further, a ground conductor 330 is formed in a region where at least the principal surface of the high-frequency switch 210 is projected in a thickness direction of the multilayer circuit board 200 to a third conductor layer 243 arranged outside the first conductor layer 241 to the high-frequency switch 120.
摘要翻译：要解决的问题：提供具有良好的高频特性并且可以容易地小型化的高频电路模块。解决方案：高频开关120被埋在多层电路板200中。在多层电路板200 通过通孔导体与输入/输出端子连接的电路图案311-318形成在与绝缘体层相对的高频开关120的主表面相对的第一导体层241和缺失图案部分319上，在除了电路图案之外的区域中不存在接地导体310，并且与第一导体层241形成与高频开关120的主面相对的区域，此外，接地导体330形成在高频开关210的至少主表面在多层电路板200的厚度方向上突出到第一导体层243的第三导体层243的区域电感层241连接到高频开关120。

5. 发明专利

JP2012049758A Filter and duplexer 审中-公开
标题翻译：过滤器和双面器
公开(公告)号：JP2012049758A
公开(公告)日：2012-03-08
申请号：JP2010189084
申请日：2010-08-26
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： HARA MOTOAKI , INOUE SHOGO , IWAKI MASAFUMI , TSUTSUMI JUN , NAKAMURA HIROSHI
IPC分类号： H03H9/64 , H03H9/02 , H03H9/145 , H03H9/17 , H03H9/25 , H03H9/54 , H03H9/70 , H03H9/72
CPC分类号： H03H9/542 , H03H9/0571 , H03H9/0576 , H03H9/1085 , H03H9/132 , H03H9/173 , H03H9/174 , H03H9/175 , H03H9/605 , H03H9/6483 , H03H9/706 , H03H9/725
摘要： PROBLEM TO BE SOLVED: To provide a filter and a duplexer which form an attenuation pole in a high frequency and can be miniaturized.SOLUTION: A filter and a duplexer comprise: series resonance devices S1-S4; parallel resonance devices P1-P4 which are formed on a piezoelectric board 10 and are parallely-connected with the series resonance devices S1-S4; an inductor L3 which is series-connected with the parallel resonance device P4; a capacitor C1 which is formed on the piezoelectric board 10 and is parallely-connected with the inductor L3; and a wiring 18 which is formed on the piezoelectric board 10 and connects the parallel resonance device P4 with the capacitor C1.
摘要翻译：要解决的问题：提供一种在高频率形成衰减极并可小型化的滤波器和双工器。滤波器和双工器包括：串联谐振装置S1-S4; 平行谐振装置P1-P4，其形成在压电板10上并与串联谐振装置S1-S4平行连接; 与并联谐振装置P4串联连接的电感器L3; 电容器C1，其形成在压电板10上并与电感器L3平行地连接; 以及形成在压电板10上并将并联谐振装置P4与电容器C1连接的布线18。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2014112641A Electronic component built-in substrate 有权
标题翻译：电子部件内置基板
公开(公告)号：JP2014112641A
公开(公告)日：2014-06-19
申请号：JP2013149356
申请日：2013-07-18
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： SARUWATARI TATSURO , SUGIYAMA YUICHI , NAKAMURA HIROSHI , NAGANUMA MASAKI , SAJI TETSUO
IPC分类号： H05K3/46
CPC分类号： H05K1/185 , H05K1/0213 , H05K1/0271 , H05K1/0298 , H05K2201/09063 , H05K2203/1178
摘要： PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate which eliminates the probability that cracks occur in an insulator layer.SOLUTION: Four first through holes 11d2 and four first through holes 11h2, which overlap with parts of an opening edge VO of a housing part 11a1 projected on a first conductor layer 11d and a third conductor layer 11h in a parallel manner, are respectively formed at the first conductor layer 11d which is the nearest to a core layer 12a where the housing 11a1 is formed so as to penetrate therethrough and the third conductor layer 11h.
摘要翻译：要解决的问题：提供一种电子部件内置基板，其消除了在绝缘体层中产生裂纹的可能性。解决方案：四个第一通孔11d2和四个第一通孔11h2，其与开口边缘VO的部分重叠分别在与形成壳体11a1的芯层12a最接近的第一导体层11d处形成以平行方式突出在第一导体层11d和第三导体层11h上的容纳部11a1，和第三导体层11h。

7. 发明专利

JP2014112629A High-frequency circuit module 有权
公开(公告)号：JP2014112629A
公开(公告)日：2014-06-19
申请号：JP2013023443
申请日：2013-02-08
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： SAJI TETSUO , NAKAMURA HIROSHI
IPC分类号： H01L23/12 , H05K3/46
CPC分类号： H05K1/0243 , H01L24/19 , H01L24/24 , H01L2223/6677 , H01L2224/04105 , H01L2224/16225 , H01L2224/73267 , H01L2924/19105 , H05K1/0233 , H05K1/0253 , H05K1/185
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency circuit module that has good high-frequency characteristics and that can be easily miniaturized.SOLUTION: A high-frequency switch 120 is buried in a multilayer circuit board 200. In the multilayer circuit board 200, circuit patterns 311-318 connected with an input/output terminal via a via conductor are formed to a first conductor layer 241 opposed to a principal surface of the high-frequency switch 120 while interposing an insulator layer, and a missing pattern part 319 where no ground conductor 310 exists in a region other than the circuit patterns and that is a region opposed to the principal surface of the high-frequency switch 120 is formed to the first conductor layer 241, and further, a ground conductor 330 is formed in a region where at least the principal surface of the high-frequency switch 210 is projected in a thickness direction of the multilayer circuit board 200 to a third conductor layer 243 arranged outside the first conductor layer 241 to the high-frequency switch 120.

8. 发明专利

JP2014099842A High-frequency circuit module 有权
标题翻译：高频电路模块
公开(公告)号：JP2014099842A
公开(公告)日：2014-05-29
申请号：JP2013179357
申请日：2013-08-30
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： NAKAMURA HIROSHI , IGARASHI TOMOHIRO
IPC分类号： H04B1/50
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency circuit module having a high packaging density.SOLUTION: A high-frequency circuit module 100 comprises: an RFIC 160 performing processes of transmitting and receiving a high-frequency signal; a power amplifier IC 155 amplifying a transmission signal from the RFIC 160; and duplexers 110 and 120 separating a transmission signal outputted from the power amplifier IC 155 to an antenna and a reception signal inputted to the RFIC 160 from the antenna from each other. Any one or both of the RFIC 160 and the power amplifier IC 155 are buried in a circuit board 200, and the duplexers 110 and 120 are arranged between the RFIC 160 and the power amplifier IC 155.
摘要翻译：要解决的问题：提供具有高封装密度的高频电路模块。解决方案：高频电路模块100包括：RFIC 160执行发送和接收高频信号的处理; 放大来自RFIC 160的发送信号的功率放大器IC 155; 以及将从功率放大器IC 155输出的发送信号与天线分离的双工器110和120以及从天线输入到RFIC 160的接收信号。 RFIC 160和功率放大器IC 155中的任何一个或两个被埋在电路板200中，并且双工器110和120被布置在RFIC 160和功率放大器IC 155之间。

9. 发明专利

JP2014099839A High-frequency circuit module 审中-公开
公开(公告)号：JP2014099839A
公开(公告)日：2014-05-29
申请号：JP2013143567
申请日：2013-07-09
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： NAKAMURA HIROSHI , IGARASHI TOMOHIRO
IPC分类号： H04B1/38 , H01P5/08
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency circuit module having a high packaging density.SOLUTION: A high-frequency circuit module 100 comprises: an RFIC 160 performing processes of transmitting and receiving a high-frequency signal; a power amplifier IC 155 amplifying a transmission signal from the RFIC 160; and duplexers 110 and 120 separating a transmission signal outputted from the power amplifier IC 155 to an antenna and a reception signal inputted to the RFIC 160 from the antenna from each other. Any one or both of the RFIC 160 and the power amplifier IC 155 are buried in a circuit board 200, and the duplexers 110 and 120 are arranged between the RFIC 160 and the power amplifier IC 155.

10. 发明专利

JP2014042094A High-frequency circuit module 有权
标题翻译：高频电路模块
公开(公告)号：JP2014042094A
公开(公告)日：2014-03-06
申请号：JP2012182286
申请日：2012-08-21
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： NAKAMURA HIROSHI , IGARASHI TOMOHIRO
IPC分类号： H04B1/40
CPC分类号： H04L5/1461 , H01L23/3735 , H01L2224/16225 , H03H7/463 , H03H9/0547 , H03H9/08 , H04B1/0057 , H05K1/0207 , H05K1/0216 , H05K1/0237
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency circuit module having a high packaging density.SOLUTION: A high-frequency circuit module 100 comprises, on an upper surface of a circuit board 200: an RFIC 160 for performing transmission processing and reception processing of a high-frequency signal; a power amplifier IC 155 for amplifying a transmission signal from the RFIC 160; and a duplexer 110 for separating a transmission signal outputted from the power amplifier IC 155 to an antenna and a reception signal inputted from the antenna to the RFIC 160. The duplexer 110 is arranged between the RFIC 160 and the power amplifier IC 155.
摘要翻译：要解决的问题：提供具有高封装密度的高频电路模块。解决方案：高频电路模块100在电路板200的上表面上包括用于执行发送处理和接收处理的RFIC 160 的高频信号; 用于放大来自RFIC 160的发送信号的功率放大器IC 155; 以及用于将从功率放大器IC 155输出的发送信号分离成天线的双工器110和从天线输入到RFIC 160的接收信号。双工器110布置在RFIC 160和功率放大器IC 155之间。

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